RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203
TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350
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| Place of Origin: | China |
| Brand Name: | Bicheng Technologies Limited |
| Certification: | UL |
| Model Number: | BIC-0188-V1.08 |
| Minimum Order Quantity: | 1 |
|---|---|
| Price: | USD 9.99-99.99 |
| Packaging Details: | Vacuum |
| Delivery Time: | 10 working days |
| Payment Terms: | T/T |
| Supply Ability: | 50000 pieces per month |
| Number Of Layers: | 2 | Glass Epoxy: | RO4534 |
|---|---|---|---|
| Final Foil: | 1 Oz | Final Height Of PCB: | 0.6 Mm ±10% |
| Surface Finish: | Immersion Gold | Solder Mask Color: | Green |
| Colour Of Component Legend: | White | Test: | 100% Electrical Test Prior Shipment |
Rogers RO4534 High Frequency Printed Circuit Board Double Layer 20mil 0.508mm With Immersion Gold
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
This is a type of antenna high frequency PCB which is built on Rogers RO4534 with 20mil substrate, starting 0.5oz copper, finished with 1oz copper. It contains fine lines with 4mil wide and microvias with 0.2mm diameter. The surface finish on pads is immersion gold with 0.05micron gold, green solder mask and white silkscreen legends. It is a double layer board fabricated as per IPC class 2, and every 50 pieces are vacuum-packed for shipment.
PCB Specifications
| PCB SIZE | 88 x 98mm=1up |
| BOARD TYPE | Double sided PCB |
| Number of Layers | 2 layers |
| Surface Mount Components | YES |
| Through Hole Components | NO |
| LAYER STACKUP | copper ------- 17um(0.5 oz)+plate TOP layer |
| Rogers RO4534 0.508mm | |
| copper ------- 17um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil |
| Minimum / Maximum Holes: | 0.2 mm / 3.5 mm |
| Number of Different Holes: | 12 |
| Number of Drill Holes: | 895 |
| Number of Milled Slots: | 2 |
| Number of Internal Cutouts: | 3 |
| Impedance Control: | no |
| Number of Gold finger: | 0 |
| BOARD MATERIAL | |
| Glass Epoxy: | Rogers RO4534 0.508mm |
| Final foil external: | 1.0 oz |
| Final foil internal: | N/A |
| Final height of PCB: | 0.6 mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold, 35% |
| Solder Mask Apply To: | Both Sides |
| Solder Mask Color: | Green |
| Solder Mask Type: | LPI |
| CONTOUR/CUTTING | Routing |
| MARKING | |
| Side of Component Legend | Component Side |
| Colour of Component Legend | White |
| Manufacturer Name or Logo: | N/A |
| VIA | Plated through hole(PTH), minimum size 0.2mm. |
| FLAMIBILITY RATING | 94V-0 |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" |
| Board plating: | 0.0029" |
| Drill tolerance: | 0.002" |
| TEST | 100% Electrical Test prior shipment |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Our PCB Capabilities(2022)
| Parameter | Value |
| Layer Counts | 1-32 |
