BICHENG ENTERPRISE LIMITED

Specialized in heavy copper PCBs for 15 years

High Frequency PCB | Metal Core PCB | Flexible PCB

90%  export | UL, ISO 9001, ISO14001 and TS 16949 certified

 

Home
About Us
PCB Services
Equipment
PCB Capabilities
Quality Assurance
Contact Us
Request A Quote
Home Samples

BGA Circuit Board

Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Seba T.

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me:

—— Daniel F

I'm Online Chat Now

BGA Circuit Board

  • High Precision BGA Circuit Board suppliers
  • High Precision BGA Circuit Board suppliers
  • High Precision BGA Circuit Board suppliers
  • High Precision BGA Circuit Board suppliers
  • High Precision BGA Circuit Board suppliers

General Profile

BGA is ball grid array packaging technology, high density surface assembly packaging technology. At the bottom of the package, the pins are spherical and arranged into a lattice-like pattern, hence name BGA. It's a type of surface-mount packaging used for integrated circuits(IC). They can be found in many interconnection pins devices such as microprocessors, communication equipment and control industrial machinery etc.

 

Advantages

1) High density saves the soldering space. It greatly avoid the danger of accidentally bridging adjacent pins with solder grew.

2) Due to the increase in the number of pins, the function is also increased.

3) Easy to let tin on pads when solder melts on PCB due to its self-centering. So it performs high reliability and good electrical performance.

4) The heat conduction is much better than the packages with legs between the PCBs. It allows heat generated by the IC inside the package to flow more easily to the PCB, preventing the chip from overheating.

 

Characters

PCB with BGA usually has many micro vias, customers generally design via under BGA with finish diameter ranging 8 to 12mil. Vias are need to be plugged, no solder mask onto BGA pads and no drill on BGA pads.

 

PCB Capabilities 2018

Parameter Value
 Layer Counts  1-32
 Substrate Material FR-4(including High Tg 170, High CTI>600V); Aluminum based; RO4350B, RO4003C; Polyimide, 94HB and FR-1 (upon request)
 Maximum Size  Flying test: 900*600mm, Fixture test 460*380mm, No test 1100*600mm
 Board Outline Tolerance  ±0.0059" (0.15mm)
 PCB Thickness 0.0157" - 0.3937" (0.40mm--10.00mm)
Thickness Tolerance(T≥0.8mm)  ±8%
Thickness Tolerance(t<0.8mm)  ±10%
 Insulation Layer Thickness 0.00295" - 0.1969" (0.075mm--5.00mm)
 Minimum Track 0.003" (0.075mm)
 Minimum Space  0.003" (0.075mm)
 Outer Copper Thickness  35µm--420µm (1oz-12oz)
 Inner Copper Thickness  17µm--420µm (0.5oz - 12oz)
 Drill Hole(Mechanical) 0.0059" - 0.25" (0.15mm--6.35mm)
 Finished Hole(Mechanical) 0.0039"-0.248" (0.10mm--6.30mm)
DiameterTolerance(Mechanical) 0.00295" (0.075mm)
 Registration (Mechanical) 0.00197" (0.05mm)
 Aspect Ratio  12:1
 Solder Mask Type  LPI
 Min Soldermask Bridge 0.00315" (0.08mm)
 Min Soldermask Clearance 0.00197" (0.05mm)
 Plug via Diameter 0.0098" - 0.0236" (0.25mm--0.60mm)
Impedance Control Tolerance  ±10%
 Surface Finish HASL,HASL LF,ENIG,Imm Tin,Imm Ag, OSP, Gold Finger

 

BGA Circuit Board

(4)
Good Quality BGA PCB Circuit Board Built On 10 Layer With UL Certified Suppliers

BGA PCB Circuit Board Built On 10 Layer With UL Certified

Introduction BGA is ball grid array packaging technology, high density surface assembly packaging technology. At the bottom of the package, the pins are spherical and arranged into a lattice-like pattern, hence ... Read More
2018-07-09 09:53:59
Good Quality BGA PCB Circuit Board Built On 8 Layer With High Tg170 FR-4 Suppliers

BGA PCB Circuit Board Built On 8 Layer With High Tg170 FR-4

Introduction BGA is ball grid array packaging technology, high density surface assembly packaging technology. At the bottom of the package, the pins are spherical and arranged into a lattice-like pattern, hence ... Read More
2018-07-09 09:49:21
Good Quality BGA PCB Circuit Board Built On 6 Layer	With Impedance Controlled Suppliers

BGA PCB Circuit Board Built On 6 Layer With Impedance Controlled

Introduction BGA is ball grid array packaging technology, high density surface assembly packaging technology. At the bottom of the package, the pins are spherical and arranged into a lattice-like pattern, hence ... Read More
2018-07-09 09:44:27
Good Quality BGA PCB Circuit Board Built On 4 Layer With Immersion Gold Suppliers

BGA PCB Circuit Board Built On 4 Layer With Immersion Gold

Introduction BGA is ball grid array packaging technology, high density surface assembly packaging technology. At the bottom of the package, the pins are spherical and arranged into a lattice-like pattern, hence ... Read More
2018-07-09 09:40:01
Page 1 of 1