RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203
TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350
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| Place of Origin: | China |
| Brand Name: | Bicheng Enterprise |
| Certification: | UL |
| Model Number: | BIC-0255-V2.55 |
| Minimum Order Quantity: | 1 |
|---|---|
| Price: | USD 2.99-5.99 PER PIECE |
| Packaging Details: | Vacuum |
| Delivery Time: | 5-6 working days |
| Payment Terms: | T/T, Western Union |
| Supply Ability: | 45000 pieces per month |
| Number Of Layers: | 1 | Glass Epoxy:: | Polyimide (PI) 25um |
|---|---|---|---|
| Final Foil: | 1 Oz | Final Height Of PCB:: | 0.1 Mm ±10% |
| Surface Finish: | Immersion Gold | Solder Mask Color:: | Yellow |
| Colour Of Component Legend: | White | Test: | 100% Electrical Test Prior Shipment |
Single Layer Flexible Printed Circuit Board Built on Polyimide with Stiffener and Gold Pads for Antennas
(FPC’s are custom-made products, the picture and parameters shown are just for reference)
General description
This is a type of flexible printed circuit for the application of antenna. It’s a single layer board at 0.15mm thick. The base laminate is from ITEQ, It’s fabricated per IPC 6012 Class 2 using supplied Gerber data. 3M tape is applied on the back side.
Parameter and data sheet
| Number of Layers | 1 |
| Board Type | Flexbile cirucit |
| Board Thickness | 0.1mm +/-10% |
| Board Material | Polyimide (PI) 25um |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60℃ |
| PTH Cu thickness | N/A |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35 um (1oz) |
| Coverlay Colour | Yellow |
| Number of Coverlay | 1 |
| Thickness of Coverlay | 25 um |
| Stiffener | 200 um |
| 3M Tape | Yes |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 2 |
| Mininum Trace (mil) | N/A |
| Minimum Gap(mil) | N/A |
| Surface Finish | Immersion Gold |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress | Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Features and benefits
Excellent flexibility
Reducing the volume
Weight reduction
Increased reliability
The end can be whole soldered
Material optionality
Low cost
Continuity of processing
Meeting your printed circuit board needs from PCB prototyping to mass volume production.
Applications
Capacitive touch screen / panel, Industrial control temperature controller soft board, consumer card reader soft board
Clarifications of FPC
According to the combination of base material and copper foil, flexible circuit board can be divided into two types: flexible board with adhesive and flexible board without adhesive. The price of non-adhesive flexible PCB is much higher than that of adhesive flexible PCB, but its flexibility, bonding force between copper foil and substrate and flatness of solder are also better than that of adhesive flexible PCB. So it is only used in the high demand situations, such as the: COF (CHIP ON FLEX, flexible board with bare chip, the high flatness of the pad) and so on. Because its price is high, most of the flexible PCBs used in the market are still adhesive flexible circuit board. Because the flexible circuit board is mainly used in the situation where bending is required, if the design or process is not reasonable, it is easy to produce micro-cracks, welding and other defects.
Economy of using FPC
If the circuit design is relatively simple, the total volume is small, and the space is suitable, the traditional internal connection is much cheaper. Flexible circuits are a good design option if the circuit is complex, processes many signals or has special electrical or mechanical requirements. When the size and performance of applications exceed the capacity of rigid circuits, flexible assembly is the most economical. A 12mil pad with a 5mil through hole and a flexible circuit with 3mil lines and spacing can be fabricated on a thin film. Therefore, it is more reliable to mount the chip directly on the film. There is no flame retardant that could be an ion source. These films may be protective and solidified at higher temperatures to obtain higher glass transition temperatures. Flexible materials are less costly than rigid materials because they are free of connectors.
Contact Person: Miss. Sally Mao
Tel: 86-755-27374847
Fax: 86-755-27374947
