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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

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Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module

Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module

  • Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
  • Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
  • Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
  • Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
  • Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
  • Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
Product Details:
Place of Origin: CHINA
Brand Name: Bicheng Enterprise Limited
Certification: UL
Model Number: BIC-0316-V3.16
Payment & Shipping Terms:
Minimum Order Quantity: 1 PIECE
Price: USD2 .99-9.99 per piece
Packaging Details: VACUUM
Delivery Time: 8-9 WORKING DAY
Payment Terms: T/T,Paypal
Supply Ability: 50000 PIECE PER MONTH
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Detailed Product Description
Board Material: Polyimide 12.5μm + 0.1mm Stiffener Of Stainless Steel And 0.1mm Polyimide Board Thickness: 0.2 Mm
Surface/Inner Layer Cu Thickness: 35 µm Surface Finish: Immersion Gold
Coverlay Colour: Yellow Color Of Silkscreen: White
Function: 100% Pass Electrical Test Number Of Layers: 2

Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module
(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)
 
General description
This is a type of 2 Layer flexible printed circuit (FPC) built on 1oz polyimide for the application of Temperature Module.
 
Basic specifications
Base material: Polyimide 12.5μm + 0.1mm stiffener of stainless steel and 0.1mm polyimide
Layer count: 2 layers
Type: Individual FPC
Format: 93.0mm x 33mm = 1 type = 1 piece
Surface finish: Immersion gold
Copper weight: Outer layer 35μm/ Inner layer 0 μm
Solder mask / Legend: yellow coverlay / White
Final PCB height: 0.2 mm (inclusive of stiffener)
Standard: IPC 6012 Class 2
Packing: 100 pieces are packed for shipment.
Lead time: 10 working days
Shelf life: 6 months
 
Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module 0
 
Features and benefits
Excellent flexibility;
Reducing the volume;
Weight reduction;
Good oxidation resistance and good heat dissipation;
RoHS materials;
Eligible products rate of first production: >95%
On-time service;
More than 18 years of PCB experience;
 
Applications
Laser head FPC, instrument panel, industrial control audio equipment, industrial control touch remote control soft board
 
Flexible Printed Circuit (FPC) Capability 2021

No.SpecificationsCapabilities
1Board TypeSingle layer, Doulbe layer, Multilayer, Rigid-Flex
2Base MaterialPI, PET
3Copper Weight0.5oz, 1oz, 2oz
4LED Maximum Size250 x 5000mm
5General Maximum Size250 x 2000mm
6Board Thickness0.03mm-3.0mm
7Thickness Tolerance±0.03mm
8Mininum Drill Hole0.05mm
9Maximum Drill Hole6.5mm
10Tolerance of Drill Hole±0.025mm
11Thickness of Hole Wall≧ 8 um
12Minimum Track/Gap of Single Layer Board0.025/0.03mm
13Minimum Track/Gap of Double Layer and Multilayer Board0.03/0.040mm
14Etching Tolerance±0.02mm
15Minimum Width of Silk Legend≧ 0.125mm
16Minimum Heigh of Silk Legend≧0.75mm
17Distance from Legend to Pad≧0.15mm
18Distance from Opening Solder Mask of Drill Coverlay to Track≧0.03mm
19Distance from Opening Solder Mask of Punching Coverlay to Track≧0.03mm
20Thickness of Immersion Nickel100-300u"
21Thickness of Immersion Gold1-3u"
22Thicnkess of Immersion Tin150-400u"
23Minimum Electrical Testing Pad0.2mm
24Minimum Tolerance of Outline(Normal Steel Mould Punch)±0.1mm
25Minimum Tolerance of Outline (Precision Steel Mould Punch)±0.05mm
26Mininum Radius of Bevel Angle (Outline)0.2mm
27Stiffner MaterialPI, FR-4, 3M Adhesive, PET, Steel Sheet
28RoHsYes
29Solder Mask ColourYellow, White, Black, Green

 
Brief Introduction of FPC
Flexible Printed Circuit Board (FPC) is referred to as "soft board". In the industry, FPC is a printed circuit board made of flexible insulating substrate (mainly polyimide or polyester film), which has many advantages that rigid printed circuit boards do not have. For example, it can be freely bent, wound, folded. The volume of electronic products can be greatly reduced by using FPC, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communication, laptop, computer peripherals, PDA, digital camera and other fields or products.
 
FPC also has the advantages of good heat dissipation, solderability, easy mounting and low cost.
 
Flexible printed circuit board has one layer, two layers and multilayer board. The base material is polyimide clad laminate. This kind of material has high heat resistance and good dimensional stability. It is the final product through pressing with the coating film which has both mechanical protection and good electrical insulation. The surface and inner conductors of double-sided and multi-layer printed circuit boards are metallized to realize the electrical connection of inner and outer layers.
 
The function of flexible circuit board can be divided into four kinds, namely, lead line, printed circuit, connector and multifunction integrated system, which cover computer, computer peripheral auxiliary system, consumer household electrical appliance and automobile, etc.

 
 
 
 
Flexible Printed Circuit (FPC) Built on 1oz Polyimide With Gold Plated for Temperature Module 1

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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