| Substrate Material | RO4350B, RO4003C, RO4730G3, RO4360G2, RO4533, RO4534, RO4535, RO3003, RO3006, RO3010, RO3035, RO3203, RO3210; RT/Duriod 5880; RT/Duriod 5870, RT/Duriod 6002, RT/Duroid 6010, RT/duroid 6035HTC; TMM3, TMM4, TMM6, TMM10, TMM10i, TMM13i, Kappa 438; TLF-35; RF-35TC, RF-60A, RF-60TC, RF-35A2, RF-45, RF-10, TRF-45; TLX-0, TLX-6, TLX-7, TLX-8; TLX-9, TLY-3, TLY-5; PTFE F4B (DK2.2 DK2.65 DK2.85 DK2.94, DK3.0, DK3.2, DK3.38, DK3.5, DK4.0, DK4.4, DK6.15, DK10.2); AD450, AD600, AD1000, TC350; Nelco N4000, N9350, N9240; FR-4 ( High Tg S1000-2M, TU-872 SLK, TU-768, IT-180A etc.), FR-4 High CTI>600V; Polyimide, PET; Metal Core etc. |
| Maximum Size | Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm |
| Board Outline Tolerance | ±0.0059" (0.15mm) |
| PCB Thickness | 0.0157" - 0.3937" (0.40mm--10.00mm) |
| Thickness Tolerance(T≥0.8mm) | ±8% |
| Thickness Tolerance(t＜0.8mm) | ±10% |
| Insulation Layer Thickness | 0.00295" - 0.1969" (0.075mm--5.00mm) |
| Minimum Track | 0.003" (0.075mm) |
| Minimum Space | 0.003" (0.075mm) |
| Outer Copper Thickness | 35µm--420µm (1oz-12oz) |
| Inner Copper Thickness | 17µm--350µm (0.5oz - 10oz) |
| Drill Hole(Mechanical) | 0.0059" - 0.25" (0.15mm--6.35mm) |
| Finished Hole(Mechanical) | 0.0039"-0.248" (0.10mm--6.30mm) |
| DiameterTolerance(Mechanical) | 0.00295" (0.075mm) |
| Registration (Mechanical) | 0.00197" (0.05mm) |
| Aspect Ratio | 12:1 |
| Solder Mask Type | LPI |
| Min Soldermask Bridge | 0.00315" (0.08mm) |
| Min Soldermask Clearance | 0.00197" (0.05mm) |
| Plug via Diameter | 0.0098" - 0.0236" (0.25mm--0.60mm) |
| Impedance Control Tolerance | ±10% |
| Surface Finish | HASL,HASL LF,ENIG,Immersion Tin,Immersion Silver, OSP, Gold Finger, Pure gold plated etc. |
Our Advantages
1. Wide range of high frequency materials, Rogers, Taconic and Wangling etc;
2. More than 19+ years’ high frequency PCB experience;
3. Strict WIP inspection and monitoring as well as working instruction;
4. 16000㎡ workshop;
5. 30000㎡ output capability per month;
6. 8000 types of PCB's per month;
7. Small quantity order is available;
8. ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
9. IPC Class 2 / IPC Class 3;
10. Delivery on time: >98%, Customer complaint rate: <1%
Appendix: Typical Value of RO4534
| Property | RO4534 | Direction | Units | Condition | Test Method |
| Dielectric Constant, er Process | 3.4 ± 0.08 | Z | - | 10 GHz/23℃ 2.5 GHz | IPC-TM-650,2.5.5.5 |
| Dissipation Factor | 0.0022 | Z | - | 2.5 GHz/23℃ | IPC-TM-650, 2.5.5.5 |
| 0.0027 | 10 GHz/23℃ | ||||
| PIM (Typical) | -157 | - | dBc | Reflected 43 dBm swept tones | Summitek 1900b PIM Analyzer |
| Dielectric Strength | >500 | Z | V/mil | 0.51 mm | IPC-TM-650, 2.5.6.2 |
| Dimensional Stability | <0.3 | X,Y | mm/m (mils/inch) | after etch | IPC-TM-650, 2.4.39A |
| Coefficient of Thermal Expansion | 11 | X | ppm/℃ | -55 to 288℃ | IPC-TM-650, 2.4.41 |
| 14 | Y | ||||
| 46 | Z | ||||
| Thermal Conductivity | 0.6 | - | W/(m.K) | 80℃ | ASTM C518 |
| Moisture Absorption | 0.06 | - | % | D48/50 | IPC-TM-650, 2.6.2.1 ASTM D570 |
| Tg | >280 | - | ℃ TMA | A | IPC-TM-650, 2.4.24.3 |
| Density | 1.8 | - | gm/cm3 | - | ASTM D792 |
| Copper Peel Strength | 6.3 (1.1) | - | lbs/in (N/mm) | 1 oz. EDC post solder float | IPC-TM-650, 2.4.8 |
| Flammability | NON FR | - | - | - | UL 94 |
| Lead-Free Process Compatible | Yes | - | - | - | - |
Contact Person: Miss. Sally Mao
Tel: 86-755-27374847
Fax: 86-755-27374947
