BICHENG ENTERPRISE LIMITED

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Flexible Printed Circuit Board FPC Built on Polyimide Film with Double Layer Structure

Customer Reviews
Kevin, Received and tested the boards - thanks very much. These are perfect, exactly what we needed. rgds Rich

—— Rich Rickett

Ruth, I got the PCB today, and they are just perfect. Please stay a little patience, my next order is coming soon. Kind regards from Hamburg Olaf

—— Olaf Kühnhold

Hi Natalie. It was perfect, I attach some pictures for your reference. And I send you next 2 projects to budget. Thanks a lot again

—— Seba T.

Kevin, Thanks, they were perfectly made, and work well. As promised, here are the links for my latest project, using the PCBs you manufactured for me:

—— Daniel F

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Flexible PCB

  • High Precision Flexible PCB suppliers
  • High Precision Flexible PCB suppliers
  • High Precision Flexible PCB suppliers
  • High Precision Flexible PCB suppliers
  • High Precision Flexible PCB suppliers

General Profile

A breakdown of a flexible circuit shows that it consists of 3 basic elements: copper foil, dielectric material and adhesive. Most of the manufacturing proceses, i.e. imaging transfer, plating and etching , are quite similar to those used when producing plated-through boards. However, there're differences due to the thin and floppy material used in flexible circuits.

 

Purpose of Flexible Circuits

1) To provide interconnections between printed circuit boards and other components.

2) To serve as three-dimensional substrates for the mounting of SMT components, e.g., in

photographic and video cameras.

3) To establish interconnections capable of withstanding dynamic flexing.

4) To form part of rigid-flex circuit boards.

 

Advantages

1) Flexibility

2) Volume decreases

3) Weight reduces

4) Consistency of SMD mounting

5) Reliability increases

6) Controllability of electrical design of parameters

7) Tin soldered overall on the FPC end

8) Material optional (PI, PET)

9) Low cost

10) Continuity of processing

 

Applications

Thin-film switch, capacitive touch screen / panel, keypad FPC, laser head FPC,

General purpose LED soft light strip, mobile phone built-in antenna FPC Touch screen,

Telephone receiver / earphone FPC, contact belt of inkjet printer, Toy lamp strip,

LCD module, instrument panel, flexible flat cable, display backlight etc.

 

Flex PCB Capability

No. Specifications Capabilities
1 Board Type Single layer, Doulbe layer, Multilayer, Rigid-Flex
2 Base Material PI, PET
3 Copper Weight 0.5oz, 1oz, 2oz
4 LED Maximum Size 250 x 5000mm
5 General Maximum Size 250 x 2000mm
6 Board Thickness 0.03mm-3.0mm
7 Thickness Tolerance ±0.03mm
8 Mininum Drill Hole 0.05mm
9 Maximum Drill Hole 6.5mm
10 Tolerance of Drill Hole ±0.025mm
11 Thickness of Hole Wall ≧ 8 um
12 Minimum Track/Gap of Single Layer Board 0.025/0.03mm
13 Minimum Track/Gap of Double Layer and Multilayer Board 0.03/0.040mm
14 Etching Tolerance ±0.02mm
15 Minimum Width of Silk Legend ≧ 0.125mm
16 Minimum Heigh of Silk Legend ≧0.75mm
17 Distance from Legend to Pad ≧0.15mm
18 Distance from Opening Solder Mask of Drill Coverlay to Track ≧0.03mm
19 Distance from Opening Solder Mask of Punching Coverlay to Track ≧0.03mm
20 Thickness of Immersion Nickel 100-300u"
21 Thickness of Immersion Gold 1-3u"
22 Thicnkess of Immersion Tin 150-400u"
23 Minimum Electrical Testing Pad 0.2mm
24 Minimum Tolerance of Outline(Normal Steel Mould Punch) ±0.1mm
25 Minimum Tolerance of Outline (Precision Steel Mould Punch) ±0.05mm
26 Mininum Radius of Bevel Angle (Outline) 0.2mm
27 Stiffner Material PI, FR-4, 3M Adhesive, PET, Steel Sheet
28 RoHs Yes
29 Solder Mask Colour Yellow, White, Black, Green

