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Shenzhen Bicheng Electronics Technology Co., Ltd
Shenzhen Bicheng Electronics Technology Co., Ltd

RO4350B, 4003C; Rogers 5880, 5870, 6002, 6010, 6006, 6035; RO3003, RO3035, RO3006, RO3010, RO3210,RO3203

TLX-8, TLX-6, TLX-9, TLX-0, TLX-7, TLY-3, TLY-5, RF-35TC, RF-60TC, RF-35A2, RF-60A, AD450, AD600, TMM4, TC350

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RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via

RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via

  • RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via
  • RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via
RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via
Product Details:
Place of Origin: China
Brand Name: Bicheng Technologies Limited
Certification: UL
Model Number: BIC-0081-V1.0
Payment & Shipping Terms:
Minimum Order Quantity: 1
Price: USD 30-40
Packaging Details: Vacuum
Delivery Time: 5-6 working days
Payment Terms: T/T, Paypal
Supply Ability: 45000 pieces per month
Contact Now
Detailed Product Description
Number Of Layers: 6 Glass Epoxy: FR-4, ITEQ IT-140 TG>135, RO4350B 10mil
Final Height Of PCB: 1.8mm ±0.16 Final Foil External: 1.0 Oz
Final Foil Internal: 1.0 Oz Surface Finish: Immersion Gold (12.7%) 2µ" Over 100µ" Nickel
Solder Mask Color: Green Colour Of Component Legend: White
Test: 100% Electrical Test Prior Shipment

RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via

(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

 

Hello everyone,

Warm greetings!

Today we’re talking about 6-layer hybrid PCB built on RO4350B and FR-4. Let’s see first one.

 

RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via 0

 

It’s for the application of radar antenna. Two cores of RO4350B on top side and bottom side, plated through holes connect each layer. Viewing from the stack-up, each dielectric material is more than 0.2mmm thick which result in whole PCB thickness to 1.9mm thick. Pads and holes are immersion gold plated. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.

 

RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via 1

 

Let’s see second one.

 

RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via 2

 

This type is more complex than the first one. The 10mil RO4350B core is the same. The main difference is that it contains 3 types blind via. The specifications are as follows:

 

Base material: RO4350B 10mil + FR4

Layer count: 6 layers

Type: Blind via L1-L2, L1-L3, L1-L4

Format: 82mm x 95mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 35 μm/ Inner layer 35 μm

Solder mask / Legend: No

Final PCB height: 1.4 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 20 working days

Shelf life: 6 months

 

There’s a very similar products whose inner-layers are using half ounce copper. Finished PCB thickness is 1.0mm. Following is the stack-up and microsecton.

 

RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via 3

 

RF Hybrid High Frequency 6-layer PCB Built On 10mil 0.254mm RO4350B and FR-4 with Blind Via 4

 

 

Therere many advantages of RO4350B hybrid PCBs.

1) Signal integrity performance improved over the stack-ups with all FR4 board;

2) Cost reduced over stack-ups with all low loss material;

3) Engineering design prevents problems from occurring in pre-production;

4) ISO9000, ISO14001, IATF16949, UL Certified factory

5) IPC Class 2 / IPC Class 3;

 

The applications are wide, listed below: Radar data acquisition converter, miscrostrip antenna, tower-mounted booster, modular oscilloscope, attenuator and 5G antenna etc.

 

Thank you for your reading. You’re welcome to contact us for your RF PCB enquiries.

 

Appendix: PCB Data Sheet

PCB SIZE 75 x 110mm=1PCS
BOARD TYPE Multilayer PCB
Number of Layers 6 Layers
Surface Mount Components YES
Through Hole Components No
LAYER STACKUP Copper ------- 35um(1 oz)+plate TOP layer
Dielectric RO4350B 0.254mm (10 mil)
Copper ------- 35um(1oz)
  PP+FR4+PP 0.695mm
  Copper ------ 35um (1oz)
  FR-4 0.25mm
  Copper ------ 35um (1oz)
  PP 0.21mm
  Copper ------35um (1oz)
  Dielectric RO4350B 0.254mm (10 mil)
  Copper ------- 35um(1 oz)+plate BOT layer
TECHNOLOGY  
Minimum Trace and Space: 4 mil / 5 mil
Minimum / Maximum Holes: 0.3 mm / 2.0 mm
Number of Different Holes: 12
Number of Drill Holes: 167
Number of Milled Slots: 0
Number of Internal Cutouts: 3
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL  
Glass Epoxy: RO4350B Tg280℃, er<3.48, Rogers Corp. FR-4 IT158
Final foil external: 1.5 oz
Final foil internal: 1 oz
Final height of PCB: 1.8 mm ±0.18mm
PLATING AND COATING  
Surface Finish Immersion gold
Solder Mask Apply To: TOP, 12micron Minimum
Solder Mask Color: Green, PRS-2000GT600D, Taiyo Supplied.
Solder Mask Type: LPSM
CONTOUR/CUTTING Routing
MARKING  
Side of Component Legend TOP
Colour of Component Legend White, IJR-4000 MW300, Taiyo brand
Manufacturer Name or Logo: Marked on the board in a conductor and leged FREE AREA
VIA Plated through hole(PTH), minimum size 0.3mm. Blind via L1-L2, L3-L6
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE  
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Contact Details
Shenzhen Bicheng Electronics Technology Co., Ltd

Contact Person: Miss. Sally Mao

Tel: 86-755-27374847

Fax: 86-755-27374947

Send your inquiry directly to us
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Shenzhen Bicheng Electronics Technology Co., Ltd
6-11C Shidai Jingyuan Fuyong Town, Baoan District, Shenzhen City, Guangdong Province, China
Tel:86-755-27374946
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