Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Rogers RT/duroid 6002 Substrate - 40mil (1.016mm) 2-layer rigid PCB Microwave Material

Rogers RT/duroid 6002 Substrate - 40mil (1.016mm) 2-layer rigid PCB Microwave Material

  • Rogers RT/duroid 6002 Substrate - 40mil (1.016mm) 2-layer rigid PCB Microwave Material
  • Rogers RT/duroid 6002 Substrate - 40mil (1.016mm) 2-layer rigid PCB Microwave Material
Rogers RT/duroid 6002 Substrate - 40mil (1.016mm) 2-layer rigid PCB Microwave Material
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise
Certification: UL
Model Number: BIC-288-V2.88
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-9.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 1 Board Material: Polyimide 25µm
Surface Cu Thickness: 1.0 Board Thickness: 0.15 Mm +/-10%
Surface Finish: Immersion Gold Solder Mask Color: Yellow
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

Introducing RT/duroid 6002: A High-Performance Microwave Material


RT/duroid 6002 laminates, introduced by Rogers, are characterized as ceramic-filled PTFE microwave materials known for their low dielectric constant and excellent high-frequency performance in complex microwave structures. They are recognized for their low loss properties and are widely used in multi-layer board constructions due to their reliable mechanical and electrical properties.


Key Features of RT/duroid 6002:

  1. A dielectric constant (Dk) of 2.94 +/- .04, ensuring consistent signal propagation.
  2. A low thermal coefficient of Dk at 12 ppm/°C, resulting in minimal changes in dielectric constant with temperature fluctuations.
  3. A dissipation factor of .0012 at 10GHz, showcasing extremely low loss and excellent high-frequency performance.
  4. Td 500 °C TGA, allowing the laminates to withstand high temperatures without significant degradation.
  5. A thermal conductivity of 0.6 W/m/k, facilitating efficient heat dissipation.
  6. A low Z-axis coefficient of thermal expansion at 24 ppm/°C, closely matched to copper, ensuring dimensional stability and reducing mechanical stress.
  7. A moisture absorption of 0.02%, enhancing overall performance and durability.
PCB Construction Details  
Board Dimensions 53.19mm x 69.23mm (1PCS)
Minimum Trace/Space 5/7 mils
Minimum Hole Size 0.4mm
Blind Vias None
Finished Board Thickness 1.1mm
Finished Copper Weight 1 oz (1.4 mils) outer layers
Via Plating Thickness 20 μm
Surface Finish Immersion Gold
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask No
Bottom Solder Mask No
Electrical Test 100% conducted prior to shipment

Benefits of RT/duroid 6002:

  1. Excellent high-frequency performance due to low loss.
  2. Precise thickness control, ensuring accuracy and reliability.
  3. In-plane expansion coefficient matched to copper, making it suitable for temperature-sensitive applications.
  4. Low out-gassing, making it ideal for space applications.
  5. Excellent dimensional stability.
  6. Outstanding mechanical and electrical properties, enabling reliable multi-layer board constructions.

However, it's important to consider the following limitations of RT/duroid 6002 laminates:

  1. Limited availability of thickness options: RT/duroid 6002 laminates may have limited choices in terms of thickness options. This can restrict the design flexibility for certain applications that require specific thickness specifications.
  2. Higher cost compared to other materials: Due to their specialized properties and performance, RT/duroid 6002 laminates can be relatively more expensive compared to alternative materials. This higher cost may impact the overall budget of a project.
  3. Complexity in processing: The ceramic-filled PTFE composition of RT/duroid 6002 laminates can make them more challenging to process compared to other materials. Special care and expertise may be required during manufacturing, fabrication, and assembly processes.
  4. Limited suitability for high-power applications: While RT/duroid 6002 laminates excel in high-frequency performance and low loss, they may have limitations when it comes to high-power applications. The material's thermal conductivity and power handling capabilities may not be as robust as some alternative materials designed specifically for high-power applications.
  5. Sensitivity to moisture: Although RT/duroid 6002 laminates have low moisture absorption, they can still be sensitive to moisture in certain environments. Proper precautions and moisture control measures should be taken to ensure optimal performance and avoid potential issues.


Nevertheless, with their exceptional electrical properties, dimensional stability, and reliable performance, RT/duroid 6002 laminates are extensively utilized in a variety of high-frequency applications, ensuring optimal signal integrity and functionality. When considering their usage, it's crucial to weigh the benefits against the associated limitations and determine their suitability for the specific requirements of your project.

Rogers RT/duroid 6002 Substrate - 40mil (1.016mm) 2-layer rigid PCB Microwave Material 0
Rogers RT/duroid 6002 Substrate - 40mil (1.016mm) 2-layer rigid PCB Microwave Material 1

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
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