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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Low Dk/Df and High Thermal Reliability Printed Circuit Board (PCB) on Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp

Low Dk/Df and High Thermal Reliability Printed Circuit Board (PCB) on Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp

  • Low Dk/Df and High Thermal Reliability Printed Circuit Board (PCB) on Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp
  • Low Dk/Df and High Thermal Reliability Printed Circuit Board (PCB) on Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp
  • Low Dk/Df and High Thermal Reliability Printed Circuit Board (PCB) on Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp
  • Low Dk/Df and High Thermal Reliability Printed Circuit Board (PCB) on Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp
Low Dk/Df and High Thermal Reliability Printed Circuit Board (PCB) on Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-500-V0.13
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-8.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 4 Glass Epoxy: TU-872 SKL Sp
Final Foil: 1.5 Oz Final Height Of PCB: 1.6 Mm ±10%
Surface Finish: Electroless Nickel Over Immersion Gold (ENIG)( 1 µ" Over 100 µ" Nickel) Solder Mask Color: Blue
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

Low Dk/Df and High Thermal Reliability Printed Circuit Board (PCB) on Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

TU-872 SLK Sp is based on a high performance modified epoxy FR-4 resin. This material is reinforced with novel woven glass and designed with extra low dielectric constant and low dissipation factor for high speed low loss and high frequency circuit board application. TU-872 SLK Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.

 

Low Dk/Df and High Thermal Reliability Printed Circuit Board (PCB) on Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp 0

 

Key Features

1. Excellent electrical properties

2. Dielectric constant less than 3.5

3. Dissipation factor less than 0.010

4. Excellent, stable and flat Dk/Df performance

5. Compatible with most FR-4 processes

6. Lead free process compatible

7. Improved z-axis thermal expansion

8. Anti-CAF capability

9. Superior dimensional stability, thickness uniformity and flatness

10. Excellent through-hole and soldering reliability

 

Our PCB Capabilities (TU-872 SLK Sp)

PCB Material: High performance modified epoxy FR-4 resin
Designation: TU-872 SLK Sp
Dielectric constant: < 3.5
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm)
PCB thickness: 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc..
Technology: HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc.

 

Main Applications

1. Radio Frequency

2. Backpanel, High performance computing

3. Line cards, Storage

4. Servers, Telecom, Base station

5. Office Routers

 

 

Typical Properties (TU-872 SLK Sp)

  Typical Values Conditioning IPC-4101 /126
Thermal      
Tg (DMA) 220°C    
Tg (DSC) 200°C   > 170°C
Tg (TMA) 190°C E-2/105  
Td (TGA) 340°C   > 340°C
CTE x-axis 12~15 ppm/°C   N/A
CTE y-axis 12~15 ppm/°C E-2/105 N/A
CTE z-axis 2.30%   < 3.0%
Thermal Stress,Solder Float, 288°C > 60 sec A > 10 sec
T260 60 min   > 30 min
T288 20 min E-2/105 > 15 min
T300 5 min   > 2 min
Flammability 94V-0 E-24/125 94V-0
DK & DF      
Permittivity (RC 50%) @10GHz 3.5    
Loss Tangent (RC 50%) @10GHz 0.008    
Electrical      
Permittivity (RC50%)      
1GHz (SPC method/4291B) 3.6/3.4   < 5.2
5GHz (SPC method) 3.5 E-2/105 -
10GHz (SPC method) 3.5   -
Loss Tangent (RC50%)      
1GHz (SPC method/4291B) 0.006/0.004    
5GHz (SPC method) 0.007 E-2/105 < 0.035
10GHz (SPC method) 0.008    
Volume Resistivity > 1010 MΩ•cm C-96/35/90 > 106 MΩ•cm
Surface Resistivity > 108 MΩ C-96/35/90 > 104 MΩ
Electric Strength > 40 KV/mm A > 30 kV/mm
Dielectric Breakdown > 50 kV A N/A
Mechanical      
Young’s Modulus      
Warp Direction 26 GPa A N/A
Fill Direction 24 GPa    
Flexural Strength      
Lengthwise > 60,000 psi A > 60,000 psi
Crosswise > 50,000 psi A > 50,000 psi
Peel Strength, 1.0 oz RTF Cu foil 4~7 lb/in A > 4 lb/in
Water Absorption 0.13% E-1/105+D-24/23 < 0.5 %
 
Low Dk/Df and High Thermal Reliability Printed Circuit Board (PCB) on Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp 1
 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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