Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Rogers RO3006 High Frequency PCB 10mil,20mil,30mil,60mil with ENIG

Rogers RO3006 High Frequency PCB 10mil,20mil,30mil,60mil with ENIG

  • Rogers RO3006 High Frequency PCB 10mil,20mil,30mil,60mil with ENIG
Rogers RO3006 High Frequency PCB 10mil,20mil,30mil,60mil with ENIG
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0312-V3.12
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-9.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: Polyimide 25μm + 0.2mm Polyimide Stiffener Board Thickness: 0.20 Mm
Surface/Inner Layer Cu Thickness: 35 µm Surface Finish: Immersion Gold
Coverlay Colour: Yellow Color Of Silkscreen: No
Function: 100% Pass Electrical Test Number Of Layers: 2

Rogers RO3006 PCBs are ceramic-filled PTFE composites designed for commercial microwave and RF applications. They offer excellent electrical and mechanical stability at a competitive price.


RO3006 Typical Properties:
RO3006 is known for its exceptional properties. Let's explore some key features:

Dielectric Constant: During manufacturing, RO3006 typically exhibits a dielectric constant of 6.15±0.05 at 10 GHz and 23℃ (IPC-TM-650 Clamped Stripline). For design purposes, the estimated dielectric constant is 6.5 within the frequency range of 8 GHz to 40 GHz, allowing for smaller circuit board designs. The DK remains stable over a wide temperature range, eliminating abrupt changes seen in PTFE glass materials near room temperature.


Dissipation Factor: RO3006 demonstrates a low dissipation factor of 0.002 at 10 GHz and 23℃ (IPC-TM-650, contributing to excellent signal integrity and low signal loss, benefiting high-gain power amplifiers.


Thermal Properties: RO3006 maintains stable electrical performance across a wide temperature range with a thermal coefficient of dielectric constant of -262 ppm/℃ from -50℃ to 150℃ at 10 GHz (IPC-TM-650


Other Properties: RO3006 exhibits dimensional stability, outstanding electrical properties, moisture resistance, high thermal decomposition temperature, compatibility with lead-free processes, and reliable copper adhesion. It meets safety standards with a flammability rating of V-0 (UL 94).


Moving on to dimensional stability, RO3006 showcases outstanding stability with a dimensional change of 0.27 mm/m in the X direction and 0.15 mm/m in the Y direction under specified conditions (COND A, IPC-TM-650 2.2.4). This ensures reliability and precision in various applications.


RO3006 also possesses excellent electrical properties. It exhibits a volume resistivity of 10^5 MΩ.cm and a surface resistivity of 10^5 MΩ under specified conditions (COND A, IPC These characteristics contribute to its suitability for high-frequency applications that require reliable insulation.


Furthermore, the material's mechanical properties are noteworthy. RO3006 demonstrates a tensile modulus of 1498 MPa in the X direction and 1293 MPa in the Y direction at 23℃ (ASTM D 638). This high modulus ensures structural integrity and durability.


In terms of moisture absorption, RO3006 has a low moisture absorption rate of 0.02% (D48/50, IPC-TM-650 This attribute is crucial for maintaining stable electrical performance in humid environments.


Other important properties include a specific heat of 0.86 j/g/k (calculated), indicating its ability to dissipate heat efficiently, and a thermal conductivity of 0.79 W/M/K at 50℃ (ASTM D 5470), contributing to effective thermal management, and that does really help thermal management issue for power amplifiers.


When considering its response to temperature variations, RO3006 exhibits a coefficient of thermal expansion of 17 ppm/℃ in the X and Y directions and 24 ppm/℃ in the Z direction (-55 to 288℃, 23℃/50% RH, IPC-TM-650 This allows for more reliable surface mounted assemblies, it’s ideal for applications sensitive to temperature change. That’s considered pretty good for the plated through holes reliability and excellent dimensional stability.


Additionally, RO3006 has a high thermal decomposition temperature (Td) of 500℃ (TGA, ASTM D 3850), indicating its ability to withstand elevated temperatures without significant degradation.


In terms of material density, RO3006 has a density of 2.6 gm/cm3 at 23℃ (ASTM D 792). This characteristic contributes to its lightweight yet robust nature.


