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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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Polyimide Tg250 ℃ High Temperature High Frequency Material Lead-free process and Immersion Gold (ENIG)

Polyimide Tg250 ℃ High Temperature High Frequency Material Lead-free process and Immersion Gold (ENIG)

  • Polyimide Tg250 ℃ High Temperature High Frequency Material Lead-free process and Immersion Gold (ENIG)
  • Polyimide Tg250 ℃ High Temperature High Frequency Material Lead-free process and Immersion Gold (ENIG)
Polyimide Tg250 ℃ High Temperature High Frequency Material Lead-free process and Immersion Gold (ENIG)
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0580-V5.80
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD20~30
Packaging Details: Vacuum
Delivery Time: 4-5 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Contact Now
Detailed Product Description
Thermal Conductivity: 1W/MK Dielectric Material, MCPCB Final Height Of PCB: 1.6mm ±0.16
Final Foil External: 1 Oz Surface Finish: Electroless Nickel Over Immersion Gold (ENIG)( 1 µ" Over 100 µ" Nickel)
Solder Mask Color: White,PSR400 WT02 Colour Of Component Legend: No Silkscreen Required
TEST: 100% Electrical Test Prior Shipment

A Comprehensive Guide on High-Temperature PCBs with Polyimide Tg250 ℃ Material

 

Polyimide Tg250 ℃ High Temperature High Frequency Material is a type of polyimide material that is designed to withstand extreme temperatures and high frequencies. It is commonly used in the manufacturing of printed circuit boards (PCBs) for applications that require high-temperature and high-frequency performance, such as aerospace, automotive, and industrial applications.

 

The "Tg" in Polyimide Tg250 ℃ Material stands for glass transition temperature, which is the temperature at which the material undergoes a transition from a hard, glassy state to a soft, rubbery state. Polyimide Tg250 ℃ Material has a high glass transition temperature of 250 ℃, which means that it can maintain its mechanical and electrical properties even at high temperatures.

 

Polyimide Tg250 ℃ Material also has excellent thermal stability, which makes it an ideal choice for high-temperature applications. It has a low coefficient of thermal expansion, which means that it can maintain its shape and size even when exposed to extreme temperatures. This makes it an excellent choice for applications where dimensional stability is critical, such as in aerospace and automotive applications.

 

In addition to its high-temperature properties, Polyimide Tg250 ℃ Material is also an excellent choice for high-frequency applications. It has a low dielectric constant and a low dissipation factor, which means that it can maintain its electrical properties even at high frequencies. This makes it an excellent choice for applications where high-frequency performance is critical, such as in telecommunications and wireless applications.

 

Polyimide Tg250 ℃ Material can be used to manufacture multilayer PCBs, which are PCBs with multiple layers of copper and insulating material. It can also be used to manufacture through-hole vias, which are used to connect different layers of the PCB. The PCBs are typically manufactured using a lead-free process to ensure that they are environmentally friendly.

 

In terms of design considerations, when designing high-temperature PCBs with Polyimide Tg250 ℃ Material, it is important to consider the material's thermal expansion coefficient and its effect on the PCB's reliability and performance. It is also important to consider the PCB's layout and the placement of components to ensure that they are not affected by thermal stress.

 

Overall, Polyimide Tg250 ℃ High Temperature High Frequency Material is an excellent choice for high-temperature and high-frequency applications. Its excellent thermal stability and electrical properties make it ideal for use in a wide range of applications, and its cost-effectiveness makes it a popular choice for manufacturers looking to improve the performance of their PCBs.

 

Understanding the Benefits of Polyimide Tg250 ℃ High Temperature High Frequency Material for PCBs

------Upgrade your PCB designs with our Polyimide Tg250 ℃ Material

 

Polyimide Tg250 ℃ High Temperature High Frequency Material is a game-changer for high-temperature and high-frequency printed circuit boards (PCBs). In this article, we will explore the benefits of using Polyimide Tg250 ℃ Material in PCBs and how it can improve the performance of your high-temperature and high-frequency applications.

 

Advantages of Polyimide Tg250 ℃ Material for High-Temperature PCBs:

Polyimide Tg250 ℃ Material is a high-temperature material that can withstand extreme temperatures of up to 250 ℃. This makes it ideal for use in high-temperature applications such as aerospace, automotive, and industrial applications. It has excellent thermal stability, which means it can maintain its mechanical and electrical properties even at high temperatures.

 

Applications of Polyimide Tg250 ℃ Material in High-Frequency PCBs:

Polyimide Tg250 ℃ Material is also an excellent choice for high-frequency applications. It has a low dielectric constant and a low dissipation factor, which makes it ideal for high-frequency PCBs. It also has good dimensional stability, which ensures that the PCBs maintain their shape and size even at high frequencies.

 

Design Considerations for High-Temperature PCBs with Polyimide Tg250 ℃ Material:

When designing high-temperature PCBs with Polyimide Tg250 ℃ Material, it is important to consider the material's thermal expansion coefficient and its effect on the PCB's reliability and performance. It is also important to consider the PCB's layout and the placement of components to ensure that they are not affected by thermal stress.

 

Manufacturing Process of High-Temperature PCBs with Polyimide Tg250 ℃ Material:

The manufacturing process of high-temperature PCBs with Polyimide Tg250 ℃ Material is similar to that of other PCBs. However, it requires special handling and processing due to the material's high-temperature properties. The PCBs are manufactured using a lead-free process to ensure that they are environmentally friendly.

 

Quality Control and Testing of High-Temperature PCBs with Polyimide Tg250 ℃ Material:

High-temperature PCBs with Polyimide Tg250 ℃ Material undergo rigorous quality control and testing to ensure that they meet the highest standards of quality and performance. They are tested for their electrical properties, thermal properties, and mechanical properties to ensure that they can withstand extreme temperatures and high frequencies.

 

Comparison of Polyimide Tg250 ℃ Material with Other High-Temperature Materials:

Polyimide Tg250 ℃ Material is superior to other high-temperature materials such as FR-4 and Ceramic in terms of its thermal stability and mechanical properties. It is also more cost-effective than Ceramic, making it an ideal choice for high-temperature and high-frequency PCBs.

 

Limitations of Polyimide Tg250 ℃ Material for High-Temperature PCBs:

Although Polyimide Tg250 ℃ Material has many advantages, it also has some limitations. It is not suitable for applications that require impedance matching, and it is not recommended for applications that require high-voltage and high-current handling.

 

Future Developments in High-Temperature PCBs with Polyimide Tg250 ℃ Material:

Polyimide Tg250 ℃ Material is a rapidly evolving technology, and there are ongoing developments in its applications and manufacturing processes. Future developments may include improvements in its electrical properties, thermal properties, and mechanical properties.

 

Conclusion:

Polyimide Tg250 ℃ Material is an excellent choice for high-temperature and high-frequency PCBs

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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