Double Layer Taconic RF-30 PCB: Unleashing Superior Performance for RF Applications

Introducing Taconic RF-30: Unleashing Superior Performance for RF Applications

When it comes to high-frequency applications, having a reliable and high-performance printed circuit board (PCB) substrate is crucial. Taconic RF-30 PTFE Ceramic-Glass PCB Substrates offer exceptional quality, stability, and performance, making them the ideal choice for a wide range of RF applications. Let's delve into the remarkable features, construction details, specifications, and typical applications of these exceptional PCB substrates.

Unmatched Features:

Taconic RF-30 PTFE Ceramic-Glass PCB Substrates boast a range of features that set them apart:

1. Minimized Passive Intermodulation Distortion: Engineered to reduce signal interference, these substrates ensure optimal signal integrity, minimizing passive intermodulation distortion.
2. Enhanced Plated Through Hole Quality: These substrates employ superior manufacturing techniques, ensuring excellent quality for plated through holes. This guarantees reliable connections and enhanced signal transmission.
3. Unyielding Mechanical Stability: Taconic RF-30 substrates maintain their mechanical stability even under challenging conditions, ensuring long-term durability and reliability.
4. Consistent Performance at High Frequencies: Designed for high-frequency operation, these substrates deliver unwavering performance, making them suitable for demanding RF applications.
5. Exceptional Thermal Stability: Taconic RF-30 substrates exhibit excellent resistance to elevated temperatures without compromising performance, ensuring reliability even in demanding thermal environments.
6. Resistant to Moisture-Related Issues: With a moisture absorption rate of merely 0.02%, these substrates are highly resistant to moisture-related problems, ensuring consistent performance over time.
7. Robust Peel Strength: The substrates boast an impressive peel strength of 10 lbs/in, guaranteeing secure adhesion of components and reliable solder joints.
8. Outstanding Price/Performance Ratio: Taconic RF-30 substrates offer exceptional performance at a competitive price, providing excellent value for RF PCB applications.

Construction Details:

The construction of Taconic RF-30 PTFE Ceramic-Glass PCB Substrates is as follows:

• Stackup: These substrates are designed as 2-layer rigid PCBs with the following layer configuration:
  1. Copper Layer 1: 35 μm
  2. RF-30 Layer: 0.762 mm (30 mil)
  3. Copper Layer 2: 35 μm
• Board Dimensions: The PCBs have dimensions of 228.99mm x 117.25 mm (1PCS), with a tolerance of +/- 0.15mm.
• Minimum Trace/Space: The minimum trace width and spacing are 5/6 mils, allowing for precise routing of high-frequency signals.
• Minimum Hole Size: The minimum hole size supported is 0.3mm, ensuring compatibility with various component types.
• No Blind Vias: These PCBs do not employ blind vias, simplifying the manufacturing process.
• Finished Board Thickness: The finished board thickness is 0.8mm, providing a compact and lightweight solution.
• Finished Cu Weight: The outer layers have a finished copper weight of 1oz (1.4 mils), striking a balance between conductivity and weight.
• Via Plating Thickness: The vias feature a plating thickness of 20 μm, ensuring reliable electrical connections.
• Surface Finish: The PCBs are finished with Hot Air Soldering Level (HASL), providing a robust and cost-effective surface coating.
• Silkscreen and Solder Mask: The top silkscreen color is white, allowing for clear component labeling. The top solder mask is green, providing protection and insulation.
• Electrical Test: Each PCB undergoes a 100% electrical test before shipment to ensure quality and reliability.

Specifications:
Taconic RF-30 PTFE Ceramic-Glass PCB Substrates exhibit the following specifications:

1. DK (Dielectric Constant): 3.0 +/- 0.1 at 1.9 GHz/23°C.
2. Dissipation Factor: 0.0014 at 1.9 GHz/23°C, ensuring minimal signal loss.
3. Peel Strength: 10 lbs/in, providing strong adhesion for components.
4. Moisture Absorption: 0.02%, offering excellent moisture resistance.
5. CTE (Coefficient of Thermal Expansion): X-axis: 11 ppm/°C, Y-axis: 21 ppm/°C, Z-axis: 208 ppm/°C.

Typical Applications:

• Taconic RF-30 PTFE Ceramic-Glass PCB Substrates find extensive applications in various RF fields, including:
• Antenna and Subcomponents: These substrates facilitate the construction of high-performance antennas and related RF components, ensuring optimal signal transmission and reception.
• RF Passive Components: Taconic RF-30 substrates provide a stable platform for RF passive components like filters, couplers, and baluns,ensuring reliable performance in demanding RF circuits.
• High-Frequency Amplifiers: These substrates are ideal for building high-frequency amplifiers that demand low signal loss and consistent performance across a wide frequency range.
• Radar Systems: Taconic RF-30 substrates excel in radar systems, where precise signal transmission and reception are critical for accurate detection and imaging.
• Wireless Communication Systems: These substrates are commonly used in wireless communication systems, such as cellular base stations, where high-frequency signal integrity is essential for efficient data transmission.
• Satellite Communication Systems: Taconic RF-30 substrates are well-suited for satellite communication systems, providing excellent electrical performance and reliability in the harsh space environment.
• Automotive Radar: With their stable mechanical properties and high-frequency capabilities, these substrates find applications in automotive radar systems, ensuring accurate object detection and collision avoidance.
• Aerospace and Defense Electronics: Taconic RF-30 PCB substrates are employed in various aerospace and defense electronic systems, including radar systems, communication equipment, and electronic warfare systems.

Please note that while Taconic RF-30 PTFE Ceramic-Glass PCB Substrates offer exceptional performance for RF applications, it's always important to consult the manufacturer's datasheet and application guidelines to ensure they meet the specific requirements of your project.