Rogers TC350 laminates are printed circuit board substrates that comprise PTFE, highly thermally conductive ceramic fillers, and woven glass reinforcement. They offer designers a unique combination of low insertion loss and higher thermal conductivity, enabling superior reliability and reduced operating temperatures in high-power applications.
Exceptional dielectric constant stability across various temperatures is maintained by TC350 laminates, a crucial feature for power amplifier and antenna designers in maximizing gain and minimizing bandwidth loss. This stability is also key for phase and impedance-sensitive devices like network transformers in power amplifiers or Wilkinson Power Dividers.
Impressive features contribute to the superior performance of TC350 laminates:
- The dielectric constant (Dk) remains stable at 3.5 at 1MHz, 1.8GHz, and 10GHz.
- A low dissipation factor of .0015 at 1MHz, 0.0018 at 1.8GHz, and 0.002 at 10GHz ensures minimal signal loss and excellent signal integrity.
- The thermal conductivity is high at 0.72 W/mk, facilitating efficient heat dissipation and management.
- The thermal coefficient of Dk is low at -9 ppm/°C, ensuring stable electrical performance across a temperature range of -40°C to 140°C.
- Moisture absorption is limited to 0.05%, providing excellent dimensional stability.
- Mechanical stability is achieved with a CTE x-axis of 7 ppm/°C, CTE y-axis of 7 ppm/°C, and CTE z-axis of 23 ppm/°C over a temperature range of 50°C to 150°C.
Reliability and manufacturing details are as follows:
- The recommended PCB stackup for a 2-layer rigid PCB using TC350 laminates consists of a copper layer on each side (35 μm) with a TC350 core thickness of 0.508 mm (20mil).
- PCB construction details include board dimensions of 68.35mm x 41.4mm with a thickness of 0.6mm. The PCB features a minimum trace/space of 6/5 mils, a minimum hole size of 0.5mm, and no blind vias. The surface finish is Hot Air Solder Level (HASL), with top and bottom solder masks in green.
- The manufactured PCBs adhere to IPC-Class-2 quality standards, ensuring reliable performance and consistent manufacturing processes.
Applications and availability:
- TC350 laminates find applications in power amplifiers, filters, couplers, tower-mounted amplifiers (TMA), tower-mounted boosters (TMB), thermally cycled antennas, microwave combiners, and power dividers.
- They are available worldwide, ensuring easy access to these high-performance PCB substrates for designers and manufacturers globally.
Experience the superior performance of TC350 laminates:
TC350 laminates enable designers to achieve unparalleled reliability, improved thermal management, and enhanced performance in high-power PCB applications. Benefit from their exceptional stability, low insertion loss, and higher thermal conductivity to elevate your designs. TC350 laminates are the optimal choice for your next high-power project, unlocking the true potential of your PCB designs.
Quality Policy
Bicheng has developed series of management procedures and approaches to assure that PCBs are in compliance with the customers' requirements, inclusive of selection of the vendors, work in progress (WIP) inspection, outgoing delivery inspection and customer service etc.
Evaluation and Audit of Suppliers
Suppliers have to be evaluated by Bicheng. In addition, Bicheng will appraise and rank suppliers every year to guarantee the materials supplied are meeting Bicheng’s requirements. Furthermore, Bicheng continuously develop suppliers and supervise them to improve their quality and environment management basing on the systems of ISO9001 & ISO14001.
Contract Evaluation
Bicheng shall review and verify customer's requirements to make sure that we have the capability to satisfy customers' requirements including specifications, delivery and other demands prior to accepting an order.
Making, audit and control of manufacturing data.
When customers' design data and specifications are provided to our market department, Bicheng has to verify all the requirements. Then, convert the design data into manufacturing data by CAM. Finally, a manufacturing instruction (MI) is generated according to the real manufacturing process and technologies for manufacturing department as the basis for actual fabrication. MI must be reviewed by independent engineers and QA engineers before issue.
Incoming Material Quality Control
All materials have to be inspected before warehousing. We established a series of strict inspection procedure and instruction to control the incoming materials. Furthermore, various precise inspecting instruments and apparatus guarantee the capability to judge the material good or not. We issue material with first in first out principle, and give out “alarm” for the material that will reach the shelf life to ensure the materials are used up before expiry.
Control of Production Process
Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.
Final Control and Inspection
All PCBs have to be gone through the open and short test as well as visual inspection after passed the specified physical tests. We own various advanced test equipment including customized, probe flying test machines to guarantee that each PCB is 100% tested.
Product Delivery Audit
We set up a dedicated FQA department to inspect the PCB products according to the customer's specifications and requirements by sampling. Qualified PCBs are going to be packed.
FQA also has to carry out a 100% audit of the warehouse packing and shipping products, including product number, customer number, product quantity, shipping address and so on prior to shipment.
Customer Service
We sets up a professional customer service team to proactively communicate with customers and timely deal with the customers' feedbacks. We highly focus on customers' needs and to understand customers’ demands, timely to adjust the policy of customer service and PCB product requirements.