Flexible PCB Sample Introduction

Flexible Printed Circuit Board FPC Built on Polyimide Film with Double Layer Structure

China Flexible Printed Circuit Board FPC Built on Polyimide Film with Double Layer Structure Supplier
Flexible Printed Circuit Board FPC Built on Polyimide Film with Double Layer Structure Supplier Flexible Printed Circuit Board FPC Built on Polyimide Film with Double Layer Structure Supplier Flexible Printed Circuit Board FPC Built on Polyimide Film with Double Layer Structure Supplier Flexible Printed Circuit Board FPC Built on Polyimide Film with Double Layer Structure Supplier Flexible Printed Circuit Board FPC Built on Polyimide Film with Double Layer Structure Supplier Flexible Printed Circuit Board FPC Built on Polyimide Film with Double Layer Structure Supplier

Large Image :  Flexible Printed Circuit Board FPC Built on Polyimide Film with Double Layer Structure

Product Details:

Place of Origin: China
Brand Name: Bicheng Enterprise
Certification: UL
Model Number: BIC-284-V2.84

Payment & Shipping Terms:

Minimum Order Quantity: 1
Price: USD 2.99-9.99 PER PIECE
Packaging Details: Vacuum
Delivery Time: 10 working days
Payment Terms: T/T, Western Union
Supply Ability: 45000 pieces per month
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Detailed Product Description
Number Of Layers: 2 Board Material: Polyimide 25µm
Surface Cu Thickness: 1.0 Board Thickness: 0.20 Mm +/-10%
Surface Finish: Immersion Gold Solder Mask Color:: 25 µm
Colour Of Component Legend: White Test: 100% Electrical Test Prior Shipment

Components of a flexible circuit
A flexible circuit consists of copper foil, dielectric substrate+ coverlay and adhesive.
Copper foil is available in two different types of copper: ED Copper and RA copper.
 
ED copper is an electro-deposited (ED) copper foil produced in the same way as the copper foil used for rigid printed circuit boards. This also means that the copper is “treated”, i.e., it has a slightly rough surface on one side, which ensures a better adhesion when the copper foil is bonded to the base material.
RA copper is a rolled and annealed copper foil produced from electrolytically deposited cathode copper, which is melted and cast into ingots. The ingots are first hot-rolled to a certain size and milled on all surfaces. The copper is then cold-rolled and annealed, until the desired thickness is obtained.
Copper foil is available in thickness of 12, 18, 35 and 70 μm.
 
The most common available for dielectric substrate and coverlay is polyimide films. This material can also be used as coverlay. Polyimide is best suited for flexible circuits because of its characteristics as stated below:
? High temperature resistance allows soldering operations without damaging the flexible circuits
? Very good electrical properties
? Good chemical resistance
Polyimide is available in thicknesses of 12.5, 20, 25 and 50 μm.
 
Base laminates for rigid printed circuit boards are copper foils laminated together with the base materials, the adhesive coming from the prepreg material during lamination. Contrary to this is the flexible circuit where the lamination of the copper foil to the film material is achieved by means of an adhesive system. It is necessary to distinguish between two main systems of adhesive, namely thermoplastic and thermoset adhesives. The choice is dictated partly by the processing, and partly by the application of the finished flexible circuit.
 
 
 
FPC Case: Flexible Printed Circuit Board FPC Built on Polyimide Film with Double Layer Structure
(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)
 
 
General description
This is a type of flexible printed circuit for the application of keypad. It’s a 2 layer FPC at 0.2mm thick. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. Polyimide stiffener is applied on the inserting part.
 
Parameter and data sheet
Size of Flexible PCB 120.18 X 30.28mm
Number of Layers 2
Board Type Flexible PCB
Board Thickness 0.20mm
Board Material Polyimide 25µm
Board Material Supplier ITEQ
Tg Value of Board Material 60℃
 
PTH Cu thickness ≥20 µm
Inner Iayer Cu thicknes N/A
Surface Cu thickness 35 µm
   
Coverlay Colour Yellow
Number of Coverlay 2
Thickness of Coverlay 25 µm
Stiffener Material Polyimide
Stiffener Thickness 0.2mm
   
Type of Silkscreen Ink IJR-4000 MW300
Supplier of Silkscreen TAIYO
Color of Silkscreen White
Number of Silkscreen 1
 
Peeling test of Coverlay No peelable
Legend Adhesion 3M 90℃ No peeling after Min. 3 times test
 
Surface Finish Immersion Gold
Thickness of Nickle/Gold Au: 0.03µm(Min.); Ni 2-4µm
RoHS Required Yes
Famability 94-V0
 
Thermal Shock Test Pass, -25℃±125℃, 1000 cycles.
Thermal Stress Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.
Function 100% Pass electrical test
Workmanship Compliance with IPC-A-600H & IPC-6013C Class 2
 
 
 
Features and benefits
Excellent flexibility
Reducing the volume
Weight reduction
Consistency of assembly
Increased reliability
Controllability of electrical parameter design
The end can be whole soldered
Material optionality
Low cost
Continuity of processing
Offer small quantity, prototypes and production.
DDU Door to door shipment with competitive shipping cost.
 
 
 
Application
Capacitive touch screen / panel, industrial control interphone, Consumer electrostatic Bracelet soft board
 
 
Quality Policy
Bicheng has developed series of management procedures and approaches to assure that PCBs are in compliance with the customers' requirements, inclusive of selection of the vendors, work in progress (WIP) inspection, outgoing delivery inspection and customer service etc.
 
Evaluation and Audit of Suppliers
Suppliers have to be evaluated by Bicheng. In addition, Bicheng will appraise and rank suppliers every year to guarantee the materials supplied are meeting Bicheng’s requirements. Furthermore, Bicheng continuously develop suppliers and supervise them to improve their quality and environment management basing on the systems of ISO9001 & ISO14001.
 
Contract Evaluation
Bicheng shall review and verify customer's requirements to make sure that we have the capability to satisfy customers' requirements including specifications, delivery and other demands prior to accepting an order.
 
Making, audit and control of manufacturing data.
When customers' design data and specifications are provided to our market department, Bicheng has to verify all the requirements. Then, convert the design data into manufacturing data by CAM. Finally, a manufacturing instruction (MI) is generated according to the real manufacturing process and technologies for manufacturing department as the basis for actual fabrication. MI must be reviewed by independent engineers and QA engineers before issue.
 
Incoming Material Quality Control
All materials have to be inspected before warehousing. We established a series of strict inspection procedure and instruction to control the incoming materials. Furthermore, various precise inspecting instruments and apparatus guarantee the capability to judge the material good or not. We issue material with first in first out principle, and give out “alarm” for the material that will reach the shelf life to ensure the materials are used up before expiry.
 
Control of Production Process
Right manufacturing instruction (MI), comprehensive equipment management and maintenance and process control, strict WIP inspection and monitoring as well as working instruction, all those make the whole fabrication process totally controlled.
 
Final Control and Inspection
All PCBs have to be gone through the open and short test as well as visual inspection after passed the specified physical tests. We own various advanced test equipment including customized, probe flying test machines to guarantee that each PCB is 100% tested.
 
Product Delivery Audit
We set up a dedicated FQA department to inspect the PCB products according to the customer's specifications and requirements by sampling. Qualified PCBs are going to be packed.
 
FQA also has to carry out a 100% audit of the warehouse packing and shipping products, including product number, customer number, product quantity, shipping address and so on prior to shipment.
 
Customer Service
We sets up a professional customer service team to proactively communicate with customers and timely deal with the customers' feedbacks. We highly focus on customers' needs and to understand customers’ demands, timely to adjust the policy of customer service and PCB product requirements.
 
 
 
 
Flexible Printed Circuit Board FPC Built on Polyimide Film with Double Layer Structure
 
Flexible Printed Circuit Board FPC Built on Polyimide Film with Double Layer Structure
 

Contact Details
BICHENG ENTERPRISE LIMITED

Contact Person: Ms. Bonnie Shi

Tel: 86-755-27374946

Fax: 86-755-27374947

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