BICHENG ENTERPRISE LIMITED

Specialized in heavy copper PCBs for 15 years

High Frequency PCB | Metal Core PCB | Flexible PCB

90%  export | UL, ISO 9001, ISO14001 and TS 16949 certified

 

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High Tg PCB

Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Seba T.

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me:

—— Daniel F

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High Tg PCB

  • High Precision High Tg PCB suppliers
  • High Precision High Tg PCB suppliers
  • High Precision High Tg PCB suppliers
  • High Precision High Tg PCB suppliers
  • High Precision High Tg PCB suppliers

Material Description
Today the workhorse of the PCB fabrication industry is epoxy glass FR-4 grade, a material based on an epoxy resin system.

 

Most Common Type of  Laminate


It begins to soften at a temperature of 130°C (glass transition temperature, Tg) and exhibits a high expansion in the Z-axis direction when heated above the Tg temperature. By modifying the resin, the cross-link density increases so that the Tg increases.The material stability is high so that a high Tg can be desirable. However, when exceeding the Tg, the material properties change more rapidly, a condition that is exaggerated as the Tg becomes higher.

 

Disadvantages of a high Tg are increased drill wear, brittleness and higher laminate costs.

 

Survey of Resin System


Material available
IT-180ATC laminate / IT-180ABS prepreg
S1170 laminate / S0701 prepreg

IT-180A is an advanced high Tg (175℃ by DSC) multifunctional filled epoxy with low CTE, high thermal reliability and CAF resistance. It’s design for high-count layer PCB and can pass 260℃ Lead free assembly and sequential lamination process.

S1170 is a lead-free compatible FR-4 laminate, DSC high Tg 170℃. It has excellent thermal stability and anti-CAF performance, low Z-axis CTE and low water absorption. S0701 is the bonding prepreg for S1170, DSC high Tg 170℃. It has excellent adhesion property and PCB processability.

Available in a various of constructions, copper weights and glass styles, including standard(HTE), RTF and VLP copper foil.

Applications
Multilayer and high layer PCB      Heavy copper applications                Backplanes
Computer and peripherals            Automobile                                        Servers and Networking
Telecommunications                     Remote broadcast                            Data storage
IP codecs                                      NATA                                                Communication systems

 

 

ITEQ Laminate/ Prepreg : IT-180ATC / IT-180ABS

IPC-4101C Spec / 99 / 101 / 126

Property Thickness<0.50 mm Thickness≧0.50 mm Units Test Method
[0.0197 in] [0.0197 in]
Typical Value Spec Typical Value Spec Metric IPC-TM-650
(English) (or as noted)
Peel Strength, minimum         N/mm 2.4.8
A. Low profile copper foil and very low profile copper foil - all copper weights > 17mm [0.669 mil]         (lb/inch) 2.4.8.2
B. Standard profile copper foil 0.88 (5.0) 0.70 (4.00) 0.88 (5.0) 0.70 (4.00)   2.4.8.3
1. After Thermal Stress            
2. At 125°C [257 F]            
3. After Process Solutions 1.23 (7.0) 0.80 (4.57) 1.40 (8.0) 1.05 (6.00)    
  1.05 (6.0) 0.70 (4.00) 1.23 (7.0) 0.70 (4.00)    
  1.05 (6.0) 0.55 (3.14) 1.23 (7.0) 0.80 (4.57)    
Volume Resistivity, minimum         MW-cm 2.5.17.1
A. C-96/35/90 3.0x1010 106 -- --
B. After moisture resistance -- -- 3.0x1010 104
C. At elevated temperature E-24/125 5.0x1010 103 1.0x1010 103
Surface Resistivity, minimum         MW 2.5.17.1
A. C-96/35/90 3.0x1010 104 -- --
B. After moisture resistance -- -- 3.0x1010 104
C. At elevated temperature E-24/125 4.0x1010 103 4.0x1010 103
Moisture Absorption, maximum -- -- 0.12 0.8 % 2.6.2.1
Dielectric Breakdown, minimum -- -- 60 40 kV 2.5.6
Permittivity (Dk, 50% resin content)   5.4   5.4 --  
(Laminate & Laminated Prepreg)      
A. 1MHz 4.4 4.4 2.5.5.9
B. 1GHz 4.4 4.4  
C. 2GHz 4.2 4.3 2.5.5.13
D. 5GHz 4.1 4.1  
E. 10GHz 4 4.1  
Loss Tangent (Df, 50% resin content)   0.035   0.035 --  
(Laminate & Laminated Prepreg)      
A. 1MHz 0.015 0.014 2.5.5.9
B. 1GHz 0.015 0.015  
C. 2GHz 0.015 0.015 2.5.5.13
D. 5GHz 0.016 0.016  
E. 10GHz 0.017 0.016  
Flexural Strength, minimum         N/mm2 2.4.4
A. Length direction -- -- 500-530 415 (lb/in2)
  -- -- (72,500-76,850) -60,190  
B. Cross direction -- -- 410-440 345  
  -- -- (59,450-63,800) -50,140  
Arc Resistance, minimum 125 60 125 60 s 2.5.1
Thermal Stress 10 s at 288°C [550.4F],minimum         Rating 2.4.13.1
A. Unetched Pass Pass Visual Pass Pass Visual
B. Etched Pass Pass Visual Pass Pass Visual
Electric Strength, minimum 45 30 -- -- kV/mm 2.5.6.2
(Laminate & Laminated Prepreg)
Flammability, V-0 V-0 V-0 V-0 Rating UL94
(Laminate & Laminated Prepreg)
Glass Transition Temperature(DSC) 175 170 minimum 175 170 minimum ˚C 2.4.25
Decomposition Temperature -- -- 345 340 minimum ˚C 2.4.24.6
(5% wt loss)
X/Y Axis CTE (40℃ to 125℃) -- -- 10--13 -- PPM/˚C 2.4.24
Z-Axis CTE           2.4.24
A. Alpha 1 -- -- 45 60 maximum PPM/˚C
B. Alpha 2 -- -- 210 300 maximum PPM/˚C
C. 50 to 260 Degrees C -- -- 2.7 3.0 maximum %
Thermal Resistance           2.4.24.1
A. T260 -- -- >60 30 minimum Minutes
B. T288 -- -- >30 15 minimum Minutes
CAF Resistance -- -- Pass AABUS Pass/Fail 2.6.25

