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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

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40mil AD255C 2-layer rigid PCB Woven Glass Reinforced PTFE DK 2.55 NiAu

40mil AD255C 2-layer rigid PCB Woven Glass Reinforced PTFE DK 2.55 NiAu

  • 40mil AD255C 2-layer rigid PCB Woven Glass Reinforced PTFE  DK 2.55 NiAu
  • 40mil AD255C 2-layer rigid PCB Woven Glass Reinforced PTFE  DK 2.55 NiAu
  • 40mil AD255C 2-layer rigid PCB Woven Glass Reinforced PTFE  DK 2.55 NiAu
40mil AD255C 2-layer rigid PCB Woven Glass Reinforced PTFE  DK 2.55 NiAu
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-258-V3.98
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Contact Now
Detailed Product Description
Board Material: Polyimide 25µm 60℃ Board Thickness: 0.20mm
Surface Cu Thickness: 35 µm Coverlay Colour: Yellow
Color Of Silkscreen: White Surface Finish: Immersion Gold
Function: 100% Pass Electrical Test

Announcing Our Latest High-Performance Circuit Boards

 

We're thrilled to share that we've recently fabricated a pair of cutting-edge printed circuit assemblies designed for reliability in extreme operating environments.

 

Crafted from an advanced AD255C substrate providing exceptional signal integrity up to 6GHz, even at temperatures spanning -40°C to 85°C, these dual-layer boards feature The substrate's low-loss dielectric properties are due to its woven glass-reinforced PTFE construction.

 

With specifications such as 78.58mm × 60.16mm dimensions, 3/4 mil minimum tracings and vias as small as 0.3mm, these boards push the limits of miniaturized component placement and routing density. Their 1.14mm stiffness is fortified by a full ounce of copper cladding both internally and externally, with protected interconnects thanks to immersion gold surfacing.

 

Specification Value
Board Dimensions 78.58mm x 60.16mm=2 Types=2 PCS, +/- 0.15mm
Minimum Trace/Space 3/4 mils
Minimum Hole Size 0.3mm
Blind/Buried Vias No
Finished Board Thickness 1.14mm
Finished Cu Weight (all layers) 1 oz (1.4 mils)
Via Plating Thickness 1 mil
Surface Finish Immersion Gold
Top Silkscreen No
Bottom Silkscreen No
Top Solder Mask Green
Bottom Solder Mask No

 

Housing a mere 27 discrete parts connected through 41 total terminals, the efficient designs leverage only 31 intermediary vias to service 3 unique circuits - a testament to expert engineering.

 

Adhering faithfully to IPC standards from the client's Gerber files through production, our skilled artisans ensured total electrical integrity under strenuous validation testing.

 

If you have any other inquiries, please be in touch with Sally Mao to discuss how we might help advance your cutting-edge projects. We look forward to future collaborations for pushing technological boundaries.

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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