ITEQ IT-180ATC - Unleashing the Power of Advanced PCB Material

ITEQ IT-180ATC - Unleashing the Power of Advanced PCB Material

When it comes to cutting-edge PCBs that deliver unparalleled performance, one material rises above the rest: ITEQ IT-180ATC. This revolutionary PCB material is transforming the industry with its exceptional properties and state-of-the-art specifications. Join us as we delve into the remarkable features, construction details, advantages, disadvantages, applications, and more, offered by ITEQ IT-180ATC.
 
Unmatched Performance: Redefining Excellence

• Experience the pinnacle of signal integrity with ITEQ IT-180ATC's outstanding permittivity (Dk) of 4.5 at 1 MHz and 4.4 at 1 GHz, ensuring optimal performance across varying frequencies.
• Bid farewell to signal loss and distortion, thanks to its remarkably low loss tangent (Df) of 0.0014 at 1 MHz and 0.0015 at 1 GHz.
• Embrace reliability in demanding environments with its impressive thermal stability, boasting a high glass transition temperature (DSC) of 175°C.
• With a decomposition temperature of 345°C, ITEQ IT-180ATC remains rock-solid even under extreme conditions.
• Versatility meets resilience with an operating temperature range of -40°C to +130°C.

 
Reliability Redefined: Unwavering Trust

• Say goodbye to thermal expansion headaches as ITEQ IT-180ATC's low coefficient of thermal expansion (CTE) ensures dimensional stability and uncompromised reliability.
• Bask in the material's remarkable heat resistance, allowing it to perform impeccably under the most challenging circumstances.
• Rest easy knowing that ITEQ IT-180ATC effortlessly resists the formation of Conductive Anodic Filament (CAF), providing exceptional reliability.
• Count on secure through-hole connections that stand the test of time with ITEQ IT-180ATC.

 
Construction Details: Crafted to Perfection

• Precision takes center stage with the 6-layer rigid PCB stackup, meticulously designed to deliver top-notch performance.
• Each copper layer, from Layer-1 to Layer-6, measures 35 microns, ensuring efficient signal transfer and seamless connectivity.
• The carefully selected prepreg layers, including Prepreg 1080 and Prepreg 106 (72%) x2, guarantee optimal insulation and bonding between the copper layers.
• Enhance structural integrity with the 0.10mm FR-4 Core High Tg layer.

 
Fine Craftsmanship: Excellence in Every Detail

• Attention to detail shines through the board's dimensions, measuring 113mm x 90mm with a tolerance of +/- 0.15mm.
• Achieve high-density interconnects with a minimum trace/space requirement of 3/4 mils.
• Laser drills with a minimum hole size of 0.10mm ensure precision and accuracy.
• Embrace the advantages of HDI with blind vias and buried vias, seamlessly connecting different layers.
• The board's thickness strikes the perfect balance between durability and flexibility at 0.66mm.
• Each layer features a 1 oz (1.4 mils) finished copper weight, guaranteeing optimal conductivity.
• Reliable connections are ensured with a 20 μm via plating thickness.
• Benefit from an Electroless Nickel Immersion Gold (ENIG) surface finish, providing excellent solderability and corrosion resistance.
• Clear labeling and instructions are provided by the top and bottom white silkscreen.
• Green solder masks on both sides shield the PCB from environmental factors.
• Adherence to IPC-4761 Type VII standards ensures resin filling and capping of 0.25mm and 0.2mm vias.
• Achieve impedance control with a 100-ohm characteristic impedance on the top layer, using a 6mil trace referenced to L2.
• Showcase innovation with the inclusion of castellated holes/half holes.
• Each PCB undergoes a 100% electrical test before shipment, ensuring top-notch quality.

 
Impressive Statistics: Power at Your Fingertips

• Accommodate complex circuitry with ITEQ IT-180ATC's capacity for 93 components and a total of 153 pads.
• Enjoy versatility in component placement with 78 thru-hole pads, 39 top SMT pads, and 36 bottom SMT pads.
• Efficient interconnection between layers is made possible by 94 vias.
• Seamless connectivity is ensured with 7 nets.

 
Advantages of ITEQ IT-180ATC PCB Material: Unleashing Potential

1. Excellent Electrical Performance: ITEQ IT-180ATC's outstanding permittivity (Dk) of 4.5 at 1 MHz and 4.4 at 1 GHz, coupled with its low loss tangent (Df) of 0.0014 at 1 MHz and 0.0015 at 1 GHz, guarantees reliable signal integrity and minimal signal loss.
2. Thermal Stability: With a highIntroducing the Game-Changer: ITEQ IT-180ATC - Unleashing the Power of Advanced PCB Material

 
When it comes to pushing the boundaries of PCB technology, one material stands out from the crowd: ITEQ IT-180ATC. Prepare to witness a revolution in the industry as we delve into the exceptional features, construction details, advantages, disadvantages, and applications of ITEQ IT-180ATC.
 
