CER-10 laminate, a revolutionary PCB material offering exceptional power, reliability

CER-10 laminate, an impressive creation by Taconic, combines woven glass reinforcement, ceramic fill technology, and coated PTFE fiberglass. This advanced laminate stands out due to its exceptional interlaminar bond strength, outstanding solder resistance, and consistent electrical properties. A proprietary composition ensures minimal moisture absorption and unwavering electrical performance.

The woven glass reinforcement in CER-10 plays a significant role in providing excellent dimensional stability and bolstered flexural strength. It has a remarkably low Z-axis expansion rate (CTE 46 ppm/°C) to ensure reliable plated-through-hole performance, even in harsh thermal environments.

Key Features:

• Precise Dielectric Constant: CER-10 laminate has a dielectric constant of 10 +/- 0.05 at 10 GHz/23°C, ensuring steadfast and stable signal transmission.
• Minimal Signal Loss: With a dissipation factor of 0.0035 at 10 GHz/23°C, CER-10 minimizes signal loss and preserves signal integrity efficiently.
• Efficient Heat Dissipation: CER-10 has a thermal conductivity of 0.63 W/mK, effectively dissipating heat and making it suitable for applications requiring optimal thermal management.
• Impervious to Moisture: CER-10 laminate has a moisture absorption rate of only 0.02%, safeguarding its electrical performance from moisture-related issues.
• Reliable in Extreme Temperatures: CER-10 maintains consistent plated-through-hole performance, even in extreme temperature variations, thanks to its low coefficient of thermal expansion on the Z-axis (46 ppm/°C).

Shortcomings:

While CER-10 laminate offers impressive qualities, it is important to consider its limitations:

• Limited Frequency Range: The dielectric constant of CER-10 may vary beyond the specified frequency range, potentially affecting performance in higher frequency applications.
• Higher Cost: Due to its advanced composition and superior properties, CER-10 laminate may be more expensive compared to standard laminates, impacting overall project budgets and feasibility.

PCB Stackup and Construction Details:

For optimal results, it is recommended to use CER-10 laminate in a 2-layer rigid PCB stackup with the following specifications:

• Copper Layer 1: 35 μm
• CER-10 Substrate: 25mil (0.635mm)
• Copper Layer 2: 35 μm

Construction details for CER-10-based PCBs are as follows:

• Board Dimensions: 95mm x 89 mm (1 piece)
• Minimum Trace/Space: 4/6 mils
• Minimum Hole Size: 0.3mm
• No Blind Vias
• Finished Board Thickness: 0.8mm
• Finished Copper Weight: 1 oz (1.4 mils) outer layers
• Via Plating Thickness: 20 μm
• Surface Finish: Immersion Gold
• Top Silkscreen: Black
• Bottom Silkscreen: None
• Top Solder Mask: None
• Bottom Solder Mask: None
• All boards undergo 100% electrical testing before shipment.

PCB Statistics:

Statistical data for PCBs manufactured using CER-10 laminate include:

• Components: 24
• Total Pads: 70
• Thru-Hole Pads: 42
• Top SMT Pads: 28
• Bottom SMT Pads: 0
• Vias: 47
• Nets: 3

Artwork and Standards:

CER-10 laminate supports Gerber RS-274-X artwork files and adheres to the IPC-Class-2 standard, ensuring high-quality manufacturing and assembly processes.

Availability and Typical Applications:

CER-10 laminate is readily available worldwide, making it accessible for various industries. Typical applications include:

• Power Amplifiers: CER-10 provides the power and reliability required for demanding power amplifier circuits.
• Filters and Couplers: CER-10's stable dielectric constant and low-loss properties make it an excellent choice for precise filtering and coupling applications.
• Passive Components: CER-10 ensures dimensional stability and electrical performance, making it ideal for passive components in PCB designs.

CER-10 laminate delivers exceptional performance, reliability, and consistent electrical properties, making it the ultimate choice for PCB production. Its innovative combination of woven glass reinforcement, ceramic fill technology, and coated PTFE fiberglass ensures remarkable interlaminar bond strength, outstanding dimensional stability, and enhanced flexural strength. With its unwavering signal transmission, low moisture absorption, and remarkable thermal stability, CER-10 empowers various high-performance applications with unparalleled reliability. While limitations exist, such as its limited frequency range and higher cost compared to standard laminates, the benefits it offers in terms of dielectric constant, signal integrity, heat dissipation, and resistance to moisture make it a compelling option for critical PCB projects.