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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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RO3003G2 High Frequency PCB Double Layer 10mil,20mil,50mil with Immersion Gold ,HASL

RO3003G2 High Frequency PCB Double Layer 10mil,20mil,50mil with Immersion Gold ,HASL

  • RO3003G2 High Frequency PCB Double Layer 10mil,20mil,50mil with Immersion Gold ,HASL
  • RO3003G2 High Frequency PCB Double Layer 10mil,20mil,50mil with Immersion Gold ,HASL
RO3003G2 High Frequency PCB Double Layer 10mil,20mil,50mil with Immersion Gold ,HASL
Product Details:
Place of Origin: China
Brand Name: Bicheng Enterprise
Certification: UL
Model Number: BIC-299-V2.99
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 2.99-9.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 1 Board Material: Polyimide (PI) 25um
Surface Cu Thickness: 1.0 Board Thickness: 0.15 Mm +/-10%
Surface Finish: Immersion Gold Solder Mask Color: Yellow
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

RO3003G2 High Frequency PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

Material Introduction

The high-frequency, ceramic-filled PTFE laminates of Rogers RO3003G2 are an extension of Rogers' industry-leading RO3003 solutions. The development of RO3003G2 laminates is based on industry feedback, with a special focus on addressing the next generation needs for millimeter wave automotive radar applications.

 

The incorporation of an optimized resin and filler content, along with the utilization of Very Low Profile ED copper provides a reduced insertion loss. This characteristic makes RO3003G2 laminates well-suited for implementation in Advanced Driver Assistance Systems (ADAS) such as adaptive cruise control, forward collision warning, active braking, and lane change assist.

 

Features

1. The dielectric constant of 3.00 at 10 GHz and 3.07 at 77 GHz.

  • Very Low Profile (VLP) ED copper.
  • Homogeneous construction incorporating VLP ED copper and reduced dielectric porosity.
  • Enhanced filler system.

 

Benefits

1. Best-in-class performance for insertion loss.

  • Minimize variation in dielectric constant in the finished PCB.
  • Enable the trend towards using smaller diameter vias; Enhanced filler system using small rounded particles
  • Global manufacturing footprint.

 

RO3003G2 High Frequency PCB Double Layer 10mil,20mil,50mil with Immersion Gold ,HASL 0

 

Our PCB Capability (RO3003G2 laminates)

PCB Capability (RO3003G2)
PCB Material: Ceramic-filled PTFE Laminates
Designation: RO3003G2
Dielectric constant: 3
Dissipation factor 0.0011
Layer count: Single Sided, Double Sided, Multi-layer PCB, Hybrid PCB
Copper weight: 1oz (35µm), 2oz (70µm)
Dielectric thickness 5mil (0.127mm), 10mil (0.254mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Immersion gold, HASL, Immersion silver, Immersion tin, ENEPIG, OSP, Bare copper, Pure gold etc..

 

Typical Applications

1. Adaptive cruise control

  • Forward collision warning
  • Active brake assist
  • Lane change assist
  • Traffic jam pilot
  • Parking pilot
  • Blind spot detection

RO3003G2 High Frequency PCB Double Layer 10mil,20mil,50mil with Immersion Gold ,HASL 1

 

RO3003G2s Data Sheet

PROPERTY RO3003G2 Direction Unit condition Test Method
Dielectric Constant, er Process 3.00 ± 0.04 Z - 10 GHz 23°C IPC-TM-650
2.5.5.5
Clamped Stripline
Dielectric Constant, er Design 3.07 Z - 77 GHZ Differential Phase
Length Method
Dissipation Factor, tan d 0.0011 Z - 10 GHz 23°C IPC-TM-650
2.5.5.5
Thermal Coefficient of er -35 Z ppm/°C 10 GHz
-50 to 150°C
IPC-TM-650
2.5.5.5
Dimensional Stability -0.16
-0.14
X
Y
mm/m Method C IPC TM-650 2.2.4
Volume Resistivity 1.4 x 10^9 - MΩ•cm COND A IPC 2.5.17.1
Surface Resistivity 2.6 x 10 - COND A IPC 2.5.17.1
Tensile Modulus 378
396
X
Y
ksi 23°C ASTM D638
Moisture Absorption 0.06 - % D48/50 IPC-TM-650
2.6.2.1
Specific Heat 0.73
0.83
Z J/g/K 0°C
50°C
ASTM E1269-11
Thermal Conductivity 0.43 Z W/m/K 50°C ASTM D5470
Coefficient of Thermal Expansion 16
17
18
X
Y
Z
ppm/°C 23°C/50% RH IPC-TM-650 2.4.41
Td 500 - °CTGA - ASTM D3850
Density 2.15 - gm/cm3 23°C ASTM D792
Copper Peel Strength 12.0 - lb/in 1/2 oz. EDC
After Solder Float
IPC-TM-2.4.8
Flammability V-0 - - - UL 94
Lead Free Process Compatible YES - - - -

 

RO3003G2 High Frequency PCB Double Layer 10mil,20mil,50mil with Immersion Gold ,HASL 2

 

 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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