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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill

Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill

  • Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill
  • Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill
  • Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill
Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-78-V1.05
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T
Supply Ability: 50000 pieces per month
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Detailed Product Description
Number Of Layers: 4 Glass Epoxy: RO4350B Tg280℃, Er<3.48, Rogers Corp; FR-4 IT158
Final Foil: 1 Oz Final Height Of PCB: 1.3 Mm ±10%
Surface Finish: Immersion Gold Solder Mask Color: Green
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

 

Hi Everyone,

Today, we're talking about 4-layer high frequency PCB made on 10mil RO4350B pressed with FR-4.

 

The board is designed as a 4-layer structure, because 4-layer is relatively simple and cost controllable, this is helpful to open up a new market.

 

Let's take a look at first build-up,

Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill 0

 

The first layer to the second layer is 10mil RO4350B core material, the core has fixed thickness which is very important to the electrical length of RF lines on the circuit board, and the other layers are FR-4 materials, which are bonded by semi-cured sheets. Inner layer is 0.5 ounces and the outer layer is 1 ounce.

 

Following picture is the cross section.

Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill 1

Plated through holes connect each layer. Pads and vias are with immersion gold.

 

The second board has a special “hole” in the board. See the build-up first.

Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill 2

Layer 1 and layer 2 is the 10mil core. The depth-control drill is dented on FR-4 side. The whole height of this board is only 0.7mm thick.

Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill 3

The applications of 10mil RO4350B hybrid PCB are wide, such as preamplifier, radar sensors, digital transmitter and splitter module; GPS antenna, communications relays, analogue transmitter and 4G antennas; RF transmitter, WiFi amplifier, RFID and attenuator etc.

 

The advantages of 10mil RO4350B hybrid PCBs:

1) RO4350B exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;

2) Signal integrity performance improved over the stack-ups with all FR4 board;

3) Cost reduced over stack-ups with all low loss material;

4) Benefit from our strong capabilities: meeting your PCB needs from prototype to mass production and IATF 16949 (2016), ISO14001 (2015), ISO9001 (2015) and UL certified factory guarantee your quality.

 

Thank you for your reading. You’re welcome to contact us for our RF PCB enquiries.

 

Appendix: Our PCB Capability 2022

Parameter Value
 Layer Counts  1-32
 Substrate Material RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc.
 
Hybrid PCB | Mixed Material PCB Built On 10 mil RO4350B + FR-4 With Depth Controlled Drill 4

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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