MOQ: | 1 |
Price: | USD40~50 |
Standard Packaging: | Vacuum |
Delivery Period: | 5-6 working days |
Payment Method: | T/T, Paypal |
Supply Capacity: | 45000 pieces per month |
Product profile
1.1 General description
This is a type of 4 layer flexible printed circuit for the application of Wireless Intercom
at 0.2mm thick. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2
using supplied Gerber data.
1.2 Features and benifits
A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. Small quantity, prototypes and production.
L. Engineering design prevents problems from occurring in pre production.
1.3 Application
Touch screen, Consumer card reader soft board, Tablet keypad flex board
1.4 Parameter and data sheet
Size of Flexible PCB | 70.58 X 120.37mm |
Number of Layers | 4 |
Board Type | Flexible PCB |
Board Thickness | 0.20mm |
Board Material | Polyimide 25µm |
Board Material Supplier | ITEQ |
Tg Value of Board Material | 60℃ |
PTH Cu thickness | ≥20 µm |
Inner Iayer Cu thicknes | 35 µm |
Surface Cu thickness | 35 µm |
Coverlay Colour | Yellow coverlay / Green solder mask |
Number of Coverlay | 2 |
Thickness of Coverlay | 25 µm |
Stiffener Material | no |
Stiffener Thickness | N/A |
Type of Silkscreen Ink | IJR-4000 MW300 |
Supplier of Silkscreen | TAIYO |
Color of Silkscreen | White |
Number of Silkscreen | 1 |
Peeling test of Coverlay | No peelable |
Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
Surface Finish | Immersion Gold |
Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
RoHS Required | Yes |
Famability | 94-V0 |
Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
Function | 100% Pass electrical test |
Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
MOQ: | 1 |
Price: | USD40~50 |
Standard Packaging: | Vacuum |
Delivery Period: | 5-6 working days |
Payment Method: | T/T, Paypal |
Supply Capacity: | 45000 pieces per month |
Product profile
1.1 General description
This is a type of 4 layer flexible printed circuit for the application of Wireless Intercom
at 0.2mm thick. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2
using supplied Gerber data.
1.2 Features and benifits
A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. Small quantity, prototypes and production.
L. Engineering design prevents problems from occurring in pre production.
1.3 Application
Touch screen, Consumer card reader soft board, Tablet keypad flex board
1.4 Parameter and data sheet
Size of Flexible PCB | 70.58 X 120.37mm |
Number of Layers | 4 |
Board Type | Flexible PCB |
Board Thickness | 0.20mm |
Board Material | Polyimide 25µm |
Board Material Supplier | ITEQ |
Tg Value of Board Material | 60℃ |
PTH Cu thickness | ≥20 µm |
Inner Iayer Cu thicknes | 35 µm |
Surface Cu thickness | 35 µm |
Coverlay Colour | Yellow coverlay / Green solder mask |
Number of Coverlay | 2 |
Thickness of Coverlay | 25 µm |
Stiffener Material | no |
Stiffener Thickness | N/A |
Type of Silkscreen Ink | IJR-4000 MW300 |
Supplier of Silkscreen | TAIYO |
Color of Silkscreen | White |
Number of Silkscreen | 1 |
Peeling test of Coverlay | No peelable |
Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
Surface Finish | Immersion Gold |
Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
RoHS Required | Yes |
Famability | 94-V0 |
Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
Function | 100% Pass electrical test |
Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |