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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

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Double Layer Taconic RF-30 PCB: Unleashing Superior Performance for RF Applications

Double Layer Taconic RF-30 PCB: Unleashing Superior Performance for RF Applications

  • Double Layer Taconic RF-30 PCB: Unleashing Superior Performance for RF Applications
  • Double Layer Taconic RF-30 PCB: Unleashing Superior Performance for RF Applications
  • Double Layer Taconic RF-30 PCB: Unleashing Superior Performance for RF Applications
  • Double Layer Taconic RF-30 PCB: Unleashing Superior Performance for RF Applications
Double Layer Taconic RF-30 PCB: Unleashing Superior Performance for RF Applications
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0282-V2.82
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-6.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: PET 25µm Board Thickness: 0.15 Mm
Surface/Inner Layer Cu Thickness: 35 µm Surface Finish: Immersion Gold
Coverlay Colour: Transparent Color Of Silkscreen: Yellow
Function: 100% Pass Electrical Test Number Of Layers: 1

Introducing Taconic RF-30: Unleashing Superior Performance for RF Applications

 

When it comes to high-frequency applications, having a reliable and high-performance printed circuit board (PCB) substrate is crucial. Taconic RF-30 PTFE Ceramic-Glass PCB Substrates offer exceptional quality, stability, and performance, making them the ideal choice for a wide range of RF applications. Let's delve into the remarkable features, construction details, specifications, and typical applications of these exceptional PCB substrates.

 

Unmatched Features:

Taconic RF-30 PTFE Ceramic-Glass PCB Substrates boast a range of features that set them apart:

  1. Minimized Passive Intermodulation Distortion: Engineered to reduce signal interference, these substrates ensure optimal signal integrity, minimizing passive intermodulation distortion.
  2. Enhanced Plated Through Hole Quality: These substrates employ superior manufacturing techniques, ensuring excellent quality for plated through holes. This guarantees reliable connections and enhanced signal transmission.
  3. Unyielding Mechanical Stability: Taconic RF-30 substrates maintain their mechanical stability even under challenging conditions, ensuring long-term durability and reliability.
  4. Consistent Performance at High Frequencies: Designed for high-frequency operation, these substrates deliver unwavering performance, making them suitable for demanding RF applications.
  5. Exceptional Thermal Stability: Taconic RF-30 substrates exhibit excellent resistance to elevated temperatures without compromising performance, ensuring reliability even in demanding thermal environments.
  6. Resistant to Moisture-Related Issues: With a moisture absorption rate of merely 0.02%, these substrates are highly resistant to moisture-related problems, ensuring consistent performance over time.
  7. Robust Peel Strength: The substrates boast an impressive peel strength of 10 lbs/in, guaranteeing secure adhesion of components and reliable solder joints.
  8. Outstanding Price/Performance Ratio: Taconic RF-30 substrates offer exceptional performance at a competitive price, providing excellent value for RF PCB applications.

Double Layer Taconic RF-30 PCB: Unleashing Superior Performance for RF Applications 0

 

Construction Details:

The construction of Taconic RF-30 PTFE Ceramic-Glass PCB Substrates is as follows:

  • Stackup: These substrates are designed as 2-layer rigid PCBs with the following layer configuration:
    1. Copper Layer 1: 35 μm
    2. RF-30 Layer: 0.762 mm (30 mil)
    3. Copper Layer 2: 35 μm
  • Board Dimensions: The PCBs have dimensions of 228.99mm x 117.25 mm (1PCS), with a tolerance of +/- 0.15mm.
  • Minimum Trace/Space: The minimum trace width and spacing are 5/6 mils, allowing for precise routing of high-frequency signals.
  • Minimum Hole Size: The minimum hole size supported is 0.3mm, ensuring compatibility with various component types.
  • No Blind Vias: These PCBs do not employ blind vias, simplifying the manufacturing process.
  • Finished Board Thickness: The finished board thickness is 0.8mm, providing a compact and lightweight solution.
  • Finished Cu Weight: The outer layers have a finished copper weight of 1oz (1.4 mils), striking a balance between conductivity and weight.
  • Via Plating Thickness: The vias feature a plating thickness of 20 μm, ensuring reliable electrical connections.
  • Surface Finish: The PCBs are finished with Hot Air Soldering Level (HASL), providing a robust and cost-effective surface coating.
  • Silkscreen and Solder Mask: The top silkscreen color is white, allowing for clear component labeling. The top solder mask is green, providing protection and insulation.
  • Electrical Test: Each PCB undergoes a 100% electrical test before shipment to ensure quality and reliability.

 

Specifications:
Taconic RF-30 PTFE Ceramic-Glass PCB Substrates exhibit the following specifications:

  1. DK (Dielectric Constant): 3.0 +/- 0.1 at 1.9 GHz/23°C.
  2. Dissipation Factor: 0.0014 at 1.9 GHz/23°C, ensuring minimal signal loss.
  3. Peel Strength: 10 lbs/in, providing strong adhesion for components.
  4. Moisture Absorption: 0.02%, offering excellent moisture resistance.
  5. CTE (Coefficient of Thermal Expansion): X-axis: 11 ppm/°C, Y-axis: 21 ppm/°C, Z-axis: 208 ppm/°C.

 

Typical Applications:

  • Taconic RF-30 PTFE Ceramic-Glass PCB Substrates find extensive applications in various RF fields, including:
  • Antenna and Subcomponents: These substrates facilitate the construction of high-performance antennas and related RF components, ensuring optimal signal transmission and reception.
  • RF Passive Components: Taconic RF-30 substrates provide a stable platform for RF passive components like filters, couplers, and baluns,ensuring reliable performance in demanding RF circuits.
  • High-Frequency Amplifiers: These substrates are ideal for building high-frequency amplifiers that demand low signal loss and consistent performance across a wide frequency range.
  • Radar Systems: Taconic RF-30 substrates excel in radar systems, where precise signal transmission and reception are critical for accurate detection and imaging.
  • Wireless Communication Systems: These substrates are commonly used in wireless communication systems, such as cellular base stations, where high-frequency signal integrity is essential for efficient data transmission.
  • Satellite Communication Systems: Taconic RF-30 substrates are well-suited for satellite communication systems, providing excellent electrical performance and reliability in the harsh space environment.
  • Automotive Radar: With their stable mechanical properties and high-frequency capabilities, these substrates find applications in automotive radar systems, ensuring accurate object detection and collision avoidance.
  • Aerospace and Defense Electronics: Taconic RF-30 PCB substrates are employed in various aerospace and defense electronic systems, including radar systems, communication equipment, and electronic warfare systems.

Please note that while Taconic RF-30 PTFE Ceramic-Glass PCB Substrates offer exceptional performance for RF applications, it's always important to consult the manufacturer's datasheet and application guidelines to ensure they meet the specific requirements of your project.

 

 

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Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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