A breakdown of a flexible circuit shows that it consists of 3 basic elements: copper foil, dielectric material and adhesive. Most of the manufacturing proceses, i.e. imaging transfer, plating and etching , are quite similar to those used when producing plated-through boards. However, there're differences due to the thin and floppy material used in flexible circuits.
Purpose of Flexible Circuits
1) To provide interconnections between printed circuit boards and other components.
2) To serve as three-dimensional substrates for the mounting of SMT components, e.g., in
photographic and video cameras.
3) To establish interconnections capable of withstanding dynamic flexing.
4) To form part of rigid-flex circuit boards.
2) Volume decreases
3) Weight reduces
4) Consistency of SMD mounting
5) Reliability increases
6) Controllability of electrical design of parameters
7) Tin soldered overall on the FPC end
8) Material optional (PI, PET)
9) Low cost
10) Continuity of processing
Thin-film switch, capacitive touch screen / panel, keypad FPC, laser head FPC,
General purpose LED soft light strip, mobile phone built-in antenna FPC Touch screen,
Telephone receiver / earphone FPC, contact belt of inkjet printer, Toy lamp strip,
LCD module, instrument panel, flexible flat cable, display backlight etc.
Flex PCB Capability
|1||Board Type||Single layer, Doulbe layer, Multilayer, Rigid-Flex|
|2||Base Material||PI, PET|
|3||Copper Weight||0.5oz, 1oz, 2oz|
|4||LED Maximum Size||250 x 5000mm|
|5||General Maximum Size||250 x 2000mm|
|8||Mininum Drill Hole||0.05mm|
|9||Maximum Drill Hole||6.5mm|
|10||Tolerance of Drill Hole||±0.025mm|
|11||Thickness of Hole Wall||≧ 8 um|
|12||Minimum Track/Gap of Single Layer Board||0.025/0.03mm|
|13||Minimum Track/Gap of Double Layer and Multilayer Board||0.03/0.040mm|
|15||Minimum Width of Silk Legend||≧ 0.125mm|
|16||Minimum Heigh of Silk Legend||≧0.75mm|
|17||Distance from Legend to Pad||≧0.15mm|
|18||Distance from Opening Solder Mask of Drill Coverlay to Track||≧0.03mm|
|19||Distance from Opening Solder Mask of Punching Coverlay to Track||≧0.03mm|
|20||Thickness of Immersion Nickel||100-300u"|
|21||Thickness of Immersion Gold||1-3u"|
|22||Thicnkess of Immersion Tin||150-400u"|
|23||Minimum Electrical Testing Pad||0.2mm|
|24||Minimum Tolerance of Outline(Normal Steel Mould Punch)||±0.1mm|
|25||Minimum Tolerance of Outline (Precision Steel Mould Punch)||±0.05mm|
|26||Mininum Radius of Bevel Angle (Outline)||0.2mm|
|27||Stiffner Material||PI, FR-4, 3M Adhesive, PET, Steel Sheet|
|29||Solder Mask Colour||Yellow, White, Black, Green|
Payment & Shipping Terms:
|Board Material:||Polyimide 50µm||Board Thickness:||0.30 Mm|
|Surface/Inner Layer Cu Thickness:||70 µm||Surface Finish:||Immersion Gold|
|Coverlay Colour:||Yellow Top / White Bottom||Color Of Silkscreen:||Black|
|Function:||100% Pass Electrical Test||Number Of Layers:||2|
Dual Layer Flexible PCB Built On Polyimide with 2 oz Copper and Immersion Gold for Industrial Control
(Flexible printed circuits are custom-made products, the picture and parameters shown are just for reference)
This is a type of flexible printed circuit for the application of AC Power Source. It’s a 2 layer FPC at 0.3mm thick with 2 oz copper. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. FR-4 as stiffener is applied on the back side.
Parameter and data sheet
|Size of Flexible PCB||130.66 X 40.67mm|
|Number of Layers||2|
|Board Type||Flexible PCB|
|Board Material||Polyimide 50µm|
|Board Material Supplier||ITEQ|
|Tg Value of Board Material||60℃|
|PTH Cu thickness||≥20 µm|
|Inner Iayer Cu thicknes||N/A|
|Surface Cu thickness||70 µm|
|Number of Coverlay||2|
|Thickness of Coverlay||25 µm|
|Type of Silkscreen Ink||IJR-4000 MW300|
|Supplier of Silkscreen||TAIYO|
|Color of Silkscreen||White|
|Number of Silkscreen||1|
|Peeling test of Coverlay||No peelable|
|Legend Adhesion||3M 90℃ No peeling after Min. 3 times test|
|Surface Finish||Immersion Gold|
|Thickness of Nickle/Gold||Au: 0.03µm(Min.); Ni 2-4µm|
|Thermal Shock Test||Pass, -25℃±125℃, 1000 cycles.|
|Thermal Stress||Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering.|
|Function||100% Pass electrical test|
|Workmanship||Compliance with IPC-A-600H & IPC-6013C Class 2|
Features and benefits
Reducing the volume
Consistency of assembly
The end can be whole soldered
Continuity of processing
Quick Lead time: 3-5 days
General purpose LED soft light strip, mobile phone antenna flex board, industrial control, temperature controller soft board
Brief Introduction of FPC
Flexible Printed Circuit Board (FPC) is referred to as "soft board". In the industry, FPC is a printed circuit board made of flexible insulating substrate (mainly polyimide or polyester film), which has many advantages that rigid printed circuit boards do not have. For example, it can be freely bent, wound, folded. The volume of electronic products can be greatly reduced by using FPC, which is suitable for the development of electronic products in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communication, laptop, computer peripherals, PDA, digital camera and other fields or products.
FPC also has the advantages of good heat dissipation, solderability, easy mounting and low cost.
Flexible printed circuit board has one layer, two layers and multilayer board. The base material is polyimide clad laminate. This kind of material has high heat resistance and good dimensional stability. It is the final product through pressing with the coating film which has both mechanical protection and good electrical insulation. The surface and inner conductors of double-sided and multi-layer printed circuit boards are metallized to realize the electrical connection of inner and outer layers.
The function of flexible circuit board can be divided into four kinds, namely, lead line, printed circuit, connector and multifunction integrated system, which cover computer, computer peripheral auxiliary system, consumer household electrical appliance and automobile, etc.