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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device

Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device

  • Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device
  • Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device
Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-107-V1.07
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-6.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 2 Glass Epoxy: PTFE F4B
Final Foil: 1 Oz Final Height Of PCB: 3.0 Mm ±10%
Surface Finish: Immersion Gold Solder Mask Color: Black
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

Metal Based High Frequency PCB Built on Modified Woven Fabric Glass Teflon (PTFE) Copper Clad Laminates with Ceramic Filler

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Metal based substrate is a combination of metal based high frequency materials. The intermediate medium is made of high frequency materials ( such as PTFE and others), one side is coated with copper foil, the other side is coated with copper base or aluminum base. The PCB made on this kind of modified material, we can call it metal based high frequency PCB.

 

Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device 0

 

Parameters

DK @ 10GHz & Tolerance: 2.20+/- 0.03

Thermal Change of DK (ppm/℃) : -48

Loss Tangent, Df@10GHz: 0.001

Thermal Conductivity(W/mk): 0.35

Td (℃): 476

Coefficient of Thermal Expansion -50℃ -260 ℃: X 40; Y45; Z98

Density (g/cm3): 1.80

Volume Resisivity (Mohm.cm) 1x 10^8

Surface Resistivity (Mohm): 1 x 10^8

Moisture Absorption: 0.02

Peel Strength (N/cm) (1oz): 20

Flammability Rating: UL94 V0

 

Data Sheet of F4BTMS Modified woven fabric glass Teflon (PTFE) copper clad laminates with ceramic filler

Designator of Substrate Material Composition / Dielectric Layer Types DK @ 10GHz & Tolerance Thermal Change of Dk(ppm/℃) Loss Tangent, Df@10GHz Thermal Conductivity(W/mk) Td (℃) Coefficient of Thermal Expansion -50℃ -260 ℃ (ppm/℃) Density (g/cm3): Volume Resisivity (Mohm.cm) Surface Resistivity (Mohm) Moisture Absorption (%) Peel Strength (N/cm) (1oz) Flammability Rating
X Y Z
F4BTMS PTFE/Ceramic/Superfine woven glass F4BTMS220 2.20±0.03 -48 0.0010 0.35 476 40 45 98 1.80 1X108 1X108 0.02 20 V-0
F4BTMS294 2.94±0.04 -20 0.0012 0.58 490 10 12 22 2.25 1X108 1X108 0.03 12 V-0
F4BTMS300 3.00±0.04 -20 0.0013 0.58 490 10 11 22 2.28 1X108 1X108 0.04 12 V-0

Type of Metal Base: Aluminum, Copper

Thickness of Metal Base: 1.0mm, 2.0mm, 3.0mm, 4.0mm

Base copper: 0.5oz, 1oz

 

Thickness and size F4BTMS

Designator of Substrate Standard Dielectric Thickness(Without the cladding) and Tolerance Available Copper Foil Standard Size
F4BTMS 0.127mm(5mil) ±0.0127mm(0.5mil) 0.254mm(10mil) ±0.02mm(1mil) 0.508mm(20mil) ±0.03mm(1.19mil) 0.762mm(30mil) ±0.04mm(1.58mil) 1.016mm(40mil) ±0.05mm(2mil) 1.524mm(60mil) ±0.05mm(2mil) 3.05mm(120mil) ±0.1mm(4mil) 5.08mm(200mil) ±0.127mm(5mil) Non-standard thickness is increased by 0.254mm(10mil). Over 6.1mm(240mil), please contact us. 0.5oz, 1oz, ED Copper, RTF Copper, HVLP Copper, RA Copper, 50ῼ Resistance Copper 305mm x 460mm (12" x 18") 460mm x 610mm (18" x 24") 500mm x 600mm (19.7" x 23.6") 915mm x 1220mm (36" x 48")

 

Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device 1

 

PCB Capability
PCB Material: Modified PTFE Copper Clad with Ceramic Filler
Designator: F4BTMS220
Dielectric constant @ 10GHz: 2.2
Layer count: Single Layer
Copper weight: 0.5oz, 1oz
PCB thickness: 1.2mm - 9.0mm
0.047” - 0.354”
Solder mask: Green, Red, Black, White, Blue etc.
PCB size: ≤400mm X 500mm
Surface finish: Bare copper, HASL, ENIG, Immersion tin etc.

 

 

Metal Based High Frequency PCB Built on 3.0mm PTFE with 1.0oz coating Immersion Gold for Radio Device 2

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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