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Double Sided Flexible PCB board With 0.15mm thick and Immersion Gold Polyimide thickness 12.5, 20, 25 and 50 μm.

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Double Sided Flexible PCB board With 0.15mm thick and Immersion Gold Polyimide thickness 12.5, 20, 25 and 50 μm.

MOQ:	1
Price:	USD 2.99-9.99 PER PIECE
Standard Packaging:	Vacuum
Delivery Period:	10 working days
Payment Method:	T/T, Western Union
Supply Capacity:	45000 pieces per month

Detail Information

Product Description

Detail Information

Place of Origin

China

Brand Name

Bicheng Enterprise

Certification

Model Number

BIC-256-V2.56

Number Of Layers:

Board Material:

Polyimide (PI) 25 Um

Surface Cu Thickness:

Board Thickness:

0.15mm +/-10%

Surface Finish:

Immersion Gold

Solder Mask Color:

Yellow

Colour Of Component Legend:

Test:

100% Electrical Test Prior Shipment

Minimum Order Quantity:

Price:

USD 2.99-9.99 PER PIECE

Packaging Details:

Vacuum

Delivery Time:

10 working days

Payment Terms:

T/T, Western Union

Supply Ability:

45000 pieces per month

Product Description

Structure of FPC

According to the number of layers of conductive copper foil, FPC can be divided into single layer circuit, double layer circuit, multi-layer circuit, double sided and so on.

Single-layer structure: the flexible circuit of this structure is the simplest structure of the flexible PCB. Usually the base material (dielectric substrates) + transparent rubber(adhesive) + copper foil is a set of purchased raw materials(semi-manufactures), the protective film and transparent glue are another kind of bought raw material. First, copper foil must be etched to obtain the required circuit, and the protective film should be drilled to reveal the corresponding pad. After cleaning, the two are combined by rolling. Then the exposed part of the pad electroplated gold or tin to protect. In this way, the big panel board will be ready. Generally also it’s stamped into the corresponding shape of the small circuit board. There is also no protective film directly on the copper foil, but printed resistance soldering coating, so that the cost will be lower, but the mechanical strength of the circuit board will become worse. Unless the strength requirement is not high and the price needs to be as low as possible, it is best to apply the protective film method.

Double layer structure: when the circuit is too complex to be wired, or copper foil is needed to shield the ground, it is necessary to choose a double layer or even a multilayer. The most typical difference between a multilayer and a single plate is the addition of a perforated structure to connect the layers of copper foil. The first process of transparent rubber + base material + copper foil is to make holes. Drill holes in the base material and copper foil first, clean and then plated with a certain thickness of copper. The subsequent fabrication process is almost the same as the single-layer circuit.

Double sided structure: both sides of the double sided FPC have pads, mainly used to connect other circuit boards. Although it and monolayer structure is similar, but the manufacturing process is very different. Its raw material is copper foil, protective film and transparent glue. The protective film should be drilled according to the position of the pad first, then the copper foil should be affixed, the pad and track lines should be etched and then the protective film of another drilled hole should be affixed.

Copper foil is available in two different types of copper: ED Copper and RA copper.

ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is “treated”, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.

RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.

Copper foil is available in thickness of 12, 18, 35 and 70 μm.

The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:

High temperature resistance allows soldering operations without damaging the flexible circuits

Very good electrical properties

Good chemical resistance

Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.

Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.

FPC Case: Double Sided Flexible PCB board With 0.15mm thick and Immersion Gold

(FPC’s are custom-made products, the picture and parameters shown are just for reference)

General description

This is a type of flexible printed circuit for the application of GPS tracking systems. It’s a 2 layer board at 0.15mm thick. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. Polyimide stiffener is applied on the inserting part.

Parameter and data sheet

Number of Layers	2
Board Size	160 x 165mm=1PCS
Board Type	Flexbile cirucit
Board Thickness	0.15mm +/-10%
Board Material	Polyimide (PI) 25um
Board Material Supplier	ITEQ
Tg Value of Board Material	60℃

PTH Cu thickness	≥20 um
Inner Iayer Cu thicknes	N/A
Surface Cu thickness	35 um (1oz)

Coverlay Colour	Yellow
Number of Coverlay	2
Thickness of Coverlay	25 um
Stiffener	NO

Type of Silkscreen Ink	NO
Supplier of Silkscreen	NO
Color of Silkscreen	NO
Number of Silkscreen	NO

Mininum Trace (mil)	4 mil
Minimum Gap(mil)	4 mil

Surface Finish	Immersion Gold
RoHS Required	Yes
Famability	94-V0

Thermal Shock Test	Pass, -25℃±125℃, 1000 cycles.
Thermal Stress	Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function	100% Pass electrical test
Workmanship	Compliance with IPC-A-600H & IPC-6013C Class 2

Features and benefits

Excellent flexibility

Reducing the volume

Weight reduction

Consistency of assembly

Increased reliability

Controllability of electrical parameter design

The end can be whole soldered

Material optionality

Low cost

Continuity of processing

Quick and on-time delivery

Make delivery on time. We keep higher than 98% on-time-delivery rate.

Application

Keypad FPC,
Industrial control computer soft board,
Consumer ETC (Electronic Toll Collection ) soft board,

About Us

Bicheng PCB, a unique printed circuit board supplier based in Shenzhen China serves worldwide customers since it’s born in 2003. At Bicheng, every batch of PCB goes through electrical test, AOI inspection, high voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc. Finally it is like a beautiful gift to be delivered to your hands.

Different plant scale to suit for your requirements

16000 square meter factory building

30000 square meter month capability

8000 types of PCB per month

ISO9001, ISO14001, TS16949, UL Certified

Variety of PCB technology to meet the market demands

HDI board

Heavy copper board

Hybrid material board

Blind via board

High frequency board

Metal core board

Immersion gold board

Multilayer board

Backplane board

Gold finger board

Comprehensive sales service presale, in sale and after sale.

Quick CADCAM checking and free PCB quotation

Free-of-charge PCB panelization

Prototype PCB capability

Volume Production capability

Quick turn-around samples

Free-of-charge PCB test

Solid carton packing

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