Laser SMT Stencil Made 0.12mm Stainless Steel Foil With 520 X 420mm Aluminum Frame

Product Details:

Place of Origin:	China
Brand Name:	Bicheng Enterprise Limited
Certification:	UL
Model Number:	BIC-951-V5.6

Payment & Shipping Terms:

Minimum Order Quantity:	1
Price:	USD69~110
Packaging Details:	KK carton (hard card)
Delivery Time:	2-3 working days
Payment Terms:	T/T/Paypal
Supply Ability:	45000 pieces per month

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Detailed Product Description

Base Material:	Stainless Steel Shim	Foil Thickness(Optional):	0.12mm
Aperture Configured:	Laser Cut	Appearance:	Engraving And Electro Polishing
Fiducial Mark:	Through Hole	Application:	CSP, BGA, 0.5mm QFP Etc. Package

Product profile

1.1 General description

This is a type of laser cut SMT stencil built on 0.12mm stainless steel foil with

520 mm x 420 mm x 20mm dimension. It’s fabricated per IPC 7525A using

supplied Gerber data, squeegee area locating in the center.Fiducal marks

are through holes to suit for the SMT machine. It’s packed with KK carton

(hard card) and usually 2 stencils are packed for shipment.

1.2 Features and benifits

A. The data file is used directly to produce and reduce the error rate;
B. The opening position accuracy of SMT template is very high: the whole

process error is ≤ ±4 μ m;
C. The opening of SMT template has geometric figure, which is advantageous

to the printing and forming of tin paste;
D. Quick and on-time delivery;
E. Great customer service;
F. Diversified shipping method;
G. No MOQ, low cost for prototypes and small runs quantity;

1.3 Application

SMD package such as PLCC,QFP,0402,0201,BGA,Flip Chip.

1.4 Parameter and data sheet

Dimension:	520 x 420 mm =1 PCS
Structure	Stencil foils with aluminum frame
Base material	Stainless steel shim
Foil Thickness	0.12mm
Aperture configured	Laser cut
Appearance	Engraving and electro polishing
Fiducial mark	Through hole
Service area:	Worldwide
Quantity of open pads:	1254
Advantages:	a) High precision dimension; b) Good shape on the window; c) Hole wall is smoother.
Application:	CSP, BGA, 0.5mm QFP etc. package

1.5 Opening Hole Design for Stencil

Component Type	Pitch	Soldering Width	Soldering Length	Opening Width	Opening Length	Shim Thickness
PLCC	1.27mm	0.65mm	2.00mm	0.60mm	1.95mm	0.15-0.25mm
QFP	0.635mm	0.35mm	1.50mm	0.32mm	1.45mm	0.15-0.18mm
QFP	0.50mm	0.254-0.33mm	1.25mm	0.22-0.25mm	1.20mm	0.12-0.15mm
QFP	0.40mm	0.25mm	1.25mm	0.20mm	1.20mm	0.10-0.12mm
QFP	0.30mm	0.20mm	1.00mm	0.15mm	0.95mm	0.07-0.12mm
0402		0.50mm	0.65mm	0.45mm	0.60mm	0.12-0.15mm
0201		0.25mm	0.40mm	0.23mm	0.35mm	0.07-0.12mm
BGA	1.27mm	0.80mm		0.75mm	0.75mm	0.15-0.20mm
BGA	1.00mm	0.38mm		0.35mm	0.35mm	0.10-0.12mm
BGA	0.50mm	0.30mm		0.28mm	0.28mm	0.07-0.12mm
Flip Chip	0.25mm	0.12mm	0.12mm	0.12mm	0.12mm	0.08-0.10mm
Flip Chip	0.20mm	0.10mm	0.10mm	0.10mm	0.10mm	0.05-0.10mm