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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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RO4730G3 30mil 0.762mm High Frequency PCB for Wireless Telecommunications Antennas

RO4730G3 30mil 0.762mm High Frequency PCB for Wireless Telecommunications Antennas

  • RO4730G3 30mil 0.762mm High Frequency PCB for Wireless Telecommunications Antennas
  • RO4730G3 30mil 0.762mm High Frequency PCB for Wireless Telecommunications Antennas
  • RO4730G3 30mil 0.762mm High Frequency PCB for Wireless Telecommunications Antennas
RO4730G3 30mil 0.762mm High Frequency PCB for Wireless Telecommunications Antennas
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0059-V0.1
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99 Per Piece
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Glass Epoxy: RO4730G3, RogersCorp Final Height Of PCB: 0.8mm ± 10%
Final Foil External: 1 Oz Surface Finish: Immersion Gold (51.3% ) 0.05µm Over 3µm Nickel
Solder Mask Color: NO Colour Of Component Legend: N/A
Number Of Layers: 2 Test: 100% Electrical Test Prior Shipment

RO4730G3 30mil 0.762mm High Frequency PCB for Wireless Telecommunications Antennas

 

Rogers RO4730G3 antenna grade laminates are reliable, low-cost alternative to the conventional PTFE-based laminates. It has the mechanical and electrical properties that antenna designers need. The materials have a dielectric constant of 3.0 and a loss tangent of 0.0022 measured at 2.5 GHz when using LoPro Reverse Treated EDC foil. These values allow antenna designers to realize substantial gain values while minimizing signal loss. Materials are available with demonstrated low PIM performance, with values better than -160dBc.

 

RO4730G3 materials are compatible with conventional epoxy and high temperature lead-free solder processing. It does not require the special treatment needed on traditional PTFE-based laminates for plated through holes preparation. Multi-layer can be achieved using RO4450F bondply at 175 ℃. The resin systems of RO4730G3 are designed to provide the properties sought after by antenna designers. The glass transition temperature exceeds 280oC, leading to a low Z-axis CTE, excellent plated through holes reliability, and lead free solder processability.

 

Typical application is cellular base station antennas.

 

General description

This is a type of double sided RF PCB built on 0.762mm (30mil) RO4730G3 for the application of Wireless telecommunications antennas.

 

Basic specifications

Base material: RO4730G3 30mil (0.762mm)

Dielectric constant: 3.0+/-0.5

Layer count: 2 layers

Type: Through holes

Format: 110mm x 100mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm

Solder mask | Legend: Green | White

Final PCB height: 1.1 mm

Standard: IPC 6012 Class 2

Packing: 20 pieces are packed for shipment.

Lead time: 7 working days

Shelf life: 6 months

 

RO4730G3 30mil 0.762mm High Frequency PCB for Wireless Telecommunications Antennas 0

 
Data Sheet of RO4730G3
RO4730G3 Typical Value
Property RO4730G3 Direction Units Condition Test Method
Dielectric Constant,εProcess 3.0±0.5 Z   10 GHz 23 IPC-TM-650 2.5.5.5
Dielectric Constant,εDesign 2.98 Z   1.7 GHz to 5 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0028 Z   10 GHz 23 IPC-TM-650 2.5.5.5
  2.5 GHz
Thermal Coefficient of ε +34 Z ppm/ -50 to 150 IPC-TM-650 2.5.5.5
Dimensional Stability <0.4 X, Y mm/m after etech +E2/150 IPC-TM-650 2.4.39A
Volume Resistivity (0.030") 9 X 107   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity (0.030") 7.2 X 105   COND A IPC-TM-650 2.5.17.1
PIM -165   dBc 50 ohm 0.060" 43 dBm 1900 MHz
Electrical Strength (0.030") 730 Z V/mil   IPC-TM-650 2.5.6.2
Flexural Strength MD 181 (26.3)   Mpa (kpsi) RT ASTM D790
CMD 139 (20.2)  
Moisure Absorption 0.093 - % 48/50 IPC-TM-650 2.6.2.1 ASTM D570
Thermal Conductivity 0.45 Z W/mK 50 ASTM D5470
Coefficient of Thermal Expansion 15.9
14.4
35.2
X
Y
Z
ppm/ -50 to 288 IPC-TM-650 2.4.4.1
Tg >280     IPC-TM-650 2.4.24
Td 411     ASTM D3850
Density 1.58   gm/cm3   ASTM D792
Copper Peel Stength 4.1   pli 1oz,LoPro EDC IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-free Process Compatible Yes        
 
Why choose us?
1) Focus on your core competencies: We’ve deeply known it is full of fierce competition for our customers in the market. You can focus on such important competencies as research and development, sales and marketing based on our professional performance and skilled services that exceeding your expectation.
 
2) Cutting-edge technology: it is rational for a small and medium-sized customer to hanker after the latest equipment and manufacturing expertise for its PCBs. By the partnerships
with Bicheng PCB, you gain access to reach your expectation with our 3 factory bases with over 26,000 square meters.
 
4) Save the cost of production: Production cost is one of the key points of our customers’ product competitiveness. Bicheng PCB have been striving to reduce its manufacturing cost from equipment introduce, worker training and technology improvement to increase their profitability. Customers are satisfied with our cost savings but without quality loss.
 
5) Avoid hassle: It’s an upset matter when quality problem hassling you. Bicheng engineering design prevents problem from occurring in pre-production. You will not get headache with Bicheng prototypes, small orders and volume production. Our rate of customer complaint is less than 1% and will be solved satisfactory.
 
6) Save time: Market requires the products updating quickly. Bicheng PCB always works fast and flexible to save the time of production from prototype to standard production,
quick turn-around or scheduled deliveries.
 
7) An excellent team: Bicheng is trustworthy partner with passion, discipline, responsibility and honesty. We have a team of experienced sales persons and skilled customer services. Do not change your supplier. If change is must, Bicheng is the right one for you.
 
 
RO4730G3 30mil 0.762mm High Frequency PCB for Wireless Telecommunications Antennas 1

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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