RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203
TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350
 |
| Place of Origin: | China |
| Brand Name: | Bicheng Enterprise Limited |
| Certification: | UL |
| Model Number: | BIC-209-V1.0 |
| Minimum Order Quantity: | 1 |
|---|---|
| Price: | USD20~30 |
| Packaging Details: | Vaccum |
| Delivery Time: | 5-6 working days |
| Payment Terms: | T/T / Paypal |
| Supply Ability: | 45000 pieces per month |
| Board Thick: | 1.524mm ±0.13mm | Copper Thick: | 1oz (35µm), 2oz (70µm) |
|---|---|---|---|
| Surface Finish: | Immersion Gold, HASL, Immersion Silver, Immersion Tin,Bare Copper, OSP, Pure Gold Plated Etc.. | Solder Mask Color: | Green |
| Colour Of Component Legend: | White | TEST: | 100% Electrical Test Prior Shipment |
Rogers CLTE-XT High Frequency PCB 9.4mil 25mil 40mil 59mil ceramic filled woven glass reinforced PTFE Circuit Boards
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
The CLTE-XT laminates are composites of PTFE, woven fiberglass reinforcement, and micro-dispersed ceramic filler that are intended to increase loss tangent while preserving good dimensional stability and offering excellent thermal reliability and electrical performance.
Features and Benefits
1. Copper matched CTE in X and Y axis
2. Low Z-direction CTE of 20 ppm /°C
3. Low dissipation factor of 0.0010 at 10 GHz reduced circuit losses without sacrificing dimensional stability
4. Tightest dielectric constant tolerance(+/- .03) and DK stability with temperature change
5. High reliability on plated through holes
6. 0.02% low moisture absorption
7. Great number of NASA outgassing values.
8. High thermal conductivity of 0.56 W/m/K
Our PCB Capability (CLTE-XT laminates)
| PCB Capability (CLTE-XT Laminates) | |
| PCB material: | Ceramic/PTFE Microwave Composite |
| Designation: | CLTE-XT |
| Dielectric constant: | 2.94 |
| Layer count: | Sinlge-sided PCB, Double-sided PCB, Multi-layer PCB, Hybrid PCB |
| Dielectric thickness: | 5.1mil(0.130mm), 9.4mil (0.239mm), 20mil (0.508mm), 25mil(0.635mm), 30mil(0.762mm), 40mil(1.016mm), 45mil(1.143mm), 59mil(1.499mm), 60mil(1.524mm) |
| Copper weight: | 1oz (35µm), 2oz (70µm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Red, Yellow etc. |
| Surface finish: | Immersion gold, HASL, Immersion silver, Immersion tin,Bare copper, OSP, Pure gold plated etc.. |
The majority of final finishes, including HASL, Sn, Ag, Ni/Au, OSP, etc., have been applied to CLTE-XT materials without incident or cause for concern. Individual circuit board can be routed, punched, or laser cut depending on preference, tolerances, and edge quality requirements.
Typical Applications
1. Advanced Driver Assistance Systems (ADAS)
2. CNI (communication, navigation and identification) Applications
3. Defense Microwave/RF Applications
4. Microwave Feed Networks
5. Phased Array Antennas
6. Power Amplifiers
7. Patch Antennas
8. Radar Manifolds
9. Satellite & Space Electronics
Data Sheet (CLTE-XT laminates)
| Properties | CLTE-XT | Units | Test Conditions | Test Method | |
| Electrical Properties | |||||
| Dielectric Constant | 2.94 | - | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
| Dissipation Factor | 0.0010 | - | 23˚C @ 50% RH | 10 GHz | IPC TM-650 2.5.5.5 |
| Dielectric Constant (design) | 2.93 | - | C-24/23/50 | 10 GHz | Microstrip Differential Phase Length |
| Thermal Coefficient of Dielectric Constant | -8 | ppm/˚C | -50°C to 150°C | 10 GHz | IPC TM-650 2.5.5.5 |
| Volume Resistivity | 4.25x10⁸ | Mohm-cm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Surface Resistivity | 2.49x10⁸ | Mohm | C-96/35/90 | - | IPC TM-650 2.5.17.1 |
| Electrical Strength (dielectric strength) | 1000 | V/mil | - | - | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | 58 | kV | D-48/50 | X/Y direc- tion | IPC TM-650 2.5.6 |
| PIM (For antenna only) | - | dBc | - | 50 ohm 0.060" |
43dBm 1900 MHz |
| Thermal Properties | |||||
| Decomposition Temperature (Td) | 539 | ˚C | 2hrs @ 105˚C | 5% Weight Loss | IPC TM-650 2.3.40 |
| Coefficient of Thermal Expansion - x | 12.7 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - y | 13.7 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Coefficient of Thermal Expansion - z | 40.8 | ppm/˚C | - | -55˚C to 288˚C | IPC TM-650 2.4.41 |
| Thermal Conductivity | 0.56 | W/(m.K) | - | z direction | ASTM D5470 |
| Time to Delamination | >60 | minutes | as-received | 288˚C | IPC TM-650 2.4.24.1 |
| Mechanical Properties | |||||
| Copper Peel Strength after Thermal Stress | 1.7 (9) |
N/mm (lbs/ in) | 10s @288˚C | 35 μm foil | IPC TM-650 2.4.8 |
| Flexural Strength (MD, CMD) | 40.7, 40.0 (5.9, 5.8) |
MPa (ksi ) | 25˚C 3˚C | - | ASTM D790 |
| Tensile Strength (MD, CMD) | 29.0, 25.5 (4.2, 3.7) |
MPa (ksi ) | 23C/50RH | - | ASTM D638 |
| Flex Modulus (MD. CMD) | 3247, 3261 (471, 473) |
MPa (ksi ) | 25C 3C | - | ASTM D790 |
| Dimensional Stability (MD, CMD) | -0.37, -0.67 | mm/m | 4 hr at 105˚C | - | IPC-TM-650 2.4.39a |
| Physical Properties | |||||
| Flammability | V-0 | - | - | C48/23/50 & C168/70 | UL 94 |
| Moisture Absorption | 0.02 | % | E1/105+D24/23 | - | IPC TM-650 2.6.2.1 |
| Density | 2.17 | g/cm³ | C-24/23/50 | - | ASTM D792 |
| Specifc Heat Capacity | 0.61 | J/g˚K | 2 hours at 105˚C | - | ASTM E2716 |
| NASA Outgassing | 0.02 / 0.00 | % | TML/CVCM | ASTM E595 | |
Contact Person: Miss. Sally Mao
Tel: 86-755-27374847
Fax: 86-755-27374947
