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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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60mil RF-10 High Frequency PCB Double Sided Taconic Microwave PCB Low Loss High DK RF PCBs

60mil RF-10 High Frequency PCB Double Sided Taconic Microwave PCB Low Loss High DK RF PCBs

  • 60mil RF-10 High Frequency PCB Double Sided Taconic Microwave PCB Low Loss High DK RF PCBs
  • 60mil RF-10 High Frequency PCB Double Sided Taconic Microwave PCB Low Loss High DK RF PCBs
60mil RF-10 High Frequency PCB Double Sided Taconic Microwave PCB Low Loss High DK RF PCBs
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-182-V9.9
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 9.99-99.99
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
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Detailed Product Description
Glass Epoxy: RF-10 Final Height Of PCB: 1.6mm ± 10%
Final Foil External: 1 Oz Surface Finish: Immersion Gold (23.3% ) 0.05µm Over 3µm Nickel
Solder Mask Color: Green Colour Of Component Legend: White
Number Of Layers: 2 Test: 100% Electrical Test Prior Shipment

60mil RF-10 High Frequency PCB Double Sided Taconic Microwave PCB Low Loss High DK RF PCBs

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

 

General Description

This type of low loss high DK PCB is built on 60mil RF-10 substrate.It is a double layer build-up with large area of immersion gold and partial green solder mask. Finished copper 1oz are on both sides. The boards are fabricated per IPC 6012 Class 2 using supplied Gerber data. Every 25 boards are packed for shipment.

 

PCB Specifications

PCB SIZE 90 x 100mm=1up
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components NO
LAYER STACKUP copper ------- 17um(0.5 oz)+plate TOP layer
RF-10 1.524mm
copper ------- 17um(0.5 oz) + plate BOT Layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.3 mm / 4.0 mm
Number of Different Holes: 5
Number of Drill Holes: 211
Number of Milled Slots: 5
Number of Internal Cutouts: 3
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RF-10 1.524mm
Final foil external: 1.0 oz
Final foil internal: N/A
Final height of PCB: 1.6 mm ±0.16
PLATING AND COATING  
Surface Finish Immersion Gold, 89%
Solder Mask Apply To: Top layer
Solder Mask Color: Green
Solder Mask Type: LPI
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING 94V-0
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

 

 

 

Typical Applications

1.Aircraft Collision Avoidance Systems

2.GPS Antennas

3.Microstrip Patch Antennas

4.Passive Components (filters, couplers, power dividers)

5.Satellite Components

 

Why choose us?

1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;

2.More than 18+ years’ high frequency PCB experience;

3.Small quantity order is available, no MOQ required;

4.We’re a Team of passion, discipline, responsibility and honesty;

5.Delivery on time: >98%, Customer complaint rate: <1%

6.16000㎡ workshop, 30000㎡ output a month and 8000 types of PCB's a month;

7.Powerful PCB capabilities support your research and development, sales and marketing;

8.IPC Class 2 / IPC Class 3

 

Typical Value of RF-10

Property Test Method Unit Value Unit Value
Dk @ 10 GHz IPC-650 2.5.5.5.1 Mod.   10.2 ± 0.3   10.2 ± 0.3
Df @ 10 GHz IPC-650 2.5.5.5.1 Mod.   0.0025   0.0025
TcK(-55 to 150 °C) IPC-650 2.5.5.6 ppm/°C -370 ppm/°C -370
Moisture Absorption IPC-650 2.6.2.1 % 0.08 % 0.08
Peel Strength (1 oz. RT copper) IPC-650 2.4.8 (solder) lbs/in 10 N/mm 1.7
Volume Resistivity IPC-650 2.5.17.1 Mohm/cm 6.0 x 107 Mohm/cm 6.0 x 107
Surface Resistivity IPC-650 2.5.17.1 Mohm 1.0 x 108 Mohm 1.0 x 108
Flexural Strength (MD) IPC - 650 - 2.4.4 psi 14,000 N/mm2 96.53
Flexural Strength (CD) IPC - 650 - 2.4.4 psi 10,000 N/mm2 68.95
Tensile Strength (MD) IPC - 650 - 2.4.19 psi 8,900 N/mm2 62.57
Tensile Strength (CD) IPC - 650 - 2.4.19 psi 5,300 N/mm2 37.26
Dimensional Stability IPC-650 2.4.39 (After Etch) % (25 mil-MD) -0.0032 % (25 mil-CD) -0.0239
Dimensional Stability IPC-650 2.4.39 (After Bake) % (25 mil-MD) -0.0215 % (25 mil-CD) -0.0529
Dimensional Stability IPC-650 2.4.39 (After Stress) % (25 mil-MD) -0.0301 % (25 mil-CD) -0.0653
Dimensional Stability IPC-650 2.4.39 (After Etch) % (60 mil-MD) -0.0027 % (60 mil-CD) -0.0142
Dimensional Stability IPC-650 2.4.39 (After Bake) % (60 mil-MD) -0.1500 % (60 mil-CD) -0.0326
Dimensional Stability IPC-650 2.4.39 (After Stress) % (60 mil-MD) -0.0167 % (60 mil-CD) -0.0377
Density (Specific Gravity) IPC-650-2.3.5 g/cm3 2.77 g/cm3 2.77
Specific Heat IPC-650-2.4.50 J/g°C 0.9 J/g°C 0.9
Thermal Conductivity (Unclad) IPC-650-2.4.50 W/M*K 0.85 W/M*K 0.85
CTE (X -Y axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 16-20 ppm/°C 16-20
CTE (Z axis) (50 to 150 °C) IPC-650 2.4.41 ppm/°C 25 ppm/°C 25
Flammability Rating Internal   V-0   V-0
60mil RF-10 High Frequency PCB Double Sided Taconic Microwave PCB Low Loss High DK RF PCBs 0

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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