6 Layer High Frequency PCB Built On 3 Cores of 20mil RO4003C and 4mil RO4450F for Radar Altimeter

6 Layer High Frequency PCB Built On 3 Cores of 20mil RO4003C and 4mil RO4450F for Radar Altimeter

(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

Hello everyone.

Warm greetings!

Today we talked about is a type of 6 layers high frequency PCB. It’s built on 3 core of 20mil RO4003C with bondply RO4450F for the application of radar altimeter. The stack-up is as follows.

As is known to all, there’re 6 cores in RO4003C family, i.e. 8mil (0.203mm) to 60mil (1.524mm).

So it’s very interesting that stack-up of 4 layers can be done in many different ways.

Following is the basic specifications.

Base material: RO4003C 0.508 mm x 3 sheets, RO4450F 0.102mm x 1 sheet

Layer count: 6 layers

Type: 1 PCB up per panel with v-cut

Format: 129mm x 75mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm/ Inner layer 35 μm

Solder mask / Legend: Green / White

Final PCB height: 1.94 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

Features and benefits

1) RO4003C exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;

2) Reducing signal loss in high frequency application meets the development needs of communication technology;

3) UL, ISO14001, IATF16949 certified factory;

4) 16000 square meter workshop;

5) More than 18 years of PCB experience;

Applications

Satellite antenna, Power splitter, Radio frequency, Power divider

PCB Data Sheet