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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications

Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications

  • Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications
  • Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications
  • Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications
  • Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications
  • Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications
Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-507-V0.62
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-9.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 2 Glass Epoxy: IT-180ATC
Final Foil: 1.0 Oz Final Height Of PCB: 1.6 Mm ±10%
Surface Finish: Immersion Gold Solder Mask Color: Green
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Brief Introduction

This is a type of standard double sided high temperature PCB which is built on ITEQ’s IT-180ATC laminate. (For more details about IT-180ATC, please refer to High Tg Lead Free Printed Circuit Board (PCB) on IT-180ATC and IT-180GNBS with 0.5oz-3oz Copper 0.5-3.2mm Thick). There are 10 boards paneled up in the array. They are 1.6mm thick with 2oz copper, coating with immersion gold on pads and green solder mask protection for substrate. 25 pieces are vacuum packed for shipment.

 

Applications

Automotive (Engine room ECU)

Backplanes

Data Storage

Server and Networking

Telecommunications

 

Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications 0

 

PCB Parameters

Item Description Requirement Actual Result
1. Laminate Material Type FR-4 IT-180ATC FR-4 IT-180ATC ACC
Tg 170 170 ACC
Supplier ITEQ ITEQ ACC
Thickness 1.6 ±10% mm 1.63-1.68 mm ACC
2.Plating thickness Hole Wall ≥25 µm 26.51 µm ACC
Outer copper 35 µm 41.09 µm ACC
Inner Copper          
3.Solder mask Material Type TAIYO/ PSR-2000GT600D TAIYO/ PSR-2000GT600D ACC
Color Green Green ACC
Rigidity (Pencil Test) ≥4H or above 5H ACC
S/M Thickness ≥10 µm 20.11 µm ACC
Location Both Sides Both Sides ACC
4. Component Mark Material Type TAIYO/ IJR-4000 MW300 IJR-4000 MW300 ACC
Color White White ACC
Location C/S C/S ACC
5. Peelable Solder Mask Material Type      
Thickness      
Location      
6. Identification UL Mark YES YES ACC
Date Code WWYY 2121 ACC
Mark Location Solder Side Solder Side ACC
7. Surface Finish Method Immersion Gold Immersion Gold ACC
Tin Thickness          
Nickel Thickness 3-6 µm 4.06 µm ACC
Gold Thickness 0.05 µm 0.056 µm ACC
8. Normativeness RoHS Directive 2015/863/EU OK ACC
REACH Directive 1907 /2006 OK ACC
9.Annular Ring Min. Line Width (mil) 5.00 mil 4.80 mil ACC
Min. Spacing (mil) 5.00 mil 5.20 mil ACC
10.V-groove Angle 30º 30º ACC
Residual thickness 0.4 ±0.1mm 0.43 mm ACC
11. Beveling Angle      
Height      
12. Function Electrical Test 100% PASS 100% PASS ACC
13. Appearance IPC Class Level IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Warp and Twist 0.70% 0.21% ACC
14. Reliability Test Tape Test No Peeling OK ACC
Solvent Test No Peeling OK ACC
Solderability Test 265 ±5℃ OK ACC
Thermal Stress Test 288 ±5℃ OK ACC
Ionic Contamination Test ≦ 1.56 µg/c㎡ 0.56 µg/c㎡ ACC

 

Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05

Hole Code PTH Required Actual value Result
1 Y 0.400 0.400 0.425 0.425 0.400 ACC
2 Y 0.450 0.450 0.500 0.475 0.450 ACC
3 Y 0.600 0.600 0.650 0.625 0.600 ACC
4 Y 0.725 0.750 0.775 0.775 0.750 ACC
5 Y 0.850 0.850 0.825 0.850 0.825 ACC

 

Electric Test Report

Test Type Flying Probe Testing Points 156 Testing Time 5/28/2021 Quantity 1000 Pieces
Testing Condition Voltage 250V Conductive Resistance 20 Ω
Current 100 mA Isulation Resistance 20 mΩ
Testing Result Quantity Passed 1000 Pieces Passing Rate 100%
Quantity Rejected 0 Pieces
Open Circuits 0 Pieces Short Circuits 0 Pieces
Conductive Non-confirming 0 Pieces Insulation Non-confirming 0 Pieces
 
Double Sided High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold for Telemetry Communications 1

 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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