Hi, I'm Sally, and today I'm excited to share a recent custom PCB project that tackles the unique challenges of high-power radio frequency design.
The Board at a Glance
This is a double-sided rigid PCB built on F4BTD350S, a high thermal conductivity PTFE resin substrate. The board measures 79mm x 110mm with a finished thickness of 0.6mm. The stackup consists of 35μm copper layers on both sides of a 0.508mm F4BTD350S core.
The design uses 7/9 mil trace and space with a minimum hole size of 0.6mm. The surface finish is Immersion Gold, with black solder mask applied on the top layer only. White silkscreen is present on the top side, and every board undergoes 100% electrical testing to IPC-Class-2 standards.
Why F4BTD350S?
What makes this material special? F4BTD350S is a glass-fiber-reinforced PTFE composite filled with high thermal conductivity ceramics. It was developed specifically for applications where heat dissipation and low signal loss are equally critical.
The material delivers a dielectric constant of 3.5 ± 0.07 at 10 GHz and an impressively low dissipation factor of 0.0016. But the real standout feature is its thermal conductivity of 1.25 W/(M·K)—significantly higher than standard PTFE materials. This means heat generated by high-power RF components is efficiently conducted away, extending device life and ensuring reliable operation under demanding conditions.
Additional advantages include a low coefficient of thermal expansion matched to copper for reliable plated through-holes, high electrical strength, and UL 94-V0 flame resistance.
Design Statistics
The board contains 18 components with 22 total pads—10 through-hole and 12 surface-mount on the top side. There are 6 vias, and the design has only 2 nets. This simple topology points to a specialized RF sub-circuit, likely a filter, coupler, or power amplifier stage where signal integrity and thermal management are paramount.
Key Design Choices
The black solder mask on the top layer provides a professional appearance while protecting components and traces. White silkscreen ensures clear component identification. The bare bottom layer is optimized for RF performance and heat dissipation.
The 0.6mm board thickness strikes a balance between mechanical strength and the lightweight construction often required in RF systems.
Typical Applications
With its high thermal conductivity and low-loss characteristics, this board is ideally suited for high-power radio frequency applications, power amplifiers, antennas, industrial heating equipment, couplers, filters, and power splitters.
Final Thoughts
This project highlights our ability to deliver customized PCBs using advanced thermal management materials like F4BTD350S. When your design demands both exceptional RF performance and efficient heat dissipation, we have the expertise to make it happen.
Have a similar project in mind? I'd love to discuss how we can help bring your design to life.
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