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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters

Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters

  • Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters
  • Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters
Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-125-V01
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 50000 pieces per month
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Detailed Product Description
Number Of Layers: 2 Glass Epoxy: RT/duroid 6035HTC
Final Foil: 1.0 Oz Final Height Of PCB: 0.3 Mm ±10%
Surface Finish: Electroless Nickel Over Immersion Gold (ENIG)( 1 µ" Over 100 µ" Nickel) Solder Mask Color: NO
Colour Of Component Legend: NO Test: 100% Electrical Test Prior Shipment

Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

RT/duroid 6035HTC high frequency circuit materials of Rogers Corporation are ceramic filled PTFE composites for use in high power RF and microwave applications. With a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and

copper foil (electrodeposited and reverse treat) with excellent long term thermal stability, RT/duroid 6035HTC laminates are an exceptional choice for high power applications.

 

Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters 0

 

Features/Benefits:

1. High Thermal conductivity

Improved dielectric heat dissipation enables lower operating temperatures for high power applications

  • Low loss tangent

Excellent high frequency performance

  • Thermally stable low profile and reverse treat copper foil

Lower insertion loss and excellent thermal stability of traces

  • Advanced filler system

Improved drill ability and extended tool life compared to alumina containing circuit materials

 

Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters 1

 

Some Typical Applications:

1. High Power RF and Microwave Amplifiers

2. Power amplifiers, Couplers, Filters

3. Combiners, Power Dividers

 

PCB Capability (RT/duroid 6035HTC)

PCB Material: Ceramic-filled PTFE composites
Designation: RT/duroid 6035HTC
Dielectric constant: 3.50±0.05
Layer count: Double Layer, Multilayer, Hybrid PCB
Copper weight: 0.5oz (17 µm), 1oz (35µm), 2oz (70µm)
PCB thickness: 10mil (0.254mm), 20mil(0.508mm), 30mil (0.762mm), 60mil(1.524mm)
PCB size: ≤400mm X 500mm
Solder mask: Green, Black, Blue, Yellow, Red etc.
Surface finish: Bare copper, HASL, ENIG, OSP etc..

 

Data Sheet of RT/duroid 6035HTC

Property RT/duorid 6035HTC Direction Units Condition Test Method
Dielectric Constant,εProcess 3.50±0.05 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5 Clamped Stripline
Dielectric Constant,εDesign 3.6 Z   8 GHz - 40 GHz Differential Phase Length Method
Dissipation Factor 0.0013 Z   10 GHz/23℃ IPC-TM-650 2.5.5.5
Thermal Coefficient of ε -66 Z ppm/℃ -50 ℃to 150℃ mod IPC-TM-650, 2.5.5.5
Volume Resistivity 108   MΩ.cm A IPC-TM-650, 2.5.17.1
Surface Resistivity 108   A IPC-TM-650, 2.5.17.1
Dimensional Stability -0.11 -0.08 CMD MD mm/m (mils/inch) 0.030" 1oz EDC foil Thickness after etch '+E4/105 IPC-TM-650 2.4.39A
Tensile Modulus 329 244 MD CMD kpsi 40 hrs @23℃/50RH ASTM D638
Moisure Absorption 0.06   % D24/23 IPC-TM-650 2.6.2.1 ASTM D570
Coefficient of Thermal Expansion (-50 ℃to 288 ℃) 19 19 39 X Y Z ppm/℃ 23℃ / 50% RH IPC-TM-650 2.4.41
Thermal Conductivity 1.44   W/m/k 80℃ ASTM C518
Density 2.2   gm/cm3 23℃ ASTM D792
Copper Peel Stength 7.9   pli 20 sec. @288 ℃ IPC-TM-650 2.4.8
Flammability V-0       UL 94
Lead-Free Process Compatible Yes        

 

Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters 2

 
Rogers RT/duroid 6035 High Frequency PCB Built on 10mil Core With Immersion Gold for Filters 3
 
 
 

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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