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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

Rogers PCB RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210

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Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

  • Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
  • Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
  • Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0076-V3.6
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-5.99 per piece
Packaging Details: Vacuum
Delivery Time: 6-7 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Contact Now
Detailed Product Description
Number Of Layers: 4 Glass Epoxy: RO4003C Tg280℃, Er<3.48, Rogers Corp.
Final Foil External: 1oz Final Height Of PCB: 1.6 Mm ±10%
Surface Finish: Immersion Gold, 85% Solder Mask Color: Green
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

 

Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4

(PCB’s are custom-made products, the picture and parameters shown are just for reference)

 

Hello everyone,

Warm greetings!

Today we talk about 4-layer hybrid PCB built on 20mil RO4003C and FR-4.

 

Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 0

 

Firstly, it's a 4 layer structure. Layer 1 to layer 2 is 20mil RO4003C core, which is the main wiring layer for the signal lines. Layer 3 to layer 4 is the core of FR-4, both cores are combined through 0.2mm prepeg. Each layer is connected by plated through holes. The inner layer and out layer of copper is 1 ounce. This is a good method to keep the board cost effective.

 

Let's take a look at its micro-section chart.

 

Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 1

 

Here on the left is the PTH hole, the bottom is layer 1 to layer 2 which is high frequency material, the upper part is glass fiber material. The finished thickness of the plate is 1.6mm.

The color of solder mask and silkscreen are also commonly used in green and white. Surface finish on pads is immersion gold.

 

Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 2

 

Following is another type of 20mil RO4003C hybrid PCB. It’s made of 2 cores of 20mil RO4003C.

 

Hybrid High Frequency Multilayer PCB 4 Layer Hybrid PCB Board Bulit On Rogers 20mil RO4003C and FR-4 3

 

The applications of 20mil RO4003C hybrid PCB is wide, such as LNA, optical coupler, balanced amplifier, duplexer etc.

 

The advantages of 20mil RO4003C hybrid PCB are reflected in following 3 points:

1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications.

2) Reducing signal loss in high frequency application meets the development needs of communication technology.

3) Cost reduced over stack-ups with all low loss material;

 

Our PCB Capability (Hybrid Design)

PCB Type: Hybrid PCB, Mixed PCB
Mixed type: RO4350B + FR4;
RO4003C + FR4;
F4B + FR4;
Duroid/RT5880 + RO4350B
Duroid/RT5880 + FR4
Solder mask: Green, Red, Blue, Black, Yellow
Layer count: 4 Layer, 6 Layer, Multilayer
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 1.0-5.0mm
PCB size: 400mm X 500mm
Surface finish: Bare copper, HASL, ENIG, Immersion tin, OSP

 

At present, the mature mixed pressing materials are as follows:

RO4350B + FR4;

RO4003C + FR4;

F4B + FR4;

RT/duroid5880 + FR4

RT/duroid5880 + RO4350B

 

Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

 
Appendix: Data Sheet of RO4003C
RO4003C Typical Value
Property RO4003C Direction Units Condition Test Method
Dielectric Constant,εProcess 3.38±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.55 Z   8 to 40 GHz Differential Phase Length Method
Dissipation Factortan,δ 0.0027
0.0021
Z   10 GHz/23℃
2.5 GHz/23℃
IPC-TM-650 2.5.5.5
Thermal Coefficient of ε +40 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 1.7 x 1010   MΩ.cm COND A IPC-TM-650 2.5.17.1
Surface Resistivity 4.2 x 109   COND A IPC-TM-650 2.5.17.1
Electrical Strength 31.2(780) Z Kv/mm(v/mil) 0.51mm(0.020") IPC-TM-650 2.5.6.2
Tensile Modulus 19,650(2,850)
19,450(2,821)
X
Y
MPa(ksi) RT ASTM D 638
Tensile Strength 139(20.2)
100(14.5)
X
Y
MPa(ksi) RT ASTM D 638
Flexural Strength 276
(40)
  MPa
(kpsi)
  IPC-TM-650 2.4.4
Dimensional Stability <0.3 X,Y mm/m
(mil/inch)
after etch+E2/150℃ IPC-TM-650 2.4.39A
Coefficient of Thermal Expansion 11
14
46
X
Y
Z
ppm/℃ -55℃to288℃ IPC-TM-650 2.4.41
Tg >280   ℃ TMA A IPC-TM-650 2.4.24.3
Td 425   ℃ TGA   ASTM D 3850
Thermal Conductivity 0.71   W/M/oK 80℃ ASTM C518
Moisture Absorption 0.06   % 48hrs immersion 0.060"
sample Temperature 50℃
ASTM D 570
Density 1.79   gm/cm3 23℃ ASTM D 792
Copper Peel Stength 1.05
(6.0)
  N/mm
(pli)
after solder float 1 oz.
EDC Foil
IPC-TM-650 2.4.8
Flammability N/A       UL 94
Lead-free Process Compatible Yes        
 
 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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