To prevent PCB board cracking, the following measures can be taken:
1. Reasonably select the plate material and thickness: Select the appropriate plate material and appropriate thickness according to the application needs and mechanical strength requirements. Thicker sheets generally have better strength and bending resistance.
2. Good layout design: In PCB layout design, pay attention to avoid concentrating components with excessive weight or mechanical stress to reduce the concentration of mechanical stress on the board. Reasonably distribute components and balance the layout to reduce the impact of mechanical stress.
3. Control the thermal expansion of the board: The PCB board will thermally expand when the temperature changes, and different materials have different thermal expansion coefficients. In the layout design, the thermal expansion coefficients of different materials are taken into consideration and the difference in thermal expansion between different materials is minimized to reduce the stress on the board.
4. Strengthen connection methods: Strengthen the design of connection points, such as using pins, sockets, locking screws and other fixed connection methods to improve the reliability and tensile strength of the connection.
5. Control the manufacturing process: During the PCB manufacturing process, strictly control the temperature and humidity conditions to avoid excessive soldering temperatures and excessive hot and humid environments. Follow the manufacturer's recommendations and best practices to ensure the manufacturing process meets process requirements.
6. Pressure distribution: Pay attention to the pressure distribution of the PCB board during installation and use. Avoid excessive bending, excessive squeezing or excessive twisting of the PCB board to reduce stress concentration.
7. Testing and quality control: Carry out necessary testing and quality control during the PCB manufacturing process to ensure the quality and reliability of the PCB board. Identify potential cracking issues through quality control measures such as X-ray inspection, AOI (automated optical inspection) and mechanical strength testing.
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Note: This article is forwarded from the Internet "CCTV Finance". The above copyright belongs to the original author. This account remains neutral on the content of the article. If there is any infringement or omission, please contact us in the background for correction or deletion!
To prevent PCB board cracking, the following measures can be taken:
1. Reasonably select the plate material and thickness: Select the appropriate plate material and appropriate thickness according to the application needs and mechanical strength requirements. Thicker sheets generally have better strength and bending resistance.
2. Good layout design: In PCB layout design, pay attention to avoid concentrating components with excessive weight or mechanical stress to reduce the concentration of mechanical stress on the board. Reasonably distribute components and balance the layout to reduce the impact of mechanical stress.
3. Control the thermal expansion of the board: The PCB board will thermally expand when the temperature changes, and different materials have different thermal expansion coefficients. In the layout design, the thermal expansion coefficients of different materials are taken into consideration and the difference in thermal expansion between different materials is minimized to reduce the stress on the board.
4. Strengthen connection methods: Strengthen the design of connection points, such as using pins, sockets, locking screws and other fixed connection methods to improve the reliability and tensile strength of the connection.
5. Control the manufacturing process: During the PCB manufacturing process, strictly control the temperature and humidity conditions to avoid excessive soldering temperatures and excessive hot and humid environments. Follow the manufacturer's recommendations and best practices to ensure the manufacturing process meets process requirements.
6. Pressure distribution: Pay attention to the pressure distribution of the PCB board during installation and use. Avoid excessive bending, excessive squeezing or excessive twisting of the PCB board to reduce stress concentration.
7. Testing and quality control: Carry out necessary testing and quality control during the PCB manufacturing process to ensure the quality and reliability of the PCB board. Identify potential cracking issues through quality control measures such as X-ray inspection, AOI (automated optical inspection) and mechanical strength testing.
============================================================================================================
Note: This article is forwarded from the Internet "CCTV Finance". The above copyright belongs to the original author. This account remains neutral on the content of the article. If there is any infringement or omission, please contact us in the background for correction or deletion!