PCB Fabrication FAQ

Q1 How do you pack the PCBs?

A PCBs are packed with Polyethylene air cushion film(vacuum plastic bags) per 20-25 pieces. Pearl cotton (Polyethylene foamed sheet) are put inside carton box. The hardness of carton box is KK grade(the highest hardness). Maximum gross weight for one carton is less than 12 kgs.

High Tg PCB

(14)
Good Quality High Tg FR-4 PCB Built On 26 Layer With Blind via Suppliers

High Tg FR-4 PCB Built On 26 Layer With Blind via

General Profile Today the workhorse of the PCB fabrication industry is epoxy glass FR-4 grade, a material based on an epoxy resin system.It begins to soften at a temperature of 130C (glass transition ... Read More
2018-06-26 10:48:49
Good Quality High Tg FR-4 PCB Built On 18 Layer With Peelable Solder masks Suppliers

High Tg FR-4 PCB Built On 18 Layer With Peelable Solder masks

General Profile Today the workhorse of the PCB fabrication industry is epoxy glass FR-4 grade, a material based on an epoxy resin system.It begins to soften at a temperature of 130C (glass transition ... Read More
2018-06-26 10:10:45
Good Quality High Tg FR-4 PCB Built On 10 Layer With Selective Hard Gold on pads Suppliers

High Tg FR-4 PCB Built On 10 Layer With Selective Hard Gold on pads

General Profile Today the workhorse of the PCB fabrication industry is epoxy glass FR-4 grade, a material based on an epoxy resin system.It begins to soften at a temperature of 130C (glass transition ... Read More
2018-06-25 14:35:48
Good Quality High Tg FR-4 PCB Built On 4 Layer With Bare Board Testing and HASL lead free Suppliers

High Tg FR-4 PCB Built On 4 Layer With Bare Board Testing and HASL lead free

General Profile Today the workhorse of the PCB fabrication industry is epoxy glass FR-4 grade, a material based on an epoxy resin system.It begins to soften at a temperature of 130C (glass transition ... Read More
2018-06-25 14:33:38
Good Quality Gold Finger PCB	Built On 10 Layer With High Voltage Test and green soldermask Suppliers

Gold Finger PCB Built On 10 Layer With High Voltage Test and green soldermask

General Profile The gold finger (connecting finger) is a connecting part between the memory bank and the memory slot,All signals are transmitted through the gold fingers. The gold finger is made up of a number ... Read More
2018-06-25 11:34:03
Good Quality Gold Finger PCB	Built On 8 Layer With Flying Probe Net List Test Suppliers

Gold Finger PCB Built On 8 Layer With Flying Probe Net List Test

General Profile The gold finger (connecting finger) is a connecting part between the memory bank and the memory slot,All signals are transmitted through the gold fingers. The gold finger is made up of a number ... Read More
2018-06-25 11:07:14
Good Quality Gold Finger PCB	Built On 6 Layer With Differential Impedance / Single End Impedance Suppliers

Gold Finger PCB Built On 6 Layer With Differential Impedance / Single End Impedance

General Profile The gold finger (connecting finger) is a connecting part between the memory bank and the memory slot,All signals are transmitted through the gold fingers. The gold finger is made up of a number ... Read More
2018-06-25 10:58:10
Good Quality Gold Finger PCB	Built On 4 Layer With Automatic Optical Inspection (AOI) Suppliers

Gold Finger PCB Built On 4 Layer With Automatic Optical Inspection (AOI)

General Profile The gold finger (connecting finger) is a connecting part between the memory bank and the memory slot,All signals are transmitted through the gold fingers. The gold finger is made up of a number ... Read More
2018-06-25 10:44:19
Good Quality Immersion Gold PCB On 4 layer FR-4 Tg170 With Matt Blue Solder Mask Suppliers

Immersion Gold PCB On 4 layer FR-4 Tg170 With Matt Blue Solder Mask

Product profile 1.1 General description This is a type of 4 layer PCB built on FR-4 Tg170 substrate for the application of Industrial Communications. It's 1.6 mm thick with white silkscreen on matt blue solder ... Read More
2018-06-16 10:57:57
Good Quality Immersion Gold PCB on 4 Layer FR-4 Tg135 Big panel and green soldermask Suppliers

Immersion Gold PCB on 4 Layer FR-4 Tg135 Big panel and green soldermask

Product profile 1.1 General description This is a type of 4 layer printed circuit board built on FR-4 Tg150 substrate for the application of Embedded Processor. It's 1.6 mm thick with white silkscreen on green ... Read More
2018-06-16 10:44:37
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