Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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TMM4 PCB : A Thermoset Microwave Material for High-Frequency PCBs

TMM4 PCB : A Thermoset Microwave Material for High-Frequency PCBs

  • TMM4 PCB : A Thermoset Microwave Material for High-Frequency PCBs
TMM4 PCB : A Thermoset Microwave Material for High-Frequency PCBs
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0304-V3.04
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-7.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: Polyimide 25μm + 0.3mm Stiffener Of Stainless Steel Board Thickness: 0.20 Mm
Surface/Inner Layer Cu Thickness: 70 µm Surface Finish: Immersion Gold
Coverlay Colour: Yellow Color Of Silkscreen: White
Function: 100% Pass Electrical Test Number Of Layers: 2

Exploring the Impressive Properties of TMM4: A Thermoset Microwave Material for High-Frequency PCBs


Rogers TMM4 PCB is a composite material combining ceramic, hydrocarbon, and thermoset polymer properties, specifically designed for stripline and microstrip applications. It offers a unique blend of mechanical and chemical characteristics, incorporating the advantages of both ceramic and traditional PTFE materials. Notably, it is based on thermoset resins, ensuring reliable wire-bonding without the risk of pad lifting or substrate deformation.


Now, let's delve into the notable properties of TMM4 that make it an optimal choice for demanding applications.


Firstly, we have the Dielectric Constant of TMM4. At a process value of 4.5±0.045 at 10 GHz, it guarantees reliable signal transmission. During the design phase, the Dielectric Constant is set at 4.7, effectively covering a wide frequency range from 8 GHz to 40 GHz.


Next, we consider the Dissipation Factor, where TMM4 excels with a process value of 0.002 at 10 GHz, indicating minimal signal loss and enhanced overall performance.


Thermal stability is another impressive characteristic of TMM4, with a Thermal Coefficient of dielectric constant measuring +15 ppm/°K across a broad temperature range from -55°C to 125°C.


Moving on to electrical properties, TMM4 boasts an Insulation Resistance exceeding 2000 Gohm, ensuring reliable insulation performance. The Volume Resistivity is an impressive 6 x 10^8, while the Surface Resistivity stands at 1 x 10^9 Mohm.


Now, let's explore the thermal properties of TMM4. It exhibits a Decomposition Temperature (Td) of 425°C, ensuring stability and reliability even in high-temperature environments.


The Coefficient of Thermal Expansion is also noteworthy. Along the X and Y axes, it measures 16 ppm/K, while along the Z axis, it measures 21 ppm/K. This indicates that TMM4 can withstand temperature variations from 0°C to 140°C without significant dimensional changes.


Additionally, TMM4 showcases a Thermal Conductivity of 0.7 W/m/K at 80°C, allowing for efficient heat dissipation in electronic systems.

Moving on to its mechanical characteristics, TMM4 demonstrates remarkable strength. The Copper Peel Strength after Thermal Stress reaches an impressive 5.7 lb/inch (1.0 N/mm) in both the X and Y directions, even after solder float with 1 oz. EDC.


TMM4's Flexural Strength stands at 15.91 kpsi in both the MD (Machine Direction) and CMD (Cross-Machine Direction), ensuring structural integrity in demanding conditions. The Flexural Modulus for MD and CMD is 1.76 Mpsi, indicating excellent stiffness.


Furthermore, TMM4 exhibits desirable physical properties. Its Moisture Absorption is minimal, measuring only 0.07% for a 2X2 area at 1.27mm (0.050") thickness, and 0.18% at 3.18mm (0.125") thickness.


The Specific Gravity of TMM4 is 2.07, providing a lightweight solution without compromising performance. Additionally, its Specific Heat Capacity is 0.83 J/g/K, contributing to efficient thermal management.


Last but not least, TMM4 is Lead-Free Process Compatible, ensuring compliance with industry standards and environmental regulations.


Property TMM 4 Direction Units Condition Test Method
Dielectric Constant,εProcess 4.5±0.045 Z   10 GHz IPC-TM-650
Dielectric Constant,εDesign 4.7 - - 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor (process) 0.002 Z - 10 GHz IPC-TM-650
Thermal Coefficient of dielectric constant +15 - ppm/°K -55℃-125℃ IPC-TM-650
Insulation Resistance >2000 - Gohm C/96/60/95 ASTM D257
Volume Resistivity 6 x 108 - - ASTM D257
Surface Resistivity 1 x 109 - Mohm - ASTM D257
Electrical Strength(dielectric strength) 371 Z V/mil - IPC-TM-650 method
Thermal Properties
Decompositioin Temperature(Td) 425 425 ℃TGA - ASTM D3850
Coefficient of Thermal Expansion - X 16 X ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y 16 Y ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z 21 Z ppm/K 0 to 140 ℃ ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity 0.7 Z W/m/K 80 ℃ ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress 5.7 (1.0) X,Y lb/inch (N/mm) after solder float 1 oz. EDC IPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD) 15.91 X,Y kpsi A ASTM D790
Flexural Modulus (MD/CMD) 1.76 X,Y Mpsi A ASTM D790
Physical Properties
Moisture Absorption (2X2) 1.27mm (0.050") 0.07 - % D/24/23 ASTM D570
  3.18mm (0.125") 0.18        
Specific Gravity 2.07 - - A ASTM D792
Specific Heat Capacity 0.83 - J/g/K A Calculated
Lead-Free Process Compatible YES - - - -


PCB Capability (TMM 4)
For TMM 4 PCBs, we can provide you with single layer board, double layer board, multi-layer board and hybrid types.


TMM 4 PCBs have wide thickness. There are the standard thickness such as 20 mils, 30 mils, 50 mils and 60mils etc. and non-standard thickness such as 15 mils, 25 mils,75 mils, and 125 mils etc. It’s as thin as 15 mils and as thick as 500 mils for our designers.


Finished copper on PCB can be 1oz, 2oz and 3oz. Our maximum PCB size on high frequency materials is 400mm by 500mm, it can be a single board in the sheet and also can be different designs in this panel.


Solder mask of green, black, blue and yellow etc is available in house. There’s immersion gold, HASL, immersion silver, immersion tin, pure gold and bare copper etc. for pads plating.


PCB material: Composite of Ceramic, hydrocarbon and thermoset polymer
Designation: TMM 4
Dielectric constant: 4.5 ±0.045 (process); 4.7 (design)
Layer count: 1-layer, 2-layer, Multi-layer, Hybrid types
Laminate thickness: 15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm), 150mil (3.81mm), 200mil (5.08mm), 250mil (6.35mm), 275mil (6.985mm), 300mil (7.620mm), 500mil (12.7mm)
Copper weight: 1oz (35µm), 2oz (70µm), 3oz (105µm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold, HASL, Immersin silver, Immersion tin, Pure gold, ENEPIG, Bare copper, OSP etc.


A Piece of TMM 4PCB
On the screen is a double layer TMM4 PCBs on 5.08mm substrate without solder mask. TMM 4 PCBs are typically used in power amplifiers and combiners, filters and couplers, satellite communication systems, GPS antennas, dielectric polarizers and lenses etc.


TMM4 PCB : A Thermoset Microwave Material for High-Frequency PCBs 0


TMM 4’s mechanical properties resist creep and cold flow. It is resistant to process chemicals, reducing damage during fabrication. All common PCB manufacturing processes can be used with TMM 4 materials, so the volume mass production is available for marketing.

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

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