RO4003C LoPro PCB 2-Layer 60.7mil with 0.035um Copper Weight IPC-Class-3

Introducing RO4003C Low Profile: Unleash High-Frequency Performance

Discover the revolutionary RO4003C Low Profile, a game-changing laminate harnessing Rogers' proprietary technology. This cutting-edge material seamlessly combines reverse treated foil bonding with the trusted RO4003C dielectric, resulting in an extraordinary laminate with minimal conductor loss. Say goodbye to signal degradation and embrace higher operating frequencies, even surpassing the 40 GHz threshold.

The RO4003C Low Profile boasts remarkable high-frequency performance while maintaining an affordable circuit fabrication process. With a dielectric constant of 3.38+/- 0.05 at 10 GHz/23°C, it ensures impeccable signal transmission. And with a mere dissipation factor of 0.0027 at 10 GHz/23°C, energy loss becomes a thing of the past.

This advanced laminate is no stranger to demanding conditions. It handles thermal challenges with grace, featuring a thermal conductivity of 0.64 W/mK and a low Z-axis coefficient of thermal expansion at 46 ppm/°C. Prepare for optimal heat dissipation and unwavering stability, even in the face of extreme temperatures.

But the RO4003C Low Profile's benefits don't stop there. By aligning with standard epoxy/glass (FR-4) processes, it eliminates the need for specialized via preparation, slashing manufacturing costs. Plus, its lead-free process compatibility ensures it meets environmental standards without compromise.

Let's delve into the advantages of the RO4003C Low Profile:

1. Unlock Higher Operating Frequencies: Bid farewell to insertion loss woes and embrace the RO4003C Low Profile's minimal conductor loss. Design with confidence, reaching exceptional frequencies beyond 40 GHz and ensuring peak performance in cutting-edge communication systems, radar applications, and high-speed data transmission.
2. Reduce Passive Inter-Modulation (PIM): Say goodbye to interference nightmares. The RO4003C Low Profile's meticulous design minimizes PIM, making it a top choice for base station antennas. Enjoy uninterrupted, high-quality wireless communication and maximize antenna efficiency.
3. Enhanced Thermal Performance: Experience the difference with reduced conductor loss. The RO4003C Low Profile optimizes thermal performance, preventing overheating and ensuring the seamless operation of high-power devices. Trust in its ability to keep your systems cool and reliable.
4. Embrace Multilayer PCB Designs: Complexity meets ease. The RO4003C Low Profile supports multilayer PCB designs, offering unparalleled flexibility for intricate circuit layouts. Perfect for densely packed components and intricate signal routing, it empowers your design vision.
5. Unleash Design Flexibility: No need to reinvent the wheel. The RO4003C Low Profile effortlessly integrates with standard FR-4 processes, allowing you to leverage familiar fabrication techniques while achieving exceptional high-frequency performance. Streamline your development process and accelerate time-to-market.
6. Tackle High-Temperature Processing: Don't let high temperatures hold you back. The RO4003C Low Profile boasts impressive thermal stability, with a glass transition temperature (Tg) exceeding 280 °C TMA and a decomposition temperature (Td) surpassing 425 °C. It's built to withstand rigorous manufacturing processes with ease.
7. Environmental Consciousness: Stay ahead of the curve. The RO4003C Low Profile is lead-free process compatible, aligning with environmental regulations and addressing sustainability concerns. Prioritize both performance and responsibility in your electronic assemblies.
8. CAF Resistance: Long-term reliability matters. The RO4003C Low Profile demonstrates impressive resistance to Conductive Anodic Filament (CAF) formation, ensuring your systems remain robust and free from electrical failures caused by ionic contamination.

Now, let's explore the PCB stackup and construction details:

The RO4003C Low Profile shines brightest in 2-layer rigid PCB applications. The stackup comprises a 35 μm copper layer, followed by the 60.7mil (1.542mm) RO4003C LoPro substrate, and another 35 μm copper layer.

Take note of these essential PCB construction details:

• Board dimensions: 86.6mm x 90.8mm (16PCS)
• Minimum Trace/Space: 4/4 mils
• Minimum Hole Size: 0.4mm
• No Blind vias.
• Finished board thickness: 1.6mm
• Finished Cu weight: 1 oz (1.4 mils) outer layers
• Via plating thickness: 20 μm
• Surface finish: Immersion Gold
• Top Silkscreen: No
• Bottom Silkscreen: No
• Top Solder Mask: Green
• Bottom Solder Mask: No
• 100% Electrical test used prior to shipment

Notable PCB Statistics:

• Components: 9
• Total Pads: 33
• Thru Hole Pads: 21
• Top SMT Pads: 12
• Bottom SMT Pads: 0
• Number of ViasThe RO4003C Low Profile laminate is available worldwide, catering to a wide range of electronic design and manufacturing projects.

Let's take a glimpse at some typical applications:

• Power Up Your Digital Systems: From servers and routers to high-speed backplanes, the RO4003C Low Profile ensures efficient signal transmission and unparalleled high-frequency performance in demanding digital applications.
• Elevate Cellular Communication: Base station antennas and power amplifiers benefit greatly from the RO4003C Low Profile's low insertion loss and PIM reduction. Enjoy reliable and high-quality wireless communication with improved antenna efficiency.
• Enhance Satellite Systems: LNBs for direct broadcast satellites require reliable signal transmission, and the RO4003C Low Profile delivers exactly that. Experience enhanced reception quality and seamless data transfer in satellite systems.
• Embrace RFID Technology: The RO4003C Low Profile supports the design of RF Identification Tags, enabling efficient data transfer and enhancing the performance of RFID systems.

With its exceptional performance, cost-effectiveness, and design flexibility, the RO4003C Low Profile is the ultimate choice for high-frequency applications that demand reliable signal integrity and efficient thermal management. Unleash the power of this innovative laminate and take your designs to new heights.