Rogers TMM4 PCB with High-Frequency Capability and Thermal Stability substrate (TMM4) - 0.508 mm (20mil) Immersion Gold

Unveiling PCB Specifications and Materials: Exploring Rogers TMM4

In the ever-evolving landscape of technology, printed circuit boards (PCBs) serve as the backbone of electronic devices. This blog post aims to delve into the specifications and materials employed in a specific PCB, shedding light on the fascinating utilization of Rogers TMM4 hydrocarbon ceramic thermoset polymer composites.

1. PCB Material: Rogers TMM4 Hydrocarbon Ceramic Thermoset Polymer Composites
The heart of the PCB lies in Rogers TMM4, an exceptional material celebrated for its remarkable electrical properties. Let's explore its defining traits:

• Process DK 4.5 at 10 GHz/23°C: This parameter determines the material's dielectric constant, crucial for high-frequency applications.
• Dissipation Factor: With a mere value of 0.002 at 10 GHz/23°C, the material ensures minimal loss of signal integrity.
• Thermal Stability: Boasting a Td value of 425°C, Rogers TMM4 maintains its structural integrity even at elevated temperatures.
• Temperature Range: The PCB thrives in environments ranging from -40℃ to +85℃, guaranteeing reliable performance across diverse conditions.

2. Stackup: 2-Layer Rigid PCB
The PCB configuration consists of two copper layers separated by a resilient Rogers TMM4 substrate. Take note of the following details:

• Copper Layer 1: A thickness of 35 μm signifies the first layer's conductivity and integrity.
• Substrate (TMM4): With a thickness of 0.508 mm (20 mil), the Rogers TMM4 substrate provides stability and support.
• Copper Layer 2: Another layer of 35 μm copper ensures the efficient flow of current.

3. Construction Details:
This section provides insights into various specifications encompassing the PCB's dimensions, manufacturing processes, and finishes:

• Board Dimensions: The PCB boasts a compact form factor, measuring 94mm x 90mm with an impressive accuracy of +/- 0.15mm.
• Trace/Space and Hole Size: For seamless routing, a minimum trace/space of 5/5 mils is maintained, complemented by a minimum hole size of 0.4mm.
• Vias: A total of 96 vias are meticulously incorporated, facilitating seamless interconnection between layers.
• Surface Finish: The PCB flaunts an immersion gold surface finish, enhancing solderability and guarding against corrosion.
• Silkscreen and Solder Mask: While the top side omits silkscreen, the bottom side lacks both silkscreen and solder mask. The top solder mask is visually captivating in green.
• Electrical Testing: Ensuring impeccable functionality, each PCB undergoes a thorough 100% electrical test before shipment.

4. PCB Statistics:
This section sheds light on various statistical aspects of the PCB:

• Components: Accommodating a total of 57 components, the PCB demonstrates its ability to support complex electronic systems.
• Total Pads: With 112 pads in place, including 76 through-hole pads, 31 top surface mount technology (SMT) pads, and 5 bottom SMT pads, the PCB offers ample connectivity options.
• Nets: The PCB proudly boasts 7 interconnected nets, facilitating seamless signal routing.

5. Artwork and Standards:

The PCB artwork adheres to the widely accepted Gerber RS-274-X format, a standard embraced by the industry. It meticulously aligns with the renowned IPC-Class-2 standard, guaranteeing manufacturing excellence.

6. Availability:
From every corner of the globe, the discussed PCB, along with the exceptional Rogers TMM4 material, is readily available. For any technical inquiries or further information, feel free to reach out to Sally Mao at sales@bichengpcb.com.

This blog post has unveiled the inner workings of a PCB that harnesses the powerful capabilities of Rogers TMM4 hydrocarbon ceramic thermoset polymer composites. By delving into its material characteristics, construction details, and compliance with industry standards, we gain a profound understanding of the PCB's capabilities and specifications. Armed with this knowledge, we can forge ahead in the development and implementation of reliable electronic systems across diverse industries.