Solder Paste Stencil SMT built on 0.1mm stainless steel foil Assembly Laser Cut

Product Details:

Place of Origin:	China
Brand Name:	Bicheng Enterprise Limited
Certification:	UL
Model Number:	BIC-0362-V3.62

Payment & Shipping Terms:

Minimum Order Quantity:	1
Price:	USD69~110
Packaging Details:	KK carton (hard card)
Delivery Time:	2-3 working days
Payment Terms:	T/T/Paypal
Supply Ability:	45000 pieces per month

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Detailed Product Description

Base Material:	Stainless Steel Shim	Foil Thickness(Optional):	0.1mm
Aperture Configured:	Laser Cut	Appearance:	Engraving And Electro Polishing
Fiducial Mark:	Through Hole	Application:	CSP, BGA, 0.5mm QFP Etc. Package

Product profile

1.1 General description

This is a type of solder paste SMT stencil (100% laser cut) built on 0.1mm stainless

steel foil with aluminum frame 420 mm x 520 mm x 20mm dimension. It’s fabricated

per IPC 7525A using supplied Gerber data, squeegee area locating in the center.

Fiducal marks are half-etch dented suit for the SMT machine. It’s packed with KK

carton (hard card) and usually 2 stencils are packed for shipment.

1.2 Features and benifits

A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole process

error is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous to

the printing and forming of tin paste;
D. Focus on low to medium volume production;
E. Quick turnaround prototype;
F. Door to door shipment service;
G. Competitive price;
H. On-time service;
I. More than 15 years of experience;

1.3 Application

SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.

1.4 Parameter and data sheet

Dimension:	370mm x 470mm, 420mm x 520mm, 550mm x 650mm
Structure	Stencil foils with aluminum frame
Base material	Stainless steel shim
Foil Thickness	0.05mm, 0.06mm, 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.18mm, 0.2mm
Aperture configured	Laser cut
Appearance	Engraving and electro polishing
Fiducial mark	Through hole
Service area:	Worldwide
Quantity of open pads:	1152
Advantages:	a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother.
Application:	CSP, BGA, 0.5mm QFP etc. package

1.5 Opening Hole Design for Stencil

Component Type	Pitch	Soldering Width	Soldering Length	Opening Width	Opening Length	Shim Thickness
PLCC	1.27mm	0.65mm	2.00mm	0.60mm	1.95mm	0.15-0.25mm
QFP	0.635mm	0.35mm	1.50mm	0.32mm	1.45mm	0.15-0.18mm
QFP	0.50mm	0.254-0.33mm	1.25mm	0.22-0.25mm	1.20mm	0.12-0.15mm
QFP	0.40mm	0.25mm	1.25mm	0.20mm	1.20mm	0.10-0.12mm
QFP	0.30mm	0.20mm	1.00mm	0.15mm	0.95mm	0.07-0.12mm
0402		0.50mm	0.65mm	0.45mm	0.60mm	0.12-0.15mm
0201		0.25mm	0.40mm	0.23mm	0.35mm	0.07-0.12mm
BGA	1.27mm	0.80mm		0.75mm	0.75mm	0.15-0.20mm
BGA	1.00mm	0.38mm		0.35mm	0.35mm	0.10-0.12mm
BGA	0.50mm	0.30mm		0.28mm	0.28mm	0.07-0.12mm
Flip Chip	0.25mm	0.12mm	0.12mm	0.12mm	0.12mm	0.08-0.10mm
Flip Chip	0.20mm	0.10mm	0.10mm	0.10mm	0.10mm	0.05-0.10mm