According to Prismark’s 2023 fourth quarter report statistics, the global PCB industry output value in U.S. dollars in 2023 will decrease by 15.0% year-on-year.
In the medium and long term, the industry will maintain stable growth. The global PCB output value is expected to grow at a compound annual growth rate of 5.4% from 2023 to 2028. From a regional perspective, the PCB industry in all regions around the world shows continued growth. Among them, the compound growth rate in mainland China was 4.1%. From the perspective of product structure, packaging substrates, high-multilayer boards of 18 layers and above, and HDI boards will maintain a relatively high growth rate, with compound growth rates of 8.8%, 7.8%, and 6.2% respectively in the next five years.
For packaging substrate products, on the one hand, product technology upgrades and application scenarios such as artificial intelligence, cloud computing, smart driving, and the Internet of Everything are being upgraded. It drives the electronics industry’s demand for high-end chips and advanced packaging to increase significantly. This has led to the long-term growth of the global packaging substrate industry. In particular, it has promoted high-end packaging substrate products used in scenarios such as high computing power and integration to show a higher growth rate. On the other hand, China has increased its support for the development of the semiconductor industry, and the increase in relevant investment will further accelerate the development of the packaging substrate industry. In the short term, as terminal manufacturers’ semiconductor inventories gradually return to normal levels, the World Semiconductor Trade Statistics Organization (hereinafter referred to as “WSTS”) predicts that the global semiconductor market will grow by 13.1% year-on-year in 2024.
For PCB products, markets such as servers and data storage, communications, new energy and smart driving, and consumer electronics will remain important growth drivers for the industry in the long term. With the accelerated evolution of artificial intelligence, the ICT industry's demand for high computing power and high-speed networks has become increasingly urgent, driving the rapid growth of demand for large-size, high-level, high-frequency, high-speed, high-end HDI, and high-heat dissipation PCB products. From the perspective of terminals, as the application of AI continues to deepen in mobile phones, PCs, smart wearables, IoT and other products, the demand for edge computing capabilities and high-speed data exchange and transmission for various terminal applications has experienced explosive growth. Driven by the above trends, terminal electronic equipment continues to grow in demand for high-frequency, high-speed, integrated, miniaturized, thin and light, high-heat dissipation and other related PCB products.
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