Furthermore, RO3006 exhibits excellent copper peel strength, with a value of 7.1 Ib/in. This measurement is conducted on 1oz copper after solder float (IPC-TM 2.4.8), ensuring reliable adhesion between the material and copper layers.


RO3006 also meets safety standards, as it achieves a flammability rating of V-0 (UL 94). Additionally, it is compatible with lead-free processes, making it environmentally friendly and compliant.


Property RO3006 Direction Units Condition Test Method
Dielectric Constant,εProcess 6.15±0.05 Z   10 GHz/23℃ IPC-TM-650 Clamped Stripline
Dielectric Constant,εDesign 6.5 Z   8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.002 Z   10 GHz/23℃ IPC-TM-650
Thermal Coefficient of ε -262 Z ppm/℃ 10 GHz -50℃to 150℃ IPC-TM-650
Dimensional Stability 0.27
mm/m COND A IPC-TM-650 2.2.4
Volume Resistivity 105   MΩ.cm COND A IPC
Surface Resistivity 105   COND A IPC
Tensile Modulus 1498
MPa 23℃ ASTM D 638
Moisture Absorption 0.02   % D48/50 IPC-TM-650
Specific Heat 0.86   j/g/k   Calculated
Thermal Conductivity 0.79   W/M/K 50℃ ASTM D 5470
Coefficient of Thermal Expansion
(-55 to 288℃)
ppm/℃ 23℃/50% RH IPC-TM-650
Td 500   ℃ TGA   ASTM D 3850
Density 2.6   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 7.1   Ib/in. 1oz,EDC After Solder Float IPC-TM 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        


PCB Capabilities for RO3006:
We offer a range of PCB capabilities for RO3006, including single-layer, double-layer, multi-layer, and hybrid board types. Our RO3006 PCBs come in various thickness options such as 5 mils, 10 mils, 20 mils, 25 mils, and 50 mils, providing flexibility for your specific requirements.


For the finished copper on the PCB, we provide options of 1oz, 2oz, and 3oz copper weights. Our high-frequency materials can accommodate PCB sizes up to a maximum of 400mm by 500mm. Whether you need a single board or multiple designs within a panel, we can accommodate your needs.


We offer a selection of solder mask colors, including green, black, blue, red, and yellow, among others. Additionally, we provide various surface finish options for the pads, such as immersion gold, HASL, immersion silver, immersion tin, and bare copper.


PCB material: Ceramic-filled PTFE composite
Designation: RO3006
Dielectric constant: 6.15 ±0.3 (process), 6.5 (design)
Layer count: 1-layer, 2-layer, Multi-layer, Hybrid PCB
Dielectric thickness: 5mil (0.127mm), 10mil (0.254mm), 25mil (0.635mm), 50mil (1.27mm)
Copper weight: 1oz (35µm), 2oz (70µm), 3oz (105 µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Red, Yellow etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, Bare copper, OSP, Pure thick gold etc..


A Sample of RO3006 PCB:
Displayed on the screen is an example of a 50mil RO3006 PCB with immersion gold surface finish. This particular PCB finds common applications in GPS antennas, power amplifiers and antennas, patch antennas for wireless communications, and direct broadcast satellite systems.


Rogers RO3006 High Frequency PCB 10mil,20mil,30mil,60mil with ENIG 0


In Conclusion:
In summary, RO3006 is a high-performance laminate material with a manufacturing process dielectric constant of 6.15±0.05 and a design purposes value of 6.5. It boasts a low dissipation factor, exceptional thermal stability, precise dimensional accuracy, excellent electrical properties, reliable mechanical performance, high thermal decomposition temperature (Td), optimal density, and strong copper peel strength. Additionally, it exhibits low moisture absorption, good thermal conductivity, and meets safety standards. The PCB manufacturing process for RO3006 is similar to standard PTFE PCB, enabling efficient volume production and competitive pricing to gain a competitive advantage in the market.


That concludes our overview of the features and benefits of RO3006 material and PCBs. We appreciate your participation today, and we hope you found this information valuable. If you have any further inquiries, please don't hesitate to ask.

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

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