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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50

TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50

  • TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50
  • TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50
  • TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50
  • TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50
  • TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50
TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-509-V3.5
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99 per piece
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 20 Glass Epoxy: TU-883
Final Foil External: 1.0oz Final Height Of PCB: 3.0 Mm ±10%
Surface Finish: Immersion Gold Solder Mask Color: Green
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 OHM
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
 
Brief Introduction
This is a type of low loss high performance multi-layer PCB built on TUC’s TU-883 core with 20 copper layers (20-layer PCB). It’s also a type of HDI circuit boards (N+1+N) with 0.1mm laser drill. This is also a type of impedance controlled PCB, 90 Ohms and 50 Ohms are controlled on each signal layers with 10% tolerance. The copper foils are 1 oz and half oz used alternately between layers. The whole PCB is 3.0mm thick, with immersion gold on pads, green solder mask and white silkscreen.
 
Applications
Radio frequency
Backplane, High performance computing
Line cards, Storage
Servers, Telecom, Base station, Office Routers
 
TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 0
 
Detailed Specifications

ItemDescriptionRequirementActualResult
1. LaminateMaterial TypeTU-883TU-883ACC
Tg170170ACC
SupplierTUCTUCACC
Thickness3±10% mm2.8-3.1mmACC
2.Plating thicknessHole Wall≥25µm26.51µmACC
Outer copper35µm41.09µmACC
Inner Copper15/31µm15/31µmACC
3.Solder maskMaterial TypeTAIYO/ PSR-2000GT600DTAIYO/ PSR-2000GT600DACC
ColorGreenGreenACC
Rigidity (Pencil Test)≥4H or above5HACC
S/M Thickness≥10µm20.11µmACC
LocationBoth SidesBoth SidesACC
4. Component MarkMaterial TypeTAIYO/ IJR-4000 MW300IJR-4000 MW300ACC
ColorWhiteWhiteACC
LocationC/S, S/SC/S, S/SACC
5. Peelable Solder MaskMaterial Type   
Thickness   
Location   
6. IdentificationUL MarkYESYESACC
Date CodeWWYY2921ACC
Mark LocationSolder SideSolder SideACC
7. Surface FinishMethodImmersion GoldImmersion GoldACC
Tin Thickness     
Nickel Thickness3-6µm4.06µmACC
Gold Thickness0.05µm0.056µmACC
8. NormativenessRoHSDirective 2015/863/EUOKACC
REACHDirective 1907 /2006OKACC
9.Annular RingMin. Line Width (mil)5.00mil4.80milACC
Min. Spacing (mil)5.00mil5.20milACC
10.V-grooveAngle   
Residual thickness     
11. BevelingAngle   
Height   
12. FunctionElectrical Test100% PASS100% PASSACC
13. AppearanceIPC Class LevelIPC-A-600J &6012D Class 2IPC-A-600J &6012D Class 2ACC
Visual InspectionIPC-A-600J &6012D Class 2IPC-A-600J &6012D Class 2ACC
Warp and Twist0.70%0.21%ACC
14. Reliability TestTape TestNo PeelingOKACC
Solvent TestNo PeelingOKACC
Solderability Test265 ±5℃OKACC
Thermal Stress Test288 ±5℃OKACC
Ionic Contamination Test≦ 1.56 µg/c㎡0.56µg/c㎡ACC

 
Stackup & Impedance Controlled
TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 1
HDI vias

TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 2
 
TU-883 Multilayer Printed Circuit Board (PCB) 20-layer Low Loss High Temperature PCB With Impedance Controlled 90 OHM 50 3

 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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