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General Profile
A breakdown of a flexible circuit shows that it consists of 3 basic elements: copper foil, dielectric material and adhesive. Most of the manufacturing proceses, i.e. imaging transfer, plating and etching , are quite similar to those used when producing plated-through boards. However, there're differences due to the thin and floppy material used in flexible circuits.
Purpose of Flexible Circuits
1) To provide interconnections between printed circuit boards and other components.
2) To serve as three-dimensional substrates for the mounting of SMT components, e.g., in
photographic and video cameras.
3) To establish interconnections capable of withstanding dynamic flexing.
4) To form part of rigid-flex circuit boards.
Advantages
1) Flexibility
2) Volume decreases
3) Weight reduces
4) Consistency of SMD mounting
5) Reliability increases
6) Controllability of electrical design of parameters
7) Tin soldered overall on the FPC end
8) Material optional (PI, PET)
9) Low cost
10) Continuity of processing
Applications
Thin-film switch, capacitive touch screen / panel, keypad FPC, laser head FPC,
General purpose LED soft light strip, mobile phone built-in antenna FPC Touch screen,
Telephone receiver / earphone FPC, contact belt of inkjet printer, Toy lamp strip,
LCD module, instrument panel, flexible flat cable, display backlight etc.
Flex PCB Capability
| No. | Specifications | Capabilities |
| 1 | Board Type | Single layer, Doulbe layer, Multilayer, Rigid-Flex |
| 2 | Base Material | PI, PET |
| 3 | Copper Weight | 0.5oz, 1oz, 2oz |
| 4 | LED Maximum Size | 250 x 5000mm |
| 5 | General Maximum Size | 250 x 2000mm |
| 6 | Board Thickness | 0.03mm-3.0mm |
| 7 | Thickness Tolerance | ±0.03mm |
| 8 | Mininum Drill Hole | 0.05mm |
| 9 | Maximum Drill Hole | 6.5mm |
| 10 | Tolerance of Drill Hole | ±0.025mm |
| 11 | Thickness of Hole Wall | ≧ 8 um |
| 12 | Minimum Track/Gap of Single Layer Board | 0.025/0.03mm |
| 13 | Minimum Track/Gap of Double Layer and Multilayer Board | 0.03/0.040mm |
| 14 | Etching Tolerance | ±0.02mm |
| 15 | Minimum Width of Silk Legend | ≧ 0.125mm |
| 16 | Minimum Heigh of Silk Legend | ≧0.75mm |
| 17 | Distance from Legend to Pad | ≧0.15mm |
| 18 | Distance from Opening Solder Mask of Drill Coverlay to Track | ≧0.03mm |
| 19 | Distance from Opening Solder Mask of Punching Coverlay to Track | ≧0.03mm |
| 20 | Thickness of Immersion Nickel | 100-300u" |
| 21 | Thickness of Immersion Gold | 1-3u" |
| 22 | Thicnkess of Immersion Tin | 150-400u" |
| 23 | Minimum Electrical Testing Pad | 0.2mm |
| 24 | Minimum Tolerance of Outline(Normal Steel Mould Punch) | ±0.1mm |
| 25 | Minimum Tolerance of Outline (Precision Steel Mould Punch) | ±0.05mm |
| 26 | Mininum Radius of Bevel Angle (Outline) | 0.2mm |
| 27 | Stiffner Material | PI, FR-4, 3M Adhesive, PET, Steel Sheet |
| 28 | RoHs | Yes |
| 29 | Solder Mask Colour | Yellow, White, Black, Green |
Product Details:
Payment & Shipping Terms:
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| Board Material: | Polyimide 25µm ITEQ 60℃ | Board Thickness: | 0.25mm |
|---|---|---|---|
| Surface Cu Thickness: | 35um | Surface Finish: | Immersion Gold |
| Coverlay Colour: | Yellow | Color Of Silkscreen: | White |
| Function: | 100% Pass Electrical Test |
Product profile
1.1 General description
This is a type of flexible printed circuit for the application of Access Systems. It's
a 2 layer FPC at 0.25mm thick. The base laminate is from ITEQ, It's fabricated
per IPC 6012 Class 2 using supplied Gerber data. Polyimide stiffner is applied
on the inserting part.
1.2 Features and benifits
A. Excellent flexibility
B. Reducing the volume
C. Weight reduction
D. Consistency of assembly
E. Increased reliability
F. Controllability of electrical parameter design
G. The end can be whole soldered
H. Material optionality
I. Low cost
J. Continuity of processing
K. Competitive price
L. Customer complaint rate: <1%
1.3 Application
Flexible flat cable,Flex keyboard for mobile phone keys,Tablet PC module soft board
1.4 Parameter and data sheet
| Size of Flexible PCB | 20.22 X 232.47mm |
| Number of Layers | 2 |
| Board Type | Flexible PCB |
| Board Thickness | 0.25mm |
| Board Material | Polyimide 25µm |
| Board Material Supplier | ITEQ |
| Tg Value of Board Material | 60℃ |
| PTH Cu thickness | ≥20 µm |
| Inner Iayer Cu thicknes | N/A |
| Surface Cu thickness | 35um |
| Coverlay Colour | Yellow |
| Number of Coverlay | 2 |
| Thickness of Coverlay | 25 µm |
| Stiffener Material | Polyimide |
| Stiffener Thickness | 0.2mm |
| Type of Silkscreen Ink | IJR-4000 MW300 |
| Supplier of Silkscreen | TAIYO |
| Color of Silkscreen | White |
| Number of Silkscreen | 2 |
| Peeling test of Coverlay | No peelable |
| Legend Adhesion | 3M 90℃ No peeling after Min. 3 times test |
| Surface Finish | Immersion Gold |
| Thickness of Nickle/Gold | Au: 0.03µm(Min.); Ni 2-4µm |
| RoHS Required | Yes |
| Famability | 94-V0 |
| Thermal Shock Test | Pass, -25℃±125℃, 1000 cycles. |
| Thermal Stress |
Pass, 300±5℃,10 seconds, 3 cycles. No delamination, no blistering. |
| Function | 100% Pass electrical test |
| Workmanship | Compliance with IPC-A-600H & IPC-6013C Class 2 |
Main flexible PCBs
PCB high speed multihead drilling machine
