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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Rogers TMM4 Microwave PCB With Immersion Gold for Satellite Communication | TMM3, TMM6, TMM10, TMM10i, TMM13i

Rogers TMM4 Microwave PCB With Immersion Gold for Satellite Communication | TMM3, TMM6, TMM10, TMM10i, TMM13i

  • Rogers TMM4 Microwave PCB With Immersion Gold for Satellite Communication | TMM3, TMM6, TMM10, TMM10i, TMM13i
  • Rogers TMM4 Microwave PCB With Immersion Gold for Satellite Communication | TMM3, TMM6, TMM10, TMM10i, TMM13i
  • Rogers TMM4 Microwave PCB With Immersion Gold for Satellite Communication | TMM3, TMM6, TMM10, TMM10i, TMM13i
Rogers TMM4 Microwave PCB With Immersion Gold for Satellite Communication | TMM3, TMM6, TMM10, TMM10i, TMM13i
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-103-V1
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD9.9-99.99 Per Piece
Packaging Details: Vacuum
Delivery Time: 8-9 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Glass Epoxy: TMM4 Final Height Of PCB: 1.6mm ± 10%
Final Foil External: 1 Oz Surface Finish: Immersion Gold
Solder Mask Color: Green Colour Of Component Legend: White
Number Of Layers: 2 Test: 100% Electrical Test Prior Shipment

Rogers TMM4 Microwave PCB for RF and Microwave Circuitry | TMM3, TMM6, TMM10, TMM10i, TMM13i PCB
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Rogers TMM4 thermoset microwave material is ceramic, hydrocarbon, thermoset polymer composite designed for high plated-through-hole reliability stripline and microstrip applications. It's available with dielectric constant at 4.70. The electrical and mechanical properties of TMM4 combine many of the benefits of both ceramic and traditional PTFE microwave circuit materials, without requiring the specialized production techniques. It does not require a sodium napthanate treatment prior to electroless plating.
 
TMM4 has an exceptionally low thermal coefficient of dielectric constant, typically less than 30 PPM/°C. The material’s isotropic coefficient of thermal expansion, very closely matched to copper, allows for production of high reliability plated through holes, and low etch shrinkage values. Furthermore, the thermal conductivity of TMM4 is approximately twice that of traditional PTFE/ceramic materials, facilitating heat removal.
 
TMM4 is based on thermoset resins, and do not soften when heated. As a result, wire bonding of component leads to circuit traces can be performed without concerns of pad lifting or substrate deformation.
 
Our Capability (TMM4)

PCB Material:Composite of Ceramic, hydrocarbon and thermoset polymer
Designator:TMM4
Dielectric constant:4.5 ±0.045 (process); 4.7 (design)
Layer count:1 Layer, 2 Layer
Copper weight:0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness:15mil (0.381mm), 20mil (0.508mm), 25mil (0.635mm), 30mil (0.762mm), 50mil (1.270mm), 60mil (1.524mm), 75mil (1.905mm), 100mil (2.540mm), 125mil (3.175mm) etc.
PCB size:≤400mm X 500mm
Solder mask:Green, Black, Blue, Yellow, Red etc.
Surface finish:Bare copper, HASL, ENIG, Immersion tin, OSP.

 
Main Applications are as follows:
Chip testers
Dielectric polarizers and lenses
Filters and coupler
Global Positioning Systems Antennas
Patch Antennas
Power amplifiers and combiners
RF and microwave circuitry
Satellite communication systems

 
Rogers TMM4 Microwave PCB With Immersion Gold for Satellite Communication | TMM3, TMM6, TMM10, TMM10i, TMM13i 0
 

Data Sheet of TMM4

TMMY Type Value
Property TMM4DirectionUnitsConditionTest Method
Dielectric Constant,εProcess4.5±0.045Z 10 GHzIPC-TM-650 2.5.5.5
Dielectric Constant,εDesign4.7--8GHz to 40 GHzDifferential Phase Length Method
Dissipation Factor (process)0.002Z-10 GHzIPC-TM-650 2.5.5.5
Thermal Coefficient of dielectric constant+15-ppm/°K-55℃-125℃IPC-TM-650 2.5.5.5
Insulation Resistance>2000-GohmC/96/60/95ASTM D257
Volume Resistivity6 x 108-Mohm.cm-ASTM D257
Surface Resistivity1 x 109-Mohm-ASTM D257
Electrical Strength(dielectric strength)371ZV/mil-IPC-TM-650 method 2.5.6.2
Thermal Properties
Decompositioin Temperature(Td)425425℃TGA-ASTM D3850
Coefficient of Thermal Expansion - x16Xppm/K0 to 140 ℃ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Y16Yppm/K0 to 140 ℃ASTM E 831 IPC-TM-650, 2.4.41
Coefficient of Thermal Expansion - Z21Zppm/K0 to 140 ℃ASTM E 831 IPC-TM-650, 2.4.41
Thermal Conductivity0.7ZW/m/K80 ℃ASTM C518
Mechanical Properties
Copper Peel Strength after Thermal Stress5.7 (1.0)X,Ylb/inch (N/mm)after solder float 1 oz. EDCIPC-TM-650 Method 2.4.8
Flexural Strength (MD/CMD)15.91X,YkpsiAASTM D790
Flexural Modulus (MD/CMD)1.76X,YMpsiAASTM D790
Physical Properties
Moisture Absorption (2X2)1.27mm (0.050")0.07-%D/24/23ASTM D570
3.18mm (0.125")0.18
Specific Gravity2.07--AASTM D792
Specific Heat Capacity0.83-J/g/KACalculated
Lead-Free Process CompatibleYES----

 
Rogers TMM4 Microwave PCB With Immersion Gold for Satellite Communication | TMM3, TMM6, TMM10, TMM10i, TMM13i 1

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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