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Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask
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Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask
  • name
  • name
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Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask

MOQ: 1
Price: USD40~50
Standard Packaging: Vacuum
Delivery Period: 5-6 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-168-V7.83
Glass Epoxy:
RF-35A2
Final Height Of PCB:
0.8 Mm ±10%
Final Foil External:
1.0 Oz
Surface Finish:
ENIG
Solder Mask Color:
Green
Colour Of Component Legend:
White
TEST:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD40~50
Packaging Details:
Vacuum
Delivery Time:
5-6 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Taconic’s RF-35A2 substrate is designed to have ultra-low fiberglass content to achieve "best in class" insertion loss properties and the uniform dielectric constant 3.5 +/-0.05 throughout the laminate. It is a type of ultra low loss power amplifier material.

 

The uniform dispersion of ceramics throughout the laminate yields an extremely low X and Y thermal expansion coefficient. Low modulus and low X-Y CTE values make RF-35A2 an attractive material for chip carrier in surface mounting technology.

 

RF-35A2 is manufactured with a proprietary multi-step process with excellent dielectric performance and excellent copper peel adhesion.The low 0.0015 dissipation factor at 10 GHz allows for maximum power transfer resulting in low heat generation.

 

Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask 0

 

Benefits:

Low loss properties

DK tolerance of +/- 0.05

Homogeneous DK

Excellent peel strength

Low moisture absorption

 

Our PCB Capability (RF-35A2)

PCB Material: PTFE Ceramic Fiberglass
Designation: RF-35A2
Dielectric constant: 3.15
Dissipation Factor 0.0015
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..

 

Applications:

Power amplifiers

Filters / couplers

High speed digital

Passive components

Wireless antennas

 

RF-35A2 Typical Values

Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   3.5   3.5
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   0.0015   0.0015
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Dielectric Breakdown IPC-650 2.5.6/ASTM D 149 kV 59 kV 59
Dielectric Strength ASTM D 149 V/mil 1000 V/mm 39,370
Volume Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) Mohm/cm 10^9 Mohm/cm 10^9
Surface Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) Mohm 10^8 Mohm 10^8
Arc Resistance IPC-650 2.5.1 Seconds 242 Seconds 242
Flexural Strength (MD) IPC-650 2.4.4 kpsi 24 N/mm2 165
Flexural Strength (CD) IPC-650 2.4.4 kpsi 15 N/mm2 103
Tensile Strength (MD) ASTM D 3039 psi 16,800 N/mm2 116
Tensile Strength (CD) ASTM D 3039 psi 11,000 N/mm2 75.8
Young’s Modulus (MD) ASTM D 3039 psi 106 N/mm2 8,343
Young’s Modulus (CD) ASTM D 3039 psi 106 N/mm2 7,171
Poisson’s Ratio (MD) ASTM D 3039   0.14   0.14
Poisson’s Ratio (CD) ASTM D 3039   0.1   0.1
Strain at Break (MD) ASTM D 3039 % 1.6 % 1.6
Strain at Break (CD) ASTM D 3039 % 1.4 % 1.4
Compressive Modulus (Z axis) ASTM D 695 (23°C) kpsi 385 N/mm2 2,650
Peel Strength (1 oz. VLP) IPC-650 2.4.8 (Thermal Stress) lbs/in 12 N/mm 2.1
Peel Strength (1 oz. VLP) IPC-650 2.4.8.3 (150°C ) (Elevated Temp.) lbs/in 14 N/mm 2.5
Peel Strength (1 oz. VLP) IPC-650 2.4.8 Sec. 5.2.3 (Proc. Chemicals) lbs/in 11 N/mm 2
Density (Specific Gravity)   gm/cm3 2.28 gm/cm3 2.28
Specific Heat ASTM E 1269 (DSC) (100°C) J/g/K 0.99 J/g/K 0.99
Thermal Conductivity ASTM F 433 W/M*K 0.29 W/M*K 0.29
Td IPC-650 2.4.24.6 2% Weight Loss °C 528 °C 528
Td IPC-650 2.4.24.6 5% Weight Loss °C 547 °C 547
CTE (x) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 10 ppm/°C 10
CTE (y) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 13 ppm/°C 13
CTE (z) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 108 ppm/°C 108

 

Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask 1

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products
PRODUCTS DETAILS
Products

