According to a research report by Caixin Securities, the global PCB market is expected to recover in 2024. High-layer boards, HDI boards, and package substrates have a high growth rate and higher technical barriers. Judging from the monthly data, the industry is expected to recover moderately, and it is recommended to pay attention to the sub-sectors with higher growth rates and barriers in PCB.
1) Data Communication Board: The global general artificial intelligence technology is accelerating its evolution, and the strong demand for AI servers and high-speed network systems is expected to continue to drive the demand for large-size, high-speed, high-layer boards. It is recommended to pay attention to: Shanghai Electric Co., Ltd., Shenzhen South Circuit, etc.
2) Automotive Board: The technological upgrades and iterations of electrification, intelligence, and networking in the automotive industry and the increase in penetration will provide strong long-term growth opportunities for the automotive board sub-market in the direction of multi-layer, high-order HDI, high-frequency and high-speed. It is recommended to pay attention to: Shanghai Electric Co., Ltd., Shenghong Technology, etc.
3) Package Substrate: The general trend of semiconductor localization is recommended to pay attention to: Xinsen Technology, etc.
4) Copper Clad Laminate: Focus on companies that continue to make breakthroughs in high-end products.
According to a research report by Caixin Securities, the global PCB market is expected to recover in 2024. High-layer boards, HDI boards, and package substrates have a high growth rate and higher technical barriers. Judging from the monthly data, the industry is expected to recover moderately, and it is recommended to pay attention to the sub-sectors with higher growth rates and barriers in PCB.
1) Data Communication Board: The global general artificial intelligence technology is accelerating its evolution, and the strong demand for AI servers and high-speed network systems is expected to continue to drive the demand for large-size, high-speed, high-layer boards. It is recommended to pay attention to: Shanghai Electric Co., Ltd., Shenzhen South Circuit, etc.
2) Automotive Board: The technological upgrades and iterations of electrification, intelligence, and networking in the automotive industry and the increase in penetration will provide strong long-term growth opportunities for the automotive board sub-market in the direction of multi-layer, high-order HDI, high-frequency and high-speed. It is recommended to pay attention to: Shanghai Electric Co., Ltd., Shenghong Technology, etc.
3) Package Substrate: The general trend of semiconductor localization is recommended to pay attention to: Xinsen Technology, etc.
4) Copper Clad Laminate: Focus on companies that continue to make breakthroughs in high-end products.