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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications

RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications

  • RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications
  • RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications
  • RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications
  • RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications
RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-136-V0.24
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-8.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 2 Glass Epoxy: RO4350B LoPro 30.7mil (0.78mm), Tg 288℃
Final Foil: 1 Oz Final Height Of PCB: 0.9 Mm ±10%
Surface Finish: Immersion Gold 0.025µm Over 3µm Nickel Solder Mask Color: Green
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RO4350B LoPro laminates use a proprietary Rogers' technology that allows reverse treated foil to bond to standard RO4350B dielectric. This results in a laminate with low conductor loss for improved insertion loss and signal integrity while maintaining all other desirable attributes of the standard RO4350B laminate system.

 

RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications 0

 

Features and Benefits:

RO4350B materials are reinforced hydrocarbon/ceramic laminates with very low profile reverse treated foil.

1. Lower insertion loss

2. Low PIM

3. Increased signal integrity

4. High circuit density

 

Low Z-axis coefficient of thermal expansion

1. Multi-layer board capability

2. Design flexibility

 

Lead-free process compatible

1. High temperature processing

2. Meets environmental concerns

 

CAF resistant

 

 

Our PCB Capability (RO4350B LoPro)

PCB Material: Hydrocarbon Ceramic Laminates
Designation: RO4350B LoPro
Dielectric constant: 3.48±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10.7mil (0.272mm), 14mil (0.356mm), 17.3mil (0.439mm), 20.7mil(0.526mm), 30.7mil (0.780mm), 60.7mil(1.542mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin etc..

 

Some Typical Applications:

1. Digital applications such as servers, routers, and high speed back planes

2. Cellular base station antennas and power amplifiers

3. LNB’s for direct broadcast satellites

4. RF Identification Tags

 

Typical Properties of RO4350B LoPro

Property Typical Value Direction Units Condition Test Method
Dielectric Constant, Process 3.48 ± 0.05 z -- 10 GHz/23°C IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant, Design 3.55 z -- 8 to 40 GHz Differential Phase Length Method
Dissipation Factor tan, 0.0037 0.0031 z -- 10 GHz/23°C 2.5 GHz/23°C IPC-TM-650 2.5.5.5
Thermal Coeffifi cient of r 50 z ppm/°C -50°C to 150°C IPC-TM-650 2.5.5.5
Volume Resistivity 1.2 X 1010   MΩ•cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 5.7 X 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) z KV/mm(V/mil) 0.51mm(0.020”) IPC-TM-650 2.5.6.2
Tensile Modulus 11473(1664) Y MPa(kpsi) RT ASTM D638
Tensile Strength 175(25.4) Y MPa(kpsi) RT ASTM D638
Flexural Strength 255(37)   MPa(kpsi)   IPC-TM-650 2.4.4
Dimensional Stability <0.5 X,Y mm/m(mils/inch) after etch +E2/150°C IPC-TM-650 2.4.39A
Coeffifi cient of Thermal Expansion 14 x ppm/°C -55 to 288°C IPC-TM-650 2.1.41
16 y
35 z
Tg >280   °C TMA A IPC-TM-650 2.4.24.3
Td 390   °C TGA   ASTM D3850
Thermal Conductivity 0.62   W/m/°K 80°C ASTM C518
Moisture Absorption 0.06   % 48 hrs immersion 0.060” sample Temperature 50°C ASTM D570
Density 1.86   gm/cm3 23°C ASTM D792
Copper Peel Strength 0.88(5.0)   N/mm(pli) after solder float 1 oz. TC Foil IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

 
RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications 1
 
RO4350B LoPro Microwave PCB 30.7mil Rogers High Frequency PCB Reverse Treated Foil With ENIG for Digital Applications 2
 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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