Newly Shipped RF PCB

Rogers PCB Board

Taconic PCB Board

PTFE PCB Board

Flexible Printed Circuit

Multilayer PCB Board

High Temperature PCB

HDI PCB Board

Impedance Controlled PCB

PCB Prototypes

Blog

Arlon PCB Board

Hybrid PCB Board

FR-4 PCB Board

High Frequency PCB
Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask
  • name
  • name
  • name
Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask
MOQ: 1
Price: USD40~50
Standard Packaging: Vacuum
Delivery Period: 5-6 working days
Payment Method: T/T, Paypal
Supply Capacity: 45000 pieces per month
Detail Information
Product Description
Detail Information
Place of Origin
China
Brand Name
Bicheng Technologies Limited
Certification
UL
Model Number
BIC-168-V7.83
Glass Epoxy:
RF-35A2
Final Height Of PCB:
0.8 Mm ±10%
Final Foil External:
1.0 Oz
Surface Finish:
ENIG
Solder Mask Color:
Green
Colour Of Component Legend:
White
TEST:
100% Electrical Test Prior Shipment
Minimum Order Quantity:
1
Price:
USD40~50
Packaging Details:
Vacuum
Delivery Time:
5-6 working days
Payment Terms:
T/T, Paypal
Supply Ability:
45000 pieces per month
Product Description

Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Taconic’s RF-35A2 substrate is designed to have ultra-low fiberglass content to achieve "best in class" insertion loss properties and the uniform dielectric constant 3.5 +/-0.05 throughout the laminate. It is a type of ultra low loss power amplifier material.

 

The uniform dispersion of ceramics throughout the laminate yields an extremely low X and Y thermal expansion coefficient. Low modulus and low X-Y CTE values make RF-35A2 an attractive material for chip carrier in surface mounting technology.

 

RF-35A2 is manufactured with a proprietary multi-step process with excellent dielectric performance and excellent copper peel adhesion.The low 0.0015 dissipation factor at 10 GHz allows for maximum power transfer resulting in low heat generation.

 

Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask 0

 

Benefits:

Low loss properties

DK tolerance of +/- 0.05

Homogeneous DK

Excellent peel strength

Low moisture absorption

 

Our PCB Capability (RF-35A2)

PCB Material: PTFE Ceramic Fiberglass
Designation: RF-35A2
Dielectric constant: 3.15
Dissipation Factor 0.0015
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..

 

Applications:

Power amplifiers

Filters / couplers

High speed digital

Passive components

Wireless antennas

 

RF-35A2 Typical Values

Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   3.5   3.5
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   0.0015   0.0015
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Dielectric Breakdown IPC-650 2.5.6/ASTM D 149 kV 59 kV 59
Dielectric Strength ASTM D 149 V/mil 1000 V/mm 39,370
Volume Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) Mohm/cm 10^9 Mohm/cm 10^9
Surface Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) Mohm 10^8 Mohm 10^8
Arc Resistance IPC-650 2.5.1 Seconds 242 Seconds 242
Flexural Strength (MD) IPC-650 2.4.4 kpsi 24 N/mm2 165
Flexural Strength (CD) IPC-650 2.4.4 kpsi 15 N/mm2 103
Tensile Strength (MD) ASTM D 3039 psi 16,800 N/mm2 116
Tensile Strength (CD) ASTM D 3039 psi 11,000 N/mm2 75.8
Young’s Modulus (MD) ASTM D 3039 psi 106 N/mm2 8,343
Young’s Modulus (CD) ASTM D 3039 psi 106 N/mm2 7,171
Poisson’s Ratio (MD) ASTM D 3039   0.14   0.14
Poisson’s Ratio (CD) ASTM D 3039   0.1   0.1
Strain at Break (MD) ASTM D 3039 % 1.6 % 1.6
Strain at Break (CD) ASTM D 3039 % 1.4 % 1.4
Compressive Modulus (Z axis) ASTM D 695 (23°C) kpsi 385 N/mm2 2,650
Peel Strength (1 oz. VLP) IPC-650 2.4.8 (Thermal Stress) lbs/in 12 N/mm 2.1
Peel Strength (1 oz. VLP) IPC-650 2.4.8.3 (150°C ) (Elevated Temp.) lbs/in 14 N/mm 2.5
Peel Strength (1 oz. VLP) IPC-650 2.4.8 Sec. 5.2.3 (Proc. Chemicals) lbs/in 11 N/mm 2
Density (Specific Gravity)   gm/cm3 2.28 gm/cm3 2.28
Specific Heat ASTM E 1269 (DSC) (100°C) J/g/K 0.99 J/g/K 0.99
Thermal Conductivity ASTM F 433 W/M*K 0.29 W/M*K 0.29
Td IPC-650 2.4.24.6 2% Weight Loss °C 528 °C 528
Td IPC-650 2.4.24.6 5% Weight Loss °C 547 °C 547
CTE (x) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 10 ppm/°C 10
CTE (y) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 13 ppm/°C 13
CTE (z) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 108 ppm/°C 108

 

Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask 1

Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel: 86-755-27374847
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