RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203
TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350
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| Place of Origin: | China |
| Brand Name: | Bicheng Technologies Limited |
| Certification: | UL |
| Model Number: | BIC-0090-V2.5 |
| Minimum Order Quantity: | 1 |
|---|---|
| Price: | USD 2.88-6.99 per piece |
| Packaging Details: | Vacuum |
| Delivery Time: | 4-5 working days |
| Payment Terms: | T/T, Paypal |
| Supply Ability: | 45000 pieces per month |
| Number Of Layers: | 2 | Glass Epoxy: | RT/duroid 5870 |
|---|---|---|---|
| Final Height Of PCB: | 0.6mm ±0.1 | Final Foil External: | 1 Oz |
| Surface Finish: | Immersion Gold 0.025µm Over 3µm Nickel | Solder Mask Color: | Gloss Green |
| Colour Of Component Legend: | White | Test: | 100% Electrical Test Prior Shipment |
Rogers High Frequency PCB Made on RT/duroid 5870 with 10mil, 20mil, 31mil and 62mil Coating with Immersion Gold
(PCB's are custom-made products, the picture and parameters shown are just for reference)
Hello Everyone,
Today, we introduce high frequency PCB built on RT/duroid 5870 laminates.
RT/duroid 5870 is glass microfiber reinforced PTFE composite of Rogers Corporation, which is designed for exacting stripline and microstrip circuit applications.
Let's see the reasons for using RT/duroid 5870 material.
1) The randomly oriented microfibers result in exceptional dielectric constant uniformity.
2) The dielectric constant of RT/duroid 5870 laminates is uniform from panel to panel and is constant over a wide frequency range.
3) Its low dissipation factor extends the usefulness of RT/duroid 5870 laminates to Ku-band and above.
4) Designed for microstrip and stripline application
Our PCB Capability (RT/duroid 5870)
| PCB Material: | Glass microfiber reinforced PTFE composites |
| Designator: | RT/duroid 5870 |
| Dielectric constant: | 2.33 ±0.02 (process) |
| 2.33 (design) | |
| Layer count: | 1 Layer, 2 Layer, Multilayer, Hybrid type (Mixed) |
| Copper weight: | 0.5oz (17 µm), 1oz (35µm), 2oz (70µm) |
| PCB thickness: | 10mil (0.254mm), 20mil (0.508mm) |
| 31mil (0.787mm), 62mil (1.575mm) | |
| PCB size: | ≤400mm X 500mm |
| Solder mask: | Green, Black, Blue, Yellow, Red etc. |
| Surface finish: | Bare copper, HASL, ENIG, Immersion tin, OSP. |
RT/duroid 5870 is often used in double sided PCB, multilayer PCB and hybrid PCB.It's available in a variety of thicknesses for double sided PCB, such as 10mil, 20mil, 31mil and 62mil. Surface finishes are bare copper, HASL, ENIG, Immersion tine and OSP for option.
The typical applications are microstrip and stripline circuits, commercial airline broadband antenna,radar systems, millimeter wave applications, point to point digital radio antenna etc.
The basic colour of RT/duroid 5870 PCB is black.
We specialize in providing you with prototype, small batches and mass production service.
If you have any questions, please feel free to contact us.
Thank you for your reading.
| RT/duroid 5870 Typical Value | ||||||
| Property | RT/duroid 5870 | Direction | Units | Condition | Test Method | |
| Dielectric Constant,εProcess | 2.33 2.33±0.02 spec. |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
| Dielectric Constant,εDesign | 2.33 | Z | N/A | 8GHz to 40 GHz | Differential Phase Length Method | |
| Dissipation Factor,tanδ | 0.0005 0.0012 |
Z | N/A | C24/23/50 C24/23/50 |
1 MHz IPC-TM-650 2.5.5.3 10 GHz IPC-TM 2.5.5.5 |
|
| Thermal Coefficient of ε | -115 | Z | ppm/℃ | -50℃to 150℃ | IPC-TM-650 2.5.5.5 | |
| Volume Resistivity | 2 x 107 | Z | Mohm cm | C/96/35/90 | ASTM D 257 | |
| Surface Resistivity | 3 x 107 | Z | Mohm | C/96/35/90 | ASTM D 257 | |
| Specific Heat | 0.96(0.23) | N/A | j/g/k (cal/g/c) |
N/A | Calculated | |
| Tensile Modulus | Test at 23℃ | Test at 100℃ | N/A | MPa(kpsi) | A | ASTM D 638 |
| 1300(189) | 490(71) | X | ||||
| 1280(185) | 430(63) | Y | ||||
| Ultimate Stress | 50(7.3) | 34(4.8) | X | |||
| 42(6.1) | 34(4.8) | Y | ||||
| Ultimate Strain | 9.8 | 8.7 | X | % | ||
| 9.8 | 8.6 | Y | ||||
| Compressive Modulus | 1210(176) | 680(99) | X | MPa(kpsi) | A | ASTM D 695 |
| 1360(198) | 860(125) | Y | ||||
| 803(120) | 520(76) | Z | ||||
| Ultimate Stress | 30(4.4) | 23(3.4) | X | |||
| 37(5.3) | 25(3.7) | Y | ||||
| 54(7.8) | 37(5.3) | Z | ||||
| Ultimate Strain | 4 | 4.3 | X | % | ||
| 3.3 | 3.3 | Y | ||||
| 8.7 | 8.5 | Z | ||||
| Moisture Absorption | 0.02 | N/A | % | 0.62"(1.6mm) D48/50 | ASTM D 570 | |
| Thermal Conductivity | 0.22 | Z | W/m/k | 80℃ | ASTM C 518 | |
| Coefficient of Thermal Expansion | 22 28 173 |
X Y Z |
ppm/℃ | 0-100℃ | IPC-TM-650 2.4.41 | |
| Td | 500 | N/A | ℃ TGA | N/A | ASTM D 3850 | |
| Density | 2.2 | N/A | gm/cm3 | N/A | ASTM D 792 | |
| Copper Peel | 27.2(4.8) | N/A | Pli(N/mm) | 1oz(35mm)EDC foil after solder float |
IPC-TM-650 2.4.8 | |
| Flammability | V-0 | N/A | N/A | N/A | UL 94 | |
| Lead-free Process Compatible | Yes | N/A | N/A | N/A | N/A | |
Contact Person: Miss. Sally Mao
Tel: 86-755-27374847
Fax: 86-755-27374947
