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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Rogers RO4730G3 2-layer rigid PCB Hydrocarbon / Ceramic / Woven Glass UL 94 V-0 Antenna Grade Laminates

Rogers RO4730G3 2-layer rigid PCB Hydrocarbon / Ceramic / Woven Glass UL 94 V-0 Antenna Grade Laminates

  • Rogers RO4730G3 2-layer rigid PCB  Hydrocarbon / Ceramic / Woven Glass UL 94 V-0 Antenna Grade Laminates
  • Rogers RO4730G3 2-layer rigid PCB  Hydrocarbon / Ceramic / Woven Glass UL 94 V-0 Antenna Grade Laminates
Rogers RO4730G3 2-layer rigid PCB  Hydrocarbon / Ceramic / Woven Glass UL 94 V-0 Antenna Grade Laminates
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0305-V3.05
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-7.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: Polyimide 25μm + 0.3mm Stiffener Of FR-4 Board Thickness: 0.20 Mm
Surface/Inner Layer Cu Thickness: 35 µm Surface Finish: Immersion Gold
Coverlay Colour: Yellow Color Of Silkscreen: White
Function: 100% Pass Electrical Test Number Of Layers: 2

The PCB material comprises Rogers RO4730G3 Hydrocarbon/Ceramic/Woven Glass UL 94 V-0 Antenna Grade Laminates, ensuring excellent signal integrity with a process DK of 3.0 at 10 GHz/23°C and a dissipation factor of 0.0028 at 10 GHz/23°C. Operable within a temperature range of -40℃ to +85℃ and possessing a Tg greater than 280°C and Td of 411°C, it exhibits resilience in challenging environments.

 

The stackup consists of two layers: Copper Layer 1, featuring a thickness of 35 μm, the RO4730G3 substrate with a measurement of 0.508 mm (20mil), and Copper Layer 2, with a thickness of 35 μm. This configuration establishes a solid foundation for circuitry, ensuring optimal performance.

 

Ample space for component placement and precise routing is provided by board dimensions of 136.61mm x 96.7mm (±0.15mm). Intricate and detailed designs are supported with a minimum trace/space of 6/4 mils and a minimum hole size of 0.5mm. The manufacturing process is simplified as blind vias are not included.

 

With a finished board thickness of 0.63mm, this PCB is built to last, featuring 1oz (1.4 mils) copper weight on the outer layers. Reliable conductivity and interconnectivity are achieved through a 20 μm via plating thickness. The surface finish, an immersion gold, ensures excellent solderability and corrosion resistance.

 

The absence of top or bottom silkscreen does not compromise the protection and clarity of the vibrant green top and bottom solder masks, which safeguard the PCB layout. Each PCB undergoes a comprehensive 100% electrical test before shipment to guarantee functionality.

 

Versatility and flexibility are offered by this PCB, accommodating various circuit designs with 106 components, 187 total pads, and 192 vias. It adheres to IPC-Class-2 standards, ensuring high-quality manufacturing and compliance with industry specifications.

 

Our newly shipped PCB is available worldwide, serving customers across the globe. For any technical inquiries or questions, please do not hesitate to contact Sally Mao at sales@bichengpcb.com.

 

Experience the reliability and performance of our meticulously crafted high-quality PCBs for your next project. Place your order now and elevate your electronic designs to new heights.

 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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