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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask

Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask

  • Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask
  • Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask
  • Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask
Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-168-V7.83
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD40~50
Packaging Details: Vacuum
Delivery Time: 5-6 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Glass Epoxy: RF-35A2 Final Height Of PCB: 0.8 Mm ±10%
Final Foil External: 1.0 Oz Surface Finish: ENIG
Solder Mask Color: Green Colour Of Component Legend: White
TEST: 100% Electrical Test Prior Shipment

Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Taconic’s RF-35A2 substrate is designed to have ultra-low fiberglass content to achieve "best in class" insertion loss properties and the uniform dielectric constant 3.5 +/-0.05 throughout the laminate. It is a type of ultra low loss power amplifier material.

 

The uniform dispersion of ceramics throughout the laminate yields an extremely low X and Y thermal expansion coefficient. Low modulus and low X-Y CTE values make RF-35A2 an attractive material for chip carrier in surface mounting technology.

 

RF-35A2 is manufactured with a proprietary multi-step process with excellent dielectric performance and excellent copper peel adhesion.The low 0.0015 dissipation factor at 10 GHz allows for maximum power transfer resulting in low heat generation.

 

Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask 0

 

Benefits:

Low loss properties

DK tolerance of +/- 0.05

Homogeneous DK

Excellent peel strength

Low moisture absorption

 

Our PCB Capability (RF-35A2)

PCB Material: PTFE Ceramic Fiberglass
Designation: RF-35A2
Dielectric constant: 3.15
Dissipation Factor 0.0015
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm)
PCB thickness: 10mil (0.254mm); 20mil (0.508mm), 30mil (0.762mm), 60mil (1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, Immersion silver, Immersoin tin, OSP etc..

 

Applications:

Power amplifiers

Filters / couplers

High speed digital

Passive components

Wireless antennas

 

RF-35A2 Typical Values

Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   3.5   3.5
Df @ 10 GHz IPC-650 2.5.5.5.1 (Modified)   0.0015   0.0015
Moisture Absorption IPC-650 2.6.2.1 % 0.03 % 0.03
Dielectric Breakdown IPC-650 2.5.6/ASTM D 149 kV 59 kV 59
Dielectric Strength ASTM D 149 V/mil 1000 V/mm 39,370
Volume Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) Mohm/cm 10^9 Mohm/cm 10^9
Surface Resistivity IPC-650 2.5.17.1 Sec. 5.2.1 (Humidity Cond.) Mohm 10^8 Mohm 10^8
Arc Resistance IPC-650 2.5.1 Seconds 242 Seconds 242
Flexural Strength (MD) IPC-650 2.4.4 kpsi 24 N/mm2 165
Flexural Strength (CD) IPC-650 2.4.4 kpsi 15 N/mm2 103
Tensile Strength (MD) ASTM D 3039 psi 16,800 N/mm2 116
Tensile Strength (CD) ASTM D 3039 psi 11,000 N/mm2 75.8
Young’s Modulus (MD) ASTM D 3039 psi 106 N/mm2 8,343
Young’s Modulus (CD) ASTM D 3039 psi 106 N/mm2 7,171
Poisson’s Ratio (MD) ASTM D 3039   0.14   0.14
Poisson’s Ratio (CD) ASTM D 3039   0.1   0.1
Strain at Break (MD) ASTM D 3039 % 1.6 % 1.6
Strain at Break (CD) ASTM D 3039 % 1.4 % 1.4
Compressive Modulus (Z axis) ASTM D 695 (23°C) kpsi 385 N/mm2 2,650
Peel Strength (1 oz. VLP) IPC-650 2.4.8 (Thermal Stress) lbs/in 12 N/mm 2.1
Peel Strength (1 oz. VLP) IPC-650 2.4.8.3 (150°C ) (Elevated Temp.) lbs/in 14 N/mm 2.5
Peel Strength (1 oz. VLP) IPC-650 2.4.8 Sec. 5.2.3 (Proc. Chemicals) lbs/in 11 N/mm 2
Density (Specific Gravity)   gm/cm3 2.28 gm/cm3 2.28
Specific Heat ASTM E 1269 (DSC) (100°C) J/g/K 0.99 J/g/K 0.99
Thermal Conductivity ASTM F 433 W/M*K 0.29 W/M*K 0.29
Td IPC-650 2.4.24.6 2% Weight Loss °C 528 °C 528
Td IPC-650 2.4.24.6 5% Weight Loss °C 547 °C 547
CTE (x) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 10 ppm/°C 10
CTE (y) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 13 ppm/°C 13
CTE (z) IPC-650 2.4.41 (>RT - 125°C) ppm/°C 108 ppm/°C 108

 

 

Taconic RF-35A2 PCB 20mil (0.508 mm) 30mil(0.762mm) 60mil (1.524mm) With Immersion Gold Immersion Silver and Blue Mask 1

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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