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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

  • Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay  for Interface Module
  • Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay  for Interface Module
  • Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay  for Interface Module
  • Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay  for Interface Module
  • Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay  for Interface Module
Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay  for Interface Module
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0313-V3.13
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-9.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: Polyimide 25μm Board Thickness: 0.25 Mm
Surface/Inner Layer Cu Thickness: 70 µm Surface Finish: Immersion Gold
Coverlay Colour: Yellow Color Of Silkscreen: No
Function: 100% Pass Electrical Test Number Of Layers: 2

Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay for Interface Module

(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)

 

General description

This is a type of 2 Layer flexible printed circuit (FPC) built on 2oz polyimide for the application of Interface Module.

 

Basic specifications

Base material: Polyimide 25μm

Layer count: 2 layers

Type: Individual FPC

Format: 105mm x 42.3mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 70μm/ Inner layer 0 μm

Solder mask / Legend: Yellow coverlay / No.

Final PCB height: 0.25 mm

Standard: IPC 6012 Class 2

Packing: 100 pieces are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

 

Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay  for Interface Module 0

 

Features and benefits

Reliability increased;

Controllability of electrical parameter design;

The end can be whole soldered;

SMT process is resistant to reflow soldering, resistant to rework;

Professional and experienced engineers check your production files

Competitive price;

No MOQ, low cost for prototypes and small runs quantity;

8000 types of PCB's per month;

 

Applications

Thin-film switch, contact belt of inkjet printer, industrial control interphone, medical keypad soft board, contact belt of inkjet printer projector soft board

 

Specifications of Standard 2 Layer FCCL

Double sided adhesiveless flexible copper clad laminate (SF202)
Specifications Thickness (µm) Copper Type Applications
Polyimide Film Copper Foil
SF202 0512DT 12.5 12 RTF Camera, LCM, TP etc..
SF202 0812DT 20 12 RTF
SF202 1012DT 25 12 RTF
SF202 0518DT 12.5 18 RTF Batter FPC
SF202 0818DT 20 18 RTF
SF2021018DT 25 18 RTF
SF202 0512DR 12.5 12 RA Camera, LCM, TP etc..
SF202 0812DR 20 12 RA
SF202 1012DR 25 12 RA
SF202 0518DR 12.5 18 RA
SF202 0818DR 20 18 RA
SF202 1018DR 25 18 RA
SF202 0535DT 12.5 35 RTF Batter FPC
SF202 1035DT 25 35 RTF
SF202 0535DR 12.5 35 RA
SF202 1035DR 25 35 RA
         
Specifications of New FCCL        
Double sided adhesiveless flexible copper clad laminate (SF202)
Specifications Thickness (µm) Copper Type Applications
Polyimide Film Copper Foil
SF202 0506DR 12.5 6 RA Fine-line
SF20200509DR 12 9 RA
SF202 0509DT 12 9 RTF
SF202 0812DR 20 12 RA Side switch
SF202 1012DR 25 12 RA
SF202 0545DT 12.5 45 RTF Wireless Charge
SF202 1045DT 25 45 RTF
SF202 0550DT 12.5 50 RTF
SF202 1050DT 25 50 RTF
SF202 0570DT 12.5 70 RTF
SF202 1070DT 25 70 RTF
SF202 101850DT 25 18, 50 RTF
SF202 101870DT 25 18,70 RTF

 

Clarifications of FPC

According to the combination of base material and copper foil, flexible circuit board can be divided into two types: flexible board with adhesive and flexible board without adhesive. The price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB, but its flexibility, bonding force between copper foil and substrate and flatness of solder are also better than that of adhesive flexible PCB. So it is only used in the high demand situations, such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high flatness of the pad) and so on. Because its price is high, most of the flexible PCBs used in the market are still adhesive flexible circuit board. Because the flexible circuit board is mainly used in the situation where bending is required, if the design or process is not reasonable, it is easy to produce micro-cracks, welding and other defects.

 

Economy of using FPC

If the circuit design is relatively simple, the total volume is small, and the space is suitable, the traditional internal connection is much cheaper. Flexible circuits are a good design option if the circuit is complex, processes many signals or has special electrical or mechanical requirements. When the size and performance of applications exceed the capacity of rigid circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole and a flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore, it is more reliable to mount the chip directly on the film. There is no flame retardant that could be an ion source. These films may be protective and solidified at higher temperatures to obtain higher glass transition temperatures. Flexible materials are less costly than rigid materials because they are free of connectors.

 
 
 
 
Flexible Printed Circuit (FPC) Built on 2oz Polyimide With Immersion Gold and Yellow Coverlay  for Interface Module 1

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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