Unmatched Performance: Redefining Excellence

• Brace yourself for unparalleled signal integrity, thanks to ITEQ IT-180ATC's extraordinary permittivity (Dk) of 4.5 at 1 MHz and 4.4 at 1 GHz, ensuring optimal performance across various frequencies.
• Bid farewell to signal loss and distortion, as ITEQ IT-180ATC boasts an impressively low loss tangent (Df) of 0.0014 at 1 MHz and 0.0015 at 1 GHz.
• Embrace reliability in even the harshest environments with its remarkable thermal stability, featuring a high glass transition temperature (DSC) of 175°C.
• With a decomposition temperature of 345°C, ITEQ IT-180ATC remains rock-solid under extreme conditions.
• Versatility meets resilience with an operating temperature range of -40°C to +130°C.

 
 
Reliability Redefined: Instilling Unwavering Trust

• Say goodbye to thermal expansion headaches as ITEQ IT-180ATC offers a low coefficient of thermal expansion (CTE), ensuring dimensional stability and unwavering reliability.
• Rest easy knowing that ITEQ IT-180ATC effortlessly resists the formation of Conductive Anodic Filament (CAF), providing exceptional reliability.
• Count on secure through-hole connections that stand the test of time with ITEQ IT-180ATC.

 
Construction Details: Precision Crafted to Perfection

• Precision takes center stage with the meticulously designed 6-layer rigid PCB stackup, delivering top-notch performance.
• Each copper layer, ranging from Layer-1 to Layer-6, measures 35 microns, ensuring efficient signal transfer and seamless connectivity.
• The carefully selected prepreg layers, including Prepreg 1080 and Prepreg 106 (72%) x2, guarantee optimal insulation and bonding between the copper layers.
• Enhance structural integrity with the 0.10mm FR-4 Core High Tg layer.

 
Fine Craftsmanship: Exquisite Attention to Detail

• Immerse yourself in the board's dimensions, measuring 113mm x 90mm with a tolerance of +/- 0.15mm, showcasing a commitment to precision.
• Achieve high-density interconnects with a minimum trace/space requirement of 3/4 mils.
• Laser drills with a minimum hole size of 0.10mm ensure unparalleled precision and accuracy.
• Embrace the advantages of HDI with blind vias and buried vias, seamlessly connecting different layers.
• Strike the perfect balance between durability and flexibility with a board thickness of 0.66mm.
• Each layer features a 1 oz (1.4 mils) finished copper weight, guaranteeing optimal conductivity.
• Reliable connections are ensured with a 20 μm via plating thickness.
• Benefit from an Electroless Nickel Immersion Gold (ENIG) surface finish, providing excellent solderability and corrosion resistance.
• Clear labeling and instructions are provided by the top and bottom white silkscreen.
• Green solder masks on both sides shield the PCB from environmental factors.
• Adherence to IPC-4761 Type VII standards ensures precise resin filling and capping of 0.25mm and 0.2mm vias.
• Achieve impedance control with a 100-ohm characteristic impedance on the top layer, using a 6mil trace referenced to L2.
• Showcase innovation with the inclusion of castellated holes/half holes.
• Each PCB undergoes a 100% electrical test before shipment, ensuring unparalleled quality.

 
Impressive Statistics: Empowering Your Vision

• Accommodate complex circuitry with ITEQ IT-180ATC's capacity for 93 components and a total of 153 pads.
• Enjoy versatility in component placement with 78 thru-hole pads, 39 top SMT pads, and 36 bottom SMT pads.
• Efficient interconnection between layers is made possible by 94 vias.
• Seamless connectivity is ensured with 7 nets.

 
Advantages of ITEQ IT-180ATC PCB Material: Unleashing Potential

1. Excellent Electrical Performance: ITEQ IT-180ATC's remarkable permittivity (Dk) of 4.5 at 1 MHz and 4.4 at 1 GHz, combined with its low loss tangent (Df) of 0.0014 at 1 MHz and 0.0015 at 1 GHz, guarantees reliable signal integrity and minimal signal loss.
2. Thermal Stability: With a high glass transition temperature (DSC) of 175°C and a decomposition