RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203
TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350
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| Place of Origin: | China |
| Brand Name: | Bicheng Enterprise |
| Certification: | UL |
| Model Number: | BIC-500-V0.13 |
| Minimum Order Quantity: | 1 |
|---|---|
| Price: | USD 2.99-8.99 PER PIECE |
| Packaging Details: | Vacuum |
| Delivery Time: | 10 working days |
| Payment Terms: | T/T, Western Union |
| Supply Ability: | 45000 pieces per month |
| Number Of Layers: | 4 | Glass Epoxy:: | TU-872 SKL Sp |
|---|---|---|---|
| Final Foil: | 1.5 Oz | Final Height Of PCB:: | 1.6 Mm ±10% |
| Surface Finish: | Electroless Nickel Over Immersion Gold (ENIG)( 1 µ" Over 100 µ" Nickel) | Solder Mask Color:: | Blue |
| Colour Of Component Legend: | White | Test: | 100% Electrical Test Prior Shipment |
Low Dk/Df and High Thermal Reliability Printed Circuit Board (PCB) on Core: TU-872 SLK Sp; Prepreg: TU-87P SLK Sp
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
TU-872 SLK Sp is based on a high performance modified epoxy FR-4 resin. This material is reinforced with novel woven glass and designed with extra low dielectric constant and low dissipation factor for high speed low loss and high frequency circuit board application. TU-872 SLK Sp material is suitable for environmental protection lead free process and also compatible with FR-4 processes. TU-872 SLK Sp laminates also exhibit excellent CTE, superior chemical resistance, moisture resistance, thermal stability, CAF resistance and toughness enhanced by an allyl network forming compound.
Key Features
1. Excellent electrical properties
2. Dielectric constant less than 3.5
3. Dissipation factor less than 0.010
4. Excellent, stable and flat Dk/Df performance
5. Compatible with most FR-4 processes
6. Lead free process compatible
7. Improved z-axis thermal expansion
8. Anti-CAF capability
9. Superior dimensional stability, thickness uniformity and flatness
10. Excellent through-hole and soldering reliability
Our PCB Capabilities (TU-872 SLK Sp)
| PCB Material: | High performance modified epoxy FR-4 resin |
| Designation: | TU-872 SLK Sp |
| Dielectric constant: | < 3.5 |
| Layer count: | Double Layer, Multilayer, Hybrid PCB |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm), 3oz (105µm), 4oz (140µm), 5oz (175µm) |
| PCB thickness: | 10mil (0.254mm), 15mil (0.381mm), 20mil (0.508mm), 25mil(0.635mm), 30mil (0.762mm), 60mil(1.524mm) |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Matt Black, Blue, Matt Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, OSP, Immersion tin, Immersion Silver etc.. |
| Technology: | HDI, Via in pad, Impedance Control, Blind via/Buried via, Edge Plating, BGA, Countsunk Holes etc. |
Main Applications
1. Radio Frequency
2. Backpanel, High performance computing
3. Line cards, Storage
4. Servers, Telecom, Base station
5. Office Routers
Typical Properties (TU-872 SLK Sp)
| Typical Values | Conditioning | IPC-4101 /126 | |
| Thermal | |||
| Tg (DMA) | 220°C | ||
| Tg (DSC) | 200°C | > 170°C | |
| Tg (TMA) | 190°C | E-2/105 | |
| Td (TGA) | 340°C | > 340°C | |
| CTE x-axis | 12~15 ppm/°C | N/A | |
| CTE y-axis | 12~15 ppm/°C | E-2/105 | N/A |
| CTE z-axis | 2.30% | < 3.0% | |
| Thermal Stress,Solder Float, 288°C | > 60 sec | A | > 10 sec |
| T260 | 60 min | > 30 min | |
| T288 | 20 min | E-2/105 | > 15 min |
| T300 | 5 min | > 2 min | |
| Flammability | 94V-0 | E-24/125 | 94V-0 |
| DK & DF | |||
| Permittivity (RC 50%) @10GHz | 3.5 | ||
| Loss Tangent (RC 50%) @10GHz | 0.008 | ||
| Electrical | |||
| Permittivity (RC50%) | |||
| 1GHz (SPC method/4291B) | 3.6/3.4 | < 5.2 | |
| 5GHz (SPC method) | 3.5 | E-2/105 | - |
| 10GHz (SPC method) | 3.5 | - | |
| Loss Tangent (RC50%) | |||
| 1GHz (SPC method/4291B) | 0.006/0.004 | ||
| 5GHz (SPC method) | 0.007 | E-2/105 | < 0.035 |
| 10GHz (SPC method) | 0.008 | ||
| Volume Resistivity | > 1010 MΩ•cm | C-96/35/90 | > 106 MΩ•cm |
| Surface Resistivity | > 108 MΩ | C-96/35/90 | > 104 MΩ |
| Electric Strength | > 40 KV/mm | A | > 30 kV/mm |
| Dielectric Breakdown | > 50 kV | A | N/A |
| Mechanical | |||
| Young’s Modulus | |||
| Warp Direction | 26 GPa | A | N/A |
| Fill Direction | 24 GPa | ||
| Flexural Strength | |||
| Lengthwise | > 60,000 psi | A | > 60,000 psi |
| Crosswise | > 50,000 psi | A | > 50,000 psi |
| Peel Strength, 1.0 oz RTF Cu foil | 4~7 lb/in | A | > 4 lb/in |
| Water Absorption | 0.13% | E-1/105+D-24/23 | < 0.5 % |
Contact Person: Miss. Sally Mao
Tel: 86-755-27374847
Fax: 86-755-27374947
