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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

Rogers PCB RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210, RO4730, RO4360, RO3203

Taconic PCB TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4

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5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold

5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold

  • 5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold
  • 5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold
5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0087-V5.4
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD20~30
Packaging Details: Vacuum
Delivery Time: 4-5 working days
Payment Terms: T/T,Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 5 Glass Epoxy: RO4003C 20mil, Tg 288℃
Final Height Of PCB: 2.1mm ±0.16 Final Foil External: 1.0 Oz
Surface Finish: Electroless Nickel Over Immersion Gold (ENIG)( 2 µ" Over 100 µ" Nickel) Solder Mask Color: No Solder Mask Required
Colour Of Component Legend: No Silkscreen Required Test: 100% Electrical Test Prior Shipment

5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold

(PCB's are custom-made products, the picture and parameters shown are just for reference)

 

Hi Everyone,

Today, we're going to talk about a type of 5-layer high frequency PCB made on Rogers RO4003C.

5 layer PCB is fabricated on 3 cores of RO4003C and etched 1 layer copper off to achieve 5 layers.

 

5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold 0

 

Viewing from the stack up, we can see 3 sheets of 20 mil cores achieve the basic layer structure, 2 layers of dielectric material (prepreg) bond the 3 cores which result in 5-layer board. Copper weight in inner-layer is half ounce, outer-layer 1 ounce. Final height of the board is 2.1mm thick.

 

Following is the picture of micro-section, which can more intuitively reflect the structure of the board. No solder mask is applied on the surface, pads are immersion gold plated.

 

5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold 1

 

Actually the stack up of multilayer PCBs can be done in many different ways according to the different requirements or applications for controlled impedances, signal transmission etc. There’re many types of cores for our designer to choose in RO4003C family, such as 8mil, 12mil, 16mil, 20mil, 32mil and 60mil etc.

 

The core has fixed thickness, it is very important to the electrical length of RF lines on the circuit board.

 

We have a variety of high frequency materials for customers to choose from, the main are Rogers 4000 series, 3000 series, 5000 series and 6000 series, Taconic TLX series, TLY series etc. and Chinese F4B series etc.

 

If you're interested in, please feel free to contact us.

Thank you for your reading.

 

Appendix: Our PCB Capability 2021

Parameter Value
 Layer Counts  1-32
 Substrate Material FR-4(including High Tg 170, High CTI>600V); Aluminum based; Copper based; Rogers RO4350B, RO4003C, RO3003, RO3006, RO3010, RO3210 etc.; Rogers RT/duroid 5880, RT/duroid 5870, RT/duroid 6002, RT/duroid 6010 etc..; Taconic TLX-8, TLY-5, RF-35TC, TLF-35 etc..; Arlon AD450, AD600 etc; PTFE F4B DK2.2, DK2.65 etc..; Polyimide and PET.
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--350µm (0.5oz - 10oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

5 Layer High Frequency PCB Board Bulit On Rogers 20mil RO4003C With Immersion Gold 2

 

 

 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Mr. Kevin